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Contents

README

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ACT88320QI109-T

Qorvo · Power Management - Specialized · QFN-32(4x4)

ACT88320QI109-T from Qorvo, in a QFN-32(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Dedicated VIN power input for BUCK3; connect the BUCK3 input capacitors (10uF to PGND) directly to pins 1 and 2.
2 VIN power_in Dedicated VIN power input for BUCK3; connect the BUCK3 input capacitors (10uF to PGND) directly to pins 1 and 2.
3 SW_B3 power_out Switch node pin for the BUCK3 regulator, connected directly to the buck inductor.
4 OVSNS input Analog VIN+ input used to monitor input voltage and start the inrush control FET; connect to PGND if the inrush FET is not used (absolute maximum 22V).
5 OVSNS_M input Analog VIN- input used to monitor current in the external sense resistor RSNS (current limit threshold 85mV); connect to PGND if the inrush FET is not used.
6 OVGATE output Gate drive for the inrush control FET, typically 8V above VIN, which requires a 12V n-channel FET.
7 PGND power_in Power ground for Buck3; connect the BUCK3 input capacitors directly to pins 7 and 8 and to the exposed pad.
8 PGND power_in Power ground for Buck3; connect the BUCK3 input capacitors directly to pins 7 and 8 and to the exposed pad.
9 SDA bidirectional I2C data input and output, open drain and requires a pull-up resistor.
10 SCL input I2C clock input.
11 GPIO4 / DVS input GPIO configured as a dynamic voltage scaling (DVS) input in CMI 109; open-drain capable and 5.5V tolerant.
12 GPIO3 / nIRQ output GPIO configured as an interrupt (nIRQ) open-drain output, needing a pull-up resistor.
13 GPIO1 / nRESET output GPIO configured as an nRESET open-drain output, released 20ms after Buck3 is in regulation in CMI 109.
14 GPIO2 / EXT_EN output GPIO configured as an open-drain output to enable an external power supply, going high 2.5ms after Buck2 is in regulation in CMI 109.
15 VIO power_in Digital input reference/bias voltage that powers the GPIO pins; bypass with a 1uF capacitor between VIO and AGND.
16 FB_B1 input Feedback for the BUCK1 regulator; connect directly (Kelvin) to the Buck1 output capacitor.
17 VIN power_in Dedicated VIN power input for BUCK1; connect the Buck1 input capacitors directly to pins 17 and 18.
18 VIN power_in Dedicated VIN power input for BUCK1; connect the Buck1 input capacitors directly to pins 17 and 18.
19 SW_B1 power_out Switch pin for the BUCK1 regulator, connected directly to the buck inductor.
20 SW_B1 power_out Switch pin for the BUCK1 regulator, connected directly to the buck inductor.
21 PGND power_in Power ground for BUCK1 and BUCK2; connect the BUCK1 and BUCK2 input capacitors directly to this pin.
22 SW_B2 power_out Switch pin for the BUCK2 regulator, connected directly to the buck inductor.
23 VIN power_in Dedicated VIN power input for BUCK2; connect the BUCK2 input capacitors directly to pins 23 and 24.
24 VIN power_in Dedicated VIN power input for BUCK2; connect the BUCK2 input capacitors directly to pins 23 and 24.
25 FB_B2 input Feedback for the BUCK2 regulator; connect Kelvin to the Buck2 output capacitor.
26 PWREN input Power enable digital input, referenced to AVIN and 5.5V tolerant, with a 10us bidirectional filter.
27 AVIN power_in Dedicated VIN power input for LDO1 and LDO2 and analog VIN input; bypass to AGND with a 1uF ceramic capacitor.
28 OUT_LDO2 power_out Output of the LDO2 regulator (200mA); bypass to AGND with a 1uF capacitor.
29 OUT_LDO1 power_out Output of the LDO1 regulator (200mA); bypass to AGND with a 1uF capacitor.
30 LSG1 output Output1 load switch gate driver for an external n-channel FET with programmable 2.5uA to 10uA slew current and a 75 ohm pulldown when disabled.
31 AGND power_in Analog ground for the analog circuitry and LDOs; must be connected to the exposed pad.
32 FB_B3 input Feedback for the BUCK3 regulator; connect Kelvin to the Buck3 output capacitor.
33 Exposed Pad power_in Exposed pad ground reference that must be soldered to the top layer ground plane, with all ground pins connected to it.

Key specifications

Parameter Value
Manufacturer Qorvo
Package QFN-32(4x4)
Category Power Management (PMIC)
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Supply Voltage Range AVIN AVIN 2.7 5.5 V referenced to AGND 9
UVLO Threshold Falling 2.5 2.6 2.7 V 9
OV Threshold Rising 5.5 5.75 6 V 9
OV Hysteresis 100 200 300 mV 9
Thermal Shutdown Temperature 140 160 180 °C Temperature rising 9
Oscillator Frequency 2.13 2.25 2.37 MHz 9
Operating Supply Current, all regulators disabled 10 µA All Regulators Disabled 9
Operating Supply Current, all regulators enabled 250 µA All Regulators Enabled but no load 9
Buck1 Output Voltage Accuracy PWM -1 1 % VOUT_B1 = default CMI voltage, continuous PWM mode 12
Buck1 Output Voltage Accuracy PFM -2 2 % VOUT_B1 = default CMI voltage, PFM mode 12
Buck1 Current Limit, Cycle-by-Cycle 4.14 4.6 5.06 A 12
Buck1 PMOS On-Resistance 40 50 mΩ ISW = -1A, VIN = 5.0V 12
Buck1 NMOS On-Resistance 16 25 mΩ ISW = 1A, VIN = 5.0V 12
Buck1 Power Good Threshold 90 92.5 95 %VNOM VOUT_B1 Rising 12
Buck1 Soft-Start Period Tset 480 600 µs 10% to 90% VNOM 12
Buck2-3 Output Voltage Accuracy -1 1 % VOUTx = default CMI voltage, IOUTx = 1A (continuous PWM mode) 14
Buck2-3 Current Limit, Cycle-by-Cycle 2.7 3 3.3 A 14
Buck2-3 Power Good Threshold 90 92.5 95 %VNOM VOUTx Rising 14
LDO Output Voltage Accuracy -1 1 % AVIN - VLDOx_OUT > 0.4V 15
LDO Output Current 180 200 mA 15
Overcurrent Shutdown Threshold (inrush) 70 85 100 mV Voltage across current sense resistor 11
Absolute Max: All Pins to AGND and PGND -0.3 6 V unless stated otherwise 7
Absolute Max: OVSNS, OVSNS_M to PGND -0.3 22 V 7
Absolute Max: OVGATE to VIN -0.3 13.2 V 7
Absolute Max: VIN to PGND -0.3 6 V 7
Operating Junction Temperature -40 150 °C 7
Storage Temperature -55 150 °C 7
Junction to Ambient Thermal Resistance 26.5 °C/W Measured on Active-Semi Evaluation Kit 7
Junction to Case Thermal Resistance 13.1 °C/W Measured on Active-Semi Evaluation Kit 7

CAD (KiCad official)

  • Symbol: ACT88320QI109-T
  • Footprint: Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm
  • 3D model: QFN-32(4x4) (KiCad packages3D, STEP)
  • 3D model files: act88320qi109-t-etched.step / act88320qi109-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); act88320qi109-t.step / act88320qi109-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Qorvo datasheet (57 pp, sha256 2209f7c7460e5025, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF