component
ADM3068EBRZ
Public Made by Adomby adom
Analog Devices RS-485/RS-422 ICs, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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ADM3068EBRZ
Analog Devices · RS-485/RS-422 ICs · SOIC-14
ADM3068EBRZ from Analog Devices, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIO | power_in | 1.62 V to 5.5 V logic supply; a 0.1 µF decoupling capacitor to GND is recommended. |
| 2 | RO | output | Receiver output data, high when (A − B) ≥ −30 mV and low when (A − B) ≤ −200 mV, tristated when RE is driven high. |
| 3 | DE | input | Driver enable; a high level enables driver outputs Y and Z and a low level places them in high impedance. |
| 4 | RE | input | Active-low receiver enable; driving low enables the receiver and driving high disables it. |
| 5 | DI | input | Transmit data input; data to be transmitted by the driver is applied to this input. |
| 6 | GND | power_in | Ground. |
| 7 | NIC | unconnected | No internal connection; this pin is not internally connected. |
| 8 | GND | power_in | Ground. |
| 9 | Y | output | Driver noninverting output, put into high impedance when the driver is disabled or VCC is powered down. |
| 10 | Z | output | Driver inverting output, put into high impedance when the driver is disabled or VCC is powered down. |
| 11 | B | input | Inverting receiver input. |
| 12 | A | input | Noninverting receiver input. |
| 13 | NIC | unconnected | No internal connection; this pin is not internally connected. |
| 14 | VCC | power_in | 3.0 V to 5.5 V power supply; a 0.1 µF decoupling capacitor to GND is recommended. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | SOIC-14 |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| No Load Supply Current | ICC | 3.5 | 7.5 | mA | DE = VIO, RE = 0 V | 4 | |
| No Load Supply Current | ICC | 3 | 4.5 | mA | DE = 0 V, RE = 0 V | 4 | |
| Supply Current, Data Rate = 50 Mbps | ICC | 107 | 172 | mA | RL = 54 Ω, DE = VIO, RE = 0 V (VCC ≥ 4.5 V) | 4 | |
| Supply Current, Data Rate = 50 Mbps | ICC | 67 | 75 | mA | RL = 54 Ω, DE = VIO, RE = 0 V (VCC = 3.0 V) | 4 | |
| Supply Current in Shutdown Mode | ISHDN | 210 | 450 | µA | DE = 0 V, RE = VIO | 4 | |
| VIO Shutdown Current | IIOSHDN | 1 | 50 | µA | DE = 0 V, RE = VIO | 4 | |
| Driver Output Voltage, Loaded | /VOD2/ | 2 | 2.5 | V | VCC ≥ 3.0 V, RL = 50 Ω, see Figure 38 | 4 | |
| Driver Output Voltage, Loaded | /VOD2/ | 1.5 | 2.1 | V | VCC ≥ 3.0 V, RL = 27 Ω (RS-485), see Figure 38 | 4 | |
| Driver Output Voltage, Loaded | /VOD2/ | 2.1 | 3.5 | V | VCC ≥ 4.5 V, RL = 50 Ω, see Figure 38 | 4 | |
| Driver Output Voltage, Loaded | /VOD2/ | 2.1 | 3 | V | VCC ≥ 4.5 V, RL = 27 Ω (RS-485), see Figure 38 | 4 | |
| Driver Output Voltage over Common Mode | /VOD3/ | 1.5 | 2.1 | V | VCC ≥ 3.0 V, −7 V ≤ VCM ≤ +12 V, see Figure 39 | 4 | |
| Driver Output Voltage over Common Mode | /VOD3/ | 2.1 | 3 | V | VCC ≥ 4.5 V, −7 V ≤ VCM ≤ +12 V, see Figure 39 | 4 | |
| Change in Differential Output Voltage for Complementary Output States | ∆/VOD/ | 0.2 | V | RL = 27 Ω or 50 Ω, see Figure 38 | 4 | ||
| Common-Mode Output Voltage | VOC | 1.6 | 3 | V | RL = 27 Ω or 50 Ω, see Figure 38 | 4 | |
| Change in Common-Mode Voltage for Complementary Output States | ∆/VOC/ | 0.2 | V | RL = 27 Ω or 50 Ω, see Figure 38 | 4 | ||
| Output Short-Circuit Current | IOS | -250 | 250 | mA | −7 V < VOUT < +12 V | 4 | |
| Output Leakage (Y, Z) | IO | 100 | µA | DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V | 4 | ||
| Output Leakage (Y, Z) | IO | -100 | µA | DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V | 4 | ||
| Logic Input Voltage Low | VIL | 0.33 | V | DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V (printed as 0.33 × VIO) | 4 | ||
| Logic Input Voltage High | VIH | 0.67 | V | DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V (printed as 0.67 × VIO) | 4 | ||
| Logic Input Current | II | -2 | 2 | µA | DE, RE, DI, 1.62 V ≤ VIO ≤ 5.5 V, 0 V ≤ VIN ≤ VIO | 4 | |
| Differential Input Threshold Voltage | VTH | -200 | -125 | -30 | mV | −7 V < VCM < +12 V | 4 |
| Input Voltage Hysteresis | VHYS | 30 | mV | −7 V < VCM < +12 V | 4 | ||
| Receiver Input Current (A, B) | II | 0.1 | 0.25 | mA | DE = 0 V, VCC = powered/unpowered, VIN = 12 V | 4 | |
| Receiver Input Current (A, B) | II | -0.2 | -0.1 | mA | DE = 0 V, VCC = powered/unpowered, VIN = −7 V | 4 | |
| Line Input Resistance | RIN | 48 | 96 | kΩ | −7 V ≤ VCM ≤ +12 V | 4 | |
| Supply Voltage VCC (operating) | VCC | 3 | 5.5 | V | 4 | ||
| Logic Supply Voltage VIO (operating) | VIO | 1.62 | 5.5 | V | VIO = 1.62 V to VCC | 4 | |
| Operating Temperature (B grade) | TA | -40 | 125 | °C | TMIN to TMAX | 4 | |
| VCC to GND | VCC | 6 | V | 8 | |||
| VIO to GND | VIO | -0.3 | 6 | V | 8 | ||
| Digital Input and Output Voltage (DE, RE, DI, RO) | -0.3 | 0.3 | V | −0.3 V to VIO + 0.3 V | 8 | ||
| Driver Output and Receiver Input Voltage | -9 | 14 | V | 8 | |||
| Storage Temperature Range | -65 | 150 | °C | 8 | |||
| Continuous Total Power Dissipation, 14-Lead SOIC_N | 0.239 | W | 14-Lead SOIC_N | 8 | |||
| Maximum Junction Temperature | TJ | 150 | °C | 8 | |||
| Lead Temperature, Soldering | 300 | °C | 10 sec | 8 | |||
| ESD on Bus Pins, IEC 61000-4-2 Contact Discharge | -12 | 12 | kV | A, B, Y, Z | 8 | ||
| ESD on Bus Pins, HBM | -30 | 30 | kV | A, B, Y, Z; printed ≥±30 kV | 8 | ||
| ESD HBM, All Other Pins | -8 | 8 | kV | 8 | |||
| Thermal Resistance Junction to Ambient, R-14 | θJA | 104.5 | °C/W | R-14 (14-lead SOIC_N), JEDEC 2S2P board | 8 | ||
| Thermal Resistance Junction to Case, R-14 | θJC | 42.9 | °C/W | R-14 (14-lead SOIC_N), JEDEC 2S2P board | 8 |
CAD (KiCad official)
- Symbol:
ADM3068EBRZ - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files:
adm3068ebrz-etched.step/adm3068ebrz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);adm3068ebrz.step/adm3068ebrz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (25 pp, sha256
7ce4130f0f613a46, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).