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ADM3068EBRZ

Analog Devices · RS-485/RS-422 ICs · SOIC-14

ADM3068EBRZ from Analog Devices, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIO power_in 1.62 V to 5.5 V logic supply; a 0.1 µF decoupling capacitor to GND is recommended.
2 RO output Receiver output data, high when (A − B) ≥ −30 mV and low when (A − B) ≤ −200 mV, tristated when RE is driven high.
3 DE input Driver enable; a high level enables driver outputs Y and Z and a low level places them in high impedance.
4 RE input Active-low receiver enable; driving low enables the receiver and driving high disables it.
5 DI input Transmit data input; data to be transmitted by the driver is applied to this input.
6 GND power_in Ground.
7 NIC unconnected No internal connection; this pin is not internally connected.
8 GND power_in Ground.
9 Y output Driver noninverting output, put into high impedance when the driver is disabled or VCC is powered down.
10 Z output Driver inverting output, put into high impedance when the driver is disabled or VCC is powered down.
11 B input Inverting receiver input.
12 A input Noninverting receiver input.
13 NIC unconnected No internal connection; this pin is not internally connected.
14 VCC power_in 3.0 V to 5.5 V power supply; a 0.1 µF decoupling capacitor to GND is recommended.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SOIC-14
Category Communication Interface Chip/UART/485/232
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
No Load Supply Current ICC 3.5 7.5 mA DE = VIO, RE = 0 V 4
No Load Supply Current ICC 3 4.5 mA DE = 0 V, RE = 0 V 4
Supply Current, Data Rate = 50 Mbps ICC 107 172 mA RL = 54 Ω, DE = VIO, RE = 0 V (VCC ≥ 4.5 V) 4
Supply Current, Data Rate = 50 Mbps ICC 67 75 mA RL = 54 Ω, DE = VIO, RE = 0 V (VCC = 3.0 V) 4
Supply Current in Shutdown Mode ISHDN 210 450 µA DE = 0 V, RE = VIO 4
VIO Shutdown Current IIOSHDN 1 50 µA DE = 0 V, RE = VIO 4
Driver Output Voltage, Loaded /VOD2/ 2 2.5 V VCC ≥ 3.0 V, RL = 50 Ω, see Figure 38 4
Driver Output Voltage, Loaded /VOD2/ 1.5 2.1 V VCC ≥ 3.0 V, RL = 27 Ω (RS-485), see Figure 38 4
Driver Output Voltage, Loaded /VOD2/ 2.1 3.5 V VCC ≥ 4.5 V, RL = 50 Ω, see Figure 38 4
Driver Output Voltage, Loaded /VOD2/ 2.1 3 V VCC ≥ 4.5 V, RL = 27 Ω (RS-485), see Figure 38 4
Driver Output Voltage over Common Mode /VOD3/ 1.5 2.1 V VCC ≥ 3.0 V, −7 V ≤ VCM ≤ +12 V, see Figure 39 4
Driver Output Voltage over Common Mode /VOD3/ 2.1 3 V VCC ≥ 4.5 V, −7 V ≤ VCM ≤ +12 V, see Figure 39 4
Change in Differential Output Voltage for Complementary Output States ∆/VOD/ 0.2 V RL = 27 Ω or 50 Ω, see Figure 38 4
Common-Mode Output Voltage VOC 1.6 3 V RL = 27 Ω or 50 Ω, see Figure 38 4
Change in Common-Mode Voltage for Complementary Output States ∆/VOC/ 0.2 V RL = 27 Ω or 50 Ω, see Figure 38 4
Output Short-Circuit Current IOS -250 250 mA −7 V < VOUT < +12 V 4
Output Leakage (Y, Z) IO 100 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V 4
Output Leakage (Y, Z) IO -100 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V 4
Logic Input Voltage Low VIL 0.33 V DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V (printed as 0.33 × VIO) 4
Logic Input Voltage High VIH 0.67 V DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V (printed as 0.67 × VIO) 4
Logic Input Current II -2 2 µA DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V, 0 V ≤ VIN ≤ VIO 4
Differential Input Threshold Voltage VTH -200 -125 -30 mV −7 V < VCM < +12 V 4
Input Voltage Hysteresis VHYS 30 mV −7 V < VCM < +12 V 4
Receiver Input Current (A, B) II 0.1 0.25 mA DE = 0 V, VCC = powered/unpowered, VIN = 12 V 4
Receiver Input Current (A, B) II -0.2 -0.1 mA DE = 0 V, VCC = powered/unpowered, VIN = −7 V 4
Line Input Resistance RIN 48 96 kΩ −7 V ≤ VCM ≤ +12 V 4
Supply Voltage VCC (operating) VCC 3 5.5 V 4
Logic Supply Voltage VIO (operating) VIO 1.62 5.5 V VIO = 1.62 V to VCC 4
Operating Temperature (B grade) TA -40 125 °C TMIN to TMAX 4
VCC to GND VCC 6 V 8
VIO to GND VIO -0.3 6 V 8
Digital Input and Output Voltage (DE, RE, DI, RO) -0.3 0.3 V −0.3 V to VIO + 0.3 V 8
Driver Output and Receiver Input Voltage -9 14 V 8
Storage Temperature Range -65 150 °C 8
Continuous Total Power Dissipation, 14-Lead SOIC_N 0.239 W 14-Lead SOIC_N 8
Maximum Junction Temperature TJ 150 °C 8
Lead Temperature, Soldering 300 °C 10 sec 8
ESD on Bus Pins, IEC 61000-4-2 Contact Discharge -12 12 kV A, B, Y, Z 8
ESD on Bus Pins, HBM -30 30 kV A, B, Y, Z; printed ≥±30 kV 8
ESD HBM, All Other Pins -8 8 kV 8
Thermal Resistance Junction to Ambient, R-14 θJA 104.5 °C/W R-14 (14-lead SOIC_N), JEDEC 2S2P board 8
Thermal Resistance Junction to Case, R-14 θJC 42.9 °C/W R-14 (14-lead SOIC_N), JEDEC 2S2P board 8

CAD (KiCad official)

  • Symbol: ADM3068EBRZ
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: adm3068ebrz-etched.step / adm3068ebrz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); adm3068ebrz.step / adm3068ebrz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (25 pp, sha256 7ce4130f0f613a46, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF