ADM3074EYRZ

Analog Devices · RS-485/RS-422 ICs · SOIC-8

ADM3074EYRZ from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VCC	power_in	Power supply, 3.3 V ±10%; bypass VCC to GND with a 0.1 µF capacitor.
2	RO	output	Receiver output: when enabled, RO is high if (A − B) ≥ −50 mV and low if (A − B) ≤ −200 mV.
3	DI	input	Driver input: with a full-duplex part and the driver enabled, a logic low forces Y low and Z high, and a logic high forces Y high and Z low.
4	GND	power_in	Ground reference for the device.
5	Y	output	Noninverting driver output.
6	Z	output	Inverting driver output.
7	B	bidirectional	Inverting receiver input B (RS-485 bus pin, ±15 kV ESD protected).
8	A	bidirectional	Noninverting receiver input A (RS-485 bus pin, ±15 kV ESD protected).

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	SOIC-8
Category	Communication Interface Chip/UART/485/232
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
VCC to GND	VCC	-0.3		6	V		8
Digital Input/Output Voltage (DE, RE, DI)		-0.3		6	V		8
Receiver Output Voltage (RO)		-0.3			V	Printed as -0.3 V to (VCC + 0.3 V)	8
Driver Output (A, B, Y, Z)/Receiver Input (A, B) Voltage		-8		13	V		8
Driver Output Current		-250		250	mA	Printed as ±250 mA	8
Operating Temperature Range ADM307xEY		-40		125	°C	ADM307xEY	8
Storage Temperature Range		-65		150	°C		8
Thermal Impedance θJA	θJA		158		°C/W	8-Lead SOIC_N	8
Lead Temperature Soldering				300	°C	10 sec	8
Lead Temperature Vapor Phase				215	°C	10 sec	8
Lead Temperature Infrared				220	°C	15 sec	8

CAD (KiCad official)

Symbol: ADM3074EYRZ
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: adm3074eyrz-etched.step / adm3074eyrz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm3074eyrz.step / adm3074eyrz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (20 pp, sha256 f6e1b96c4dce3dff, retrieved 2026-10-28, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

# ADM3074EYRZ

**Analog Devices** · RS-485/RS-422 ICs · SOIC-8

ADM3074EYRZ from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Power supply, 3.3 V ±10%; bypass VCC to GND with a 0.1 µF capacitor. |
| 2 | RO | output | Receiver output: when enabled, RO is high if (A − B) ≥ −50 mV and low if (A − B) ≤ −200 mV. |
| 3 | DI | input | Driver input: with a full-duplex part and the driver enabled, a logic low forces Y low and Z high, and a logic high forces Y high and Z low. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | Y | output | Noninverting driver output. |
| 6 | Z | output | Inverting driver output. |
| 7 | B | bidirectional | Inverting receiver input B (RS-485 bus pin, ±15 kV ESD protected). |
| 8 | A | bidirectional | Noninverting receiver input A (RS-485 bus pin, ±15 kV ESD protected). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | SOIC-8 |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC to GND | VCC | -0.3 |  | 6 | V |  | 8 |
| Digital Input/Output Voltage (DE, RE, DI) |  | -0.3 |  | 6 | V |  | 8 |
| Receiver Output Voltage (RO) |  | -0.3 |  |  | V | Printed as -0.3 V to (VCC + 0.3 V) | 8 |
| Driver Output (A, B, Y, Z)/Receiver Input (A, B) Voltage |  | -8 |  | 13 | V |  | 8 |
| Driver Output Current |  | -250 |  | 250 | mA | Printed as ±250 mA | 8 |
| Operating Temperature Range ADM307xEY |  | -40 |  | 125 | °C | ADM307xEY | 8 |
| Storage Temperature Range |  | -65 |  | 150 | °C |  | 8 |
| Thermal Impedance θJA | θJA |  | 158 |  | °C/W | 8-Lead SOIC_N | 8 |
| Lead Temperature Soldering |  |  |  | 300 | °C | 10 sec | 8 |
| Lead Temperature Vapor Phase |  |  |  | 215 | °C | 10 sec | 8 |
| Lead Temperature Infrared |  |  |  | 220 | °C | 15 sec | 8 |

## CAD (KiCad official)

- Symbol: `ADM3074EYRZ`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `adm3074eyrz-etched.step` / `adm3074eyrz-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `adm3074eyrz.step` / `adm3074eyrz.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Analog Devices datasheet](https://www.analog.com/media/en/technical-documentation/data-sheets/ADM3070E_3071E_3072E_3073E_3074E_3075E_3076E_3077E_3078E.pdf) (20 pp, sha256 `f6e1b96c4dce3dff`, retrieved 2026-10-28, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/adm3074eyrz-datasheet.pdf)