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ADM3074EYRZ
Public Made by Adomby adom
Analog Devices RS-485/RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownADM3074EYRZ
Analog Devices · RS-485/RS-422 ICs · SOIC-8
ADM3074EYRZ from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Power supply, 3.3 V ±10%; bypass VCC to GND with a 0.1 µF capacitor. |
| 2 | RO | output | Receiver output: when enabled, RO is high if (A − B) ≥ −50 mV and low if (A − B) ≤ −200 mV. |
| 3 | DI | input | Driver input: with a full-duplex part and the driver enabled, a logic low forces Y low and Z high, and a logic high forces Y high and Z low. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | Y | output | Noninverting driver output. |
| 6 | Z | output | Inverting driver output. |
| 7 | B | bidirectional | Inverting receiver input B (RS-485 bus pin, ±15 kV ESD protected). |
| 8 | A | bidirectional | Noninverting receiver input A (RS-485 bus pin, ±15 kV ESD protected). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | SOIC-8 |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC to GND | VCC | -0.3 | 6 | V | 8 | ||
| Digital Input/Output Voltage (DE, RE, DI) | -0.3 | 6 | V | 8 | |||
| Receiver Output Voltage (RO) | -0.3 | V | Printed as -0.3 V to (VCC + 0.3 V) | 8 | |||
| Driver Output (A, B, Y, Z)/Receiver Input (A, B) Voltage | -8 | 13 | V | 8 | |||
| Driver Output Current | -250 | 250 | mA | Printed as ±250 mA | 8 | ||
| Operating Temperature Range ADM307xEY | -40 | 125 | °C | ADM307xEY | 8 | ||
| Storage Temperature Range | -65 | 150 | °C | 8 | |||
| Thermal Impedance θJA | θJA | 158 | °C/W | 8-Lead SOIC_N | 8 | ||
| Lead Temperature Soldering | 300 | °C | 10 sec | 8 | |||
| Lead Temperature Vapor Phase | 215 | °C | 10 sec | 8 | |||
| Lead Temperature Infrared | 220 | °C | 15 sec | 8 |
CAD (KiCad official)
- Symbol:
ADM3074EYRZ - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
adm3074eyrz-etched.step/adm3074eyrz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);adm3074eyrz.step/adm3074eyrz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (20 pp, sha256
f6e1b96c4dce3dff, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).