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AD5441BRMZ

Analog Devices · Digital To Analog Converters (DACs) · MSOP-8

AD5441BRMZ from Analog Devices, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VREF power_in DAC reference input pin that establishes the DAC full-scale voltage, with constant input resistance vs. code (absolute maximum ±18 V to GND).
2 RFB passive Internal matching feedback resistor, connected to the external op amp output (absolute maximum ±18 V to GND).
3 IOUT output DAC current output, with full-scale output 1 LSB less than the reference input voltage -VREF.
4 GND power_in Analog and digital ground.
5 LD input Level-sensitive active-low load strobe that transfers shift-register data to the DAC register while active low.
6 SRI input 12-bit serial register input where data loads directly into the shift register MSB first and extra leading bits are ignored.
7 CLK input Clock input where the positive edge clocks data into the shift register.
8 VDD power_in Positive power supply input with a specified range of operation of 5 V ± 10%.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-8
Category ADC/DAC/Data Conversion
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Relative Accuracy INL -0.5 0.5 LSB 3
Differential Nonlinearity DNL -0.5 0.5 LSB All grades monotonic to 12 bits 3
Gain Error GFSE -1 1 LSB Data = FFFH 3
Gain Temperature Coefficient TCGFS -5 5 ppm/°C IOUT pin measured 3
Output Leakage Current ILKG -5 5 nA Data = 000H, IOUT pin measured 3
Output Leakage Current ILKG -25 25 nA TA = -40°C, +125°C, data = 000H, IOUT pin measured 3
Zero-Scale Error IZSE -0.03 0.03 LSB Data = 000H 3
Zero-Scale Error IZSE -0.15 0.15 LSB TA = −40°C, +125°C, data = 000H 3
Input Resistance RREF 7 15 kΩ Absolute temperature coefficient < 50 ppm/°C 3
Power Supply Range VDD RANGE 2.5 5.5 V 3
Power Dissipation PDISS 2.5 5.5 μW VLOGIC = 0 V or VDD 3
Tdata setup tDS 10 ns 2.5 V supply column; data setup 4
Tdata setup tDS 5 ns 5.5 V supply column; data setup 4
Data hold tDH 5 ns 2.5 V supply column; data hold 4
Clock width high tCH 15 ns 2.5 V supply column 4
Clock width high tCH 10 ns 5.5 V supply column 4
Clock width low tCL 15 ns 2.5 V supply column 4
Clock width low tCL 10 ns 5.5 V supply column 4
Load pulse width tLD 20 ns 2.5 V supply column 4
Load pulse width tLD 10 ns 5.5 V supply column 4
LD DAC high to MSB CLK high tLD1 0 ns 2.5 V supply column 4
LSB CLK to LD DAC tASB 0 ns 2.5 V supply column 4
VDD to GND VDD -0.3 8 V 5
VREF to GND VREF -18 18 V 5
RFB to GND RFB -18 18 V 5
Logic Inputs to GND -0.3 V Upper limit printed as VDD + 0.3 V 5
IOUT to GND IOUT -0.3 V Upper limit printed as VDD + 0.3 V 5
IOUT Short Circuit to GND 50 mA 5
Maximum Junction Temperature TJ max 150 °C 5
Operating Temperature Range -40 125 °C 5
Storage Temperature Range -65 150 °C 5
Lead Temperature (Soldering) 300 °C 10 sec 5
Input Capacitance CREF 5 pF 3
Output Capacitance COUT 1 pF Data = 000H 3
Output Capacitance COUT 4 pF Data = FFFH 3
Digital Input Low VIL 0.8 V 3
Digital Input High VIH 2.4 V 3
Input Leakage Current IIL 1 μA VLOGIC = 0 V to 5 V 3
Input Capacitance CIL 4 pF VLOGIC = 0 V 3
Output Current Settling Time tS 5 μs To ±0.01% of full-scale, external op amp OP42 3
Output Current Settling Time tS 0.5 μs To ±0.01% of full-scale, 100 Ω terminated to ground 3
DAC Glitch Q 40 nVs Data = 000H to FFFH to 000H, VREF = 0 V, OP42 3
DAC Glitch Q 1 nVs Data = 000H to FFFH to 000H, VREF = 0 V, 100 Ω 3
Digital Feedthrough 5 nV Using external op amp OP42 3
Feedthrough (VOUT/VREF) FT 1.4 mV p-p VREF = 20 V p-p, data = 000H, f = 10 kHz 3
Total Harmonic Distortion THD -85 dB VREF = 6 V rms, data = FFFH, f = 1 kHz 3
Output Noise Density en 17 nV/√Hz 10 Hz to 100 kHz between RFB and IOUT 3
Multiplying Bandwidth BW 1.9 MHz −3 dB, VOUT/VREF, VREF = 100 mV rms, data = FFFH 3
Positive Supply Current IDD 10 μA VLOGIC = 0 V or VDD 3
Power Supply Sensitivity PSS 0.002 %/% ΔVDD = ±5% 3
Thermal Resistance, junction-to-ambient (8-Lead MSOP) θJA 142 °C/W Worst case, surface-mount device soldered in circuit board 5
Thermal Resistance, junction-to-case (8-Lead MSOP) θJC 44 °C/W Worst case, surface-mount device soldered in circuit board 5

CAD (KiCad official)

  • Symbol: AD5441BRMZ
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: ad5441brmz-etched.step / ad5441brmz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ad5441brmz.step / ad5441brmz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (16 pp, sha256 e59114a066cad0c1, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF