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ACPL-061L-500E

Broadcom AVAGO · Logic Output Optoisolators · SOIC-8

ACPL-061L-500E from Broadcom AVAGO, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected Not connected on the ACPL-061L SO-8 package.
2 Anode input LED anode input; the datasheet specifies an input forward current of 1.6 mA to 6.0 mA (IFH) with a 8 mA maximum average forward input current.
3 Cathode input LED cathode input; the datasheet specifies a maximum average forward input current of 8 mA and a reverse input voltage of 5 V maximum.
4 NC unconnected Not connected on the ACPL-061L SO-8 package.
5 GND power_in Output-side ground; a 0.1 µF bypass capacitor must be connected between VDD and GND, with total lead length not exceeding 20 mm.
6 Vo output Push-pull CMOS output with slew-rate control; output voltage is limited to -0.5 V to VDD + 0.5 V and output current to 10 mA maximum.
7 NC unconnected Not connected on the ACPL-061L (footnote states pin 7 is not connected).
8 VDD power_in Output-side supply; the recommended supply range is 2.7 V to 5.5 V with a 6.5 V absolute maximum, and a 0.1 µF bypass capacitor is required between VDD and GND.

Key specifications

Parameter Value
Manufacturer Broadcom AVAGO
Package SOIC-8
Category Optoisolators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Storage Temperature TS -55 125 °C 6
Operating Temperature TA -40 105 °C 6
Reverse Input Voltage VR 5 V 6
Supply Voltage VDD 6.5 V 6
Average Forward Input Current IF 8 mA 6
Peak Forward Input Current IF(TRAN) 1 A ≤1 s Pulse Width, <300 pulses per second 6
Peak Forward Input Current IF(TRAN) 80 mA ≤1 s Pulse Width, <10% Duty Cycle 6
Output Current IO 10 mA 6
Output Voltage VO -0.5 V 6
Input Power Dissipation PI 14 mW 6
Output Power Dissipation PO 20 mW 6
Lead Solder Temperature TLS 260 °C for 10 sec., 1.6 mm below seating plane 6
Operating Temperature TA -40 105 °C 7
Input Current, Low Level IFL 0 250 A 7
Input Current, High Level IFH 1.6 6 mA 7
Power Supply Voltage VDD 2.7 5.5 V 7
Forward Input Voltage VF(OFF) 0.8 V 7
Logic Low Input Voltage VIL 0 0.8 V 7
Input Forward Voltage VF 0.95 1.3 1.7 V IF = 2 mA 7
Input Reverse Breakdown Voltage BVR 3 5 V VIR = 10 A 7
Logic Low Output Voltage VOL 0.03 0.1 V IF = 2 mA, VI = 5 V (RT = 1.68 k) or VI = 3.3V (RT = 870), IO = 20 A 7
Logic Low Output Voltage VOL 0.18 0.4 V IF = 2 mA, VI = 5 V (RT = 1.68 k) or VI = 3.3V (RT = 870), IO = 3.2 mA 7
Input Threshold Current ITH 0.7 1.3 mA 7
Logic Low Output Supply Current IDDL 0.8 1.3 mA 7
Logic High Output Supply Current IDDH 0.8 1.3 mA 7
Propagation Delay Time to Logic Low Output tPHL 46 80 ns IF = 2 mA, VI = 5 V, RT = 1.68 k, CL = 15 pF, CMOS Signal Levels; or VI = 3.3 V, RT = 870, CL = 15 pF 8
Propagation Delay Time to Logic High Output tPLH 40 80 ns IF = 2 mA, VI = 5 V, RT = 1.68 k, CL = 15 pF, CMOS Signal Levels; or VI = 3.3 V, RT = 870, CL = 15 pF 8
Pulse Width tPW 100 ns 8
Pulse Width Distortion PWD 6 30 ns 8
Propagation Delay Skew tPSK 30 ns 8
Output Rise Time (10% - 90%) tR 12 ns IF = 2 mA, VI = 5 V, RT = 1.68 k, CL = 15 pF, CMOS Signal Levels 8
Output Rise Time (10% - 90%) tR 10 ns IF = 2 mA, VI = 3.3 V, RT = 870, CL = 15 pF, CMOS Signal Levels 8
Output Fall Time (90% - 10%) tF 12 ns IF = 2 mA, VI = 5 V, RT = 1.68 k, CL = 15 pF, CMOS Signal Levels 8
Output Fall Time (90% - 10%) tF 10 ns IF = 2 mA, VI = 3.3 V, RT = 870, CL = 15 pF, CMOS Signal Levels 8
Static Common Mode Transient Immunity at Logic High Output CMH 20 35 kV/µs VCM = 1000 V, TA = 25°C, IF = 0 mA, VI = 0 V (RT = 1.68 k) or (RT = 870), CL = 15 pF, CMOS Signal Levels 8
Static Common Mode Transient Immunity at Logic Low Output CML 20 35 kV/µs VCM = 1000 V, TA = 25°C, VI = 5 V (RT = 1.68 k) or VI = 3.3 V (RT = 870), IF = 2 mA, CL = 15 pF, CMOS Signal Levels 8
Dynamic Common Mode Transient Immunity CMRD 35 kV/µs VCM = 1000 V, TA = 25°C, IF = 2 mA, VI = 5 V (RT = 1.68 k) or VI = 3.3 V (RT = 870), 10 MBd datarate, absolute increase of PWD < 10 ns 8
Input-Output Insulation VISO 3750 Vrms RH < 50% for 1 min., TA = 25°C 9
Input-Output Capacitance CI-O 0.6 pF f = 1 MHz, TA = 25°C 9
Input Capacitance CIN 60 pF f = 1 MHz, VF = 0 V 7
Input Diode Temperature Coefficient VF/TA -1.6 mV/°C IF = 2 mA 7

CAD (KiCad official)

  • Symbol: ACPL-061L-500E
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: acpl-061l-500e-etched.step / acpl-061l-500e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); acpl-061l-500e.step / acpl-061l-500e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Broadcom AVAGO datasheet (17 pp, sha256 a7df20103dbe2929, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF