app
AI Flow
Public Made by Adomby adom
Adom's AI Flow: a tool to help the AI follow all of the steps it takes to build a board.
main
(kicad_pcb
(version 20260206)
(generator "pcbnew")
(generator_version "10.0")
(general
(thickness 1.6166)
(legacy_teardrops no)
)
(paper "A4")
(title_block
(title "ESC: G431")
(date "2026-08-30")
(rev "2.0.1")
(company "ADOM INDUSTRIES INC.")
(comment 1 "DRAWN BY: CALEB TAYLOR")
)
(layers
(0 "F.Cu" signal)
(4 "In1.Cu" signal)
(6 "In2.Cu" signal)
(2 "B.Cu" signal)
(9 "F.Adhes" user "F.Adhesive")
(11 "B.Adhes" user "B.Adhesive")
(13 "F.Paste" user)
(15 "B.Paste" user)
(5 "F.SilkS" user "F.Silkscreen")
(7 "B.SilkS" user "B.Silkscreen")
(1 "F.Mask" user)
(3 "B.Mask" user)
(17 "Dwgs.User" user "User.Drawings")
(19 "Cmts.User" user "User.Comments")
(21 "Eco1.User" user "User.Eco1")
(23 "Eco2.User" user "User.Eco2")
(25 "Edge.Cuts" user)
(27 "Margin" user)
(31 "F.CrtYd" user "F.Courtyard")
(29 "B.CrtYd" user "B.Courtyard")
(35 "F.Fab" user)
(33 "B.Fab" user)
(39 "User.1" user)
(41 "User.2" user)
(43 "User.3" user)
(45 "User.4" user)
)
(setup
(stackup
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(type "Top Silk Screen")
(color "White")
)
(layer "F.Paste"
(type "Top Solder Paste")
)
(layer "F.Mask"
(type "Top Solder Mask")
(color "Green")
(thickness 0.0152)
)
(layer "F.Cu"
(type "copper")
(thickness 0.035)
)
(layer "dielectric 1"
(type "prepreg")
(color "FR4 natural")
(thickness 0.2104)
(material "FR4")
(epsilon_r 4.1)
(loss_tangent 0.02)
)
(layer "In1.Cu"
(type "copper")
(thickness 0.0152)
)
(layer "dielectric 2"
(type "core")
(color "FR4 natural")
(thickness 1.065)
(material "FR4")
(epsilon_r 4.1)
(loss_tangent 0.02)
)
(layer "In2.Cu"
(type "copper")
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)
(layer "dielectric 3"
(type "prepreg")
(color "FR4 natural")
(thickness 0.2104)
(material "FR4")
(epsilon_r 4.1)
(loss_tangent 0.02)
)
(layer "B.Cu"
(type "copper")
(thickness 0.035)
)
(layer "B.Mask"
(type "Bottom Solder Mask")
(color "Green")
(thickness 0.0152)
)
(layer "B.Paste"
(type "Bottom Solder Paste")
)
(layer "B.SilkS"
(type "Bottom Silk Screen")
(color "White")
)
(copper_finish "None")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0.09)
(solder_mask_min_width 0.1)
(allow_soldermask_bridges_in_footprints yes)
(tenting
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(back yes)
)
(covering
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(back no)
)
(plugging
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(back no)
)
(capping no)
(filling no)
(pcbplotparams
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(usegerberattributes yes)
(usegerberadvancedattributes yes)
(creategerberjobfile yes)
(dashed_line_dash_ratio 12)
(dashed_line_gap_ratio 3)
(svgprecision 4)
(plotframeref no)
(mode 1)
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(pdf_back_fp_property_popups yes)
(pdf_metadata yes)
(pdf_single_document no)
(dxfpolygonmode yes)
(dxfimperialunits yes)
(dxfusepcbnewfont yes)
(psnegative no)
(psa4output no)
(plot_black_and_white yes)
(sketchpadsonfab no)
(plotpadnumbers no)
(hidednponfab no)
(sketchdnponfab yes)
(crossoutdnponfab yes)
(subtractmaskfromsilk no)
(outputformat 1)
(mirror no)
(drillshape 1)
(scaleselection 1)
(outputdirectory "")
)
)
(footprint "TestPoint:TestPoint_Pad_D1.0mm"
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(embedded_fonts no)
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(uuid "ab25178b-9114-4456-bae1-4de0090ef2d2")
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(net "/COMP1_INM_IO1_BEMF_B")
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(net "/COMP2_INM_IO1_BEMF_A")
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(uuid "18d6d970-a9de-487c-bf18-d827292568a3")
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(net "/VBAT_SENSE")
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(pad "15" smd roundrect
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(net "/IBAT_SENSE")
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(net "unconnected-(U5-PB0-Pad16)")
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(uuid "7ada251f-185e-4bef-8e57-76e67a5fdbcc")
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(net "unconnected-(U5-PB2-Pad18)")
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(net "/PB12")
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