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Contents

README

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AD5685RBCPZ-RL7

Analog Devices · Digital To Analog Converters (DACs) · LFCSP-16(3x3)

AD5685RBCPZ-RL7 from Analog Devices, in a LFCSP-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUTA output Analog output voltage from DAC A; the output amplifier has rail-to-rail operation.
2 GND power_in Ground reference point for all circuitry on the part.
3 VDD power_in Power supply input operated from 2.7 V to 5.5 V, to be decoupled with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND.
4 VOUTC output Analog output voltage from DAC C; the output amplifier has rail-to-rail operation.
5 VOUTD output Analog output voltage from DAC D; the output amplifier has rail-to-rail operation.
6 SDO output Serial data output used for daisy-chaining devices or for readback, transferred on the rising edge of SCLK and valid on the falling edge.
7 LDAC input Load DAC control that, when pulsed low, updates any or all DAC registers with new input data, and can be tied permanently low.
8 GAIN input Span set pin: tied to GND gives a 0 V to VREF output span, tied to VLOGIC gives a 0 V to 2 × VREF span on all four DACs.
9 VLOGIC power_in Digital power supply with a voltage range from 1.8 V to 5.5 V.
10 SCLK input Serial clock input; data is clocked into the input shift register on the falling edge at rates up to 50 MHz.
11 SYNC input Active-low frame synchronization input; when low, data is transferred in on the falling edges of the next 24 clocks.
12 SDIN input Serial data input to a 24-bit input shift register, clocked in on the falling edge of SCLK.
13 RESET input Falling-edge-sensitive asynchronous reset input that loads zero scale or midscale per RSTSEL and ignores LDAC pulses while low.
14 RSTSEL input Power-on reset select: tied to GND powers all four DACs to zero scale, tied to VLOGIC powers all four DACs to midscale.
15 VREF power_in Common reference pin that is the reference output when the internal reference is used and the reference input when an external reference is used; the default is reference output.
16 VOUTB output Analog output voltage from DAC B; the output amplifier has rail-to-rail operation.
17 EPAD power_in Exposed pad that must be tied to GND.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-16(3x3)
Category ADC/DAC/Data Conversion
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Relative Accuracy (INL) INL 0.5 1 LSB 3
Differential Nonlinearity DNL 1 LSB Guaranteed monotonic by design 3
Zero-Code Error 0.4 1.5 mV All zeros loaded to DAC register 3
Offset Error -1.5 0.1 1.5 mV 3
Full-Scale Error -0.1 0.01 0.1 % of FSR All ones loaded to DAC register 3
Gain Error -0.1 0.02 0.1 % of FSR 3
Offset Error Drift -1 1 µV/°C 3
Gain Temperature Coefficient -1 1 ppm of FSR/°C 3
Resistive Load RL 1 kΩ 3
Reference Output Voltage VREF 2.4975 2.5025 V At ambient 3
Reference Temperature Coefficient TC 2 5 ppm/°C See the Terminology section 3
Supply Voltage VDD (Gain = 1) VDD 2.7 5.5 V Gain = 1 3
Logic Supply Voltage VLOGIC 1.62 5.5 V 3
Normal Mode Supply Current IDD 0.59 0.7 mA VIH = VDD, VIL = GND, VDD = 2.7 V to 5.5 V; internal reference off 4
Normal Mode Supply Current, Internal Reference On IDD 1.1 1.3 mA VIH = VDD, VIL = GND, VDD = 2.7 V to 5.5 V; internal reference on, at full scale 4
All Power-Down Modes Supply Current IDD 1 4 µA −40°C to +85°C 4
All Power-Down Modes Supply Current, High Temperature IDD 6 µA −40°C to +105°C 4
Output Voltage Settling Time tS 5 8 µs ¼ to ¾ scale settling to ±2 LSB 5
VDD to GND VDD -0.3 7 V 8
VLOGIC to GND VLOGIC -0.3 7 V 8
Operating Temperature Range TA -40 105 °C 8
Storage Temperature Range TSTG -65 150 °C 8
Junction Temperature TJ 125 °C 8
Reflow Soldering Peak Temperature, Pb Free 260 °C J-STD-020 8
16-Lead LFCSP Thermal Impedance, Junction-to-Ambient θJA 70 °C/W 0 Airflow, 4-Layer Board 8

CAD (KiCad official)

  • Symbol: AD5685RBCPZ-RL7
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: LFCSP-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: ad5685rbcpz-rl7-etched.step / ad5685rbcpz-rl7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad5685rbcpz-rl7.step / ad5685rbcpz-rl7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (29 pp, sha256 16c7cb655e87649e, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF