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ABS1-10

Shandong Jingdao Microelectronics · Bridge Rectifiers · ABS

ABS1-10 from Shandong Jingdao Microelectronics, in a ABS. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 - power_out DC negative output terminal of the glass-passivated bridge rectifier, rated for reverse voltage up to 1000 V for the ABS10-10 variant and 100 V for ABS1-10.
2 + power_out DC positive output terminal of the bridge rectifier, supplying up to 1 A forward current.
3 Input Pin (~) passive AC input terminal of the bridge rectifier; the part is rated for 1 A forward current with high surge capability.
4 Input Pin (~) passive AC input terminal of the bridge rectifier; the part is rated for 1 A forward current with high surge capability.

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package ABS
Category Diodes
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Peak Reverse Voltage VRRM 100 V 1
Maximum RMS Voltage VRMS 70 V 1
Maximum DC Blocking Voltage VDC 100 V 1
Average Rectified Output Current IO 1 A at Tc = 125 °C 1
Peak Forward Surge Current IFSM 35 A 8.3 ms single half sine wave superimposed on rated load (JEDEC method) 1
Forward Voltage per element VF 1.1 V @IF = 1.0 A 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 5 μA @TA = 25 °C 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 50 μA @TA = 100 °C 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 100 μA @TA = 125 °C 1
Operating and Storage Temperature Range Tj, Tstg -55 150 °C 1
Typical Junction Capacitance Cj 13 pF Measured at 1MHz and applied reverse voltage of 4 V DC (Note 1) 1
Typical Thermal Resistance, junction to ambient RθJA 72 °C/W Mounted on glass epoxy PC board with 4×1.5"×1.5" (3.81×3.81 cm) copper pad (Note 2) 1
Typical Thermal Resistance, junction to case RθJC 20 °C/W Note 2: mounted on glass epoxy PC board with 4×1.5"×1.5" copper pad 1

CAD (KiCad official)

  • Symbol: ABS1-10
  • Footprint: Diode_SMD:Diode_Bridge_Diotec_ABS
  • 3D model: ABS (KiCad packages3D, STEP)
  • 3D model files: abs1-10-etched.step / abs1-10-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); abs1-10.step / abs1-10.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256 0cba158f268a5681, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF