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A89500GEJTR-T

Allegro MicroSystems, LLC · Gate Drive ICs · DFN-10(3x3)

A89500GEJTR-T from Allegro MicroSystems, LLC, in a DFN-10(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Gate drive power supply input, 8 to 15 V operating range, to be decoupled with a ceramic capacitor CVCC close to the VCC and GND terminals.
2 NC unconnected No internal connection; connect to GND.
3 C passive Bootstrap capacitor connection (positive supply for the high-side gate driver), with CBOOT connected between C and S.
4 GH output High-side gate drive output for an external N-channel MOSFET.
5 S passive Load connection and source reference of the high-side MOSFET, negative supply reference for the floating high-side driver.
6 RESETn input Active-low standby mode control logic input that puts the device into low-power sleep mode when taken low, with 50 kΩ typical pull-down.
7 HS input High-side control logic input, active high, 3.3 V and 5 V compatible with 50 kΩ typical pull-down.
8 LS input Low-side control logic input, active high, 3.3 V and 5 V compatible with 50 kΩ typical pull-down.
9 GND power_in Analog, digital, and power ground; connect to supply ground.
10 GL output Low-side gate drive output for an external N-channel MOSFET, referenced to GND.
11 PAD power_in Exposed thermal pad; connect to GND.

Key specifications

Parameter Value
Manufacturer Allegro MicroSystems, LLC
Package DFN-10(3x3)
Category Power Supply Chip
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC Functional Operating Range, outputs active VCC 8 15 V Operating, outputs active 5
VCC Functional Operating Range, no unsafe states VCC 0 15 V No unsafe states 5
VCC Quiescent Current ICCQ 3 mA RESETn = high, all gate drive outputs low 5
VCC Sleep Current ICCS 20 µA RESETn ≤ 300 mV, sleep mode 5
VCC Undervoltage VCCUV 6.3 6.65 7 V VCC falling 5
VCC Undervoltage Hysteresis VCCUVHys 0.2 0.5 V 5
Internal Logic Supply Regulator Voltage VDL 3 3.3 3.6 V 5
Bootstrap Diode Forward Voltage VfBOOT 0.7 1.3 1.7 V ID = 1 mA 5
Bootstrap Diode Forward Voltage VfBOOT 1.6 2 2.4 V ID = 100 mA 5
Turn-On Time, High-Side tr(HS) 105 231 ns CLOAD = 33 nF, 2 to 8 V, VC, VS = 12 V 5
Turn-On Time, Low-Side tr(LS) 105 231 ns CLOAD = 33 nF, 2 to 8 V, VCC = 12 V 5
Turn-Off Time, High-Side tf(HS) 46 133 ns CLOAD = 33 nF, 8 to 2 V, VC, VS = 12 V 5
Turn-Off Time, Low-Side tf(LS) 46 133 ns CLOAD = 33 nF, 8 to 2 V, VCC = 12 V 5
Pull-Up Peak Source Current, High-Side IPUPK(HS) -2.7 -1.5 A VC, VS = 12 V 5
Pull-Up Peak Source Current, Low-Side IPUPK(LS) -2.7 -1.5 A VCC = 12 V 5
Pull-Up On Resistance RDS(on)UP 1.2 3.4 Ω TJ = 25°C, IGH = -150 mA 5
Pull-Down Peak Sink Current IPDPK 3.1 5.2 A VCC = 12 V 5
Pull-Down On Resistance RDS(on)DN 0.4 1 Ω TJ = 25°C, IGL = -150 mA 5
GL Output Voltage Low VGLL 0.02 V -1 mA < IGL, 1 mA 5
GH Passive Pull-Down RGHPD 45 950 1700 kΩ VCC open circuit, VGH, VS = 0.1 V 5
GL Passive Pull-Down RGLPD 45 950 1700 kΩ VCC open circuit, VGL = 0.1 V 5
GH Active Pull-Down RGHPA 5.9 10 37.6 kΩ VC, VS > 3 V 5
GL Active Pull-Down RGLPA 5.9 10 37.6 kΩ VCC > 3 V 5
Turn-Off Propagation Delay tP(off) 17 32 ns Input change to unloaded gate output change 5
Turn-On Propagation Delay tP(on) 17 32 ns Input change to unloaded gate output change 5
Propagation Delay Matching (On to Off) ΔtOO 3 15 ns 5
Input Low Voltage VIL 1 V HS, LS, RESETn 5
Input High Voltage VIH 2 V HS, LS, RESETn 5
Input Hysteresis VIhys 200 300 600 mV All logic inputs 5
Input Pull-Down RPD 50 kΩ LS, HS, RESETn, 0 < VIN < 6 V 5
Supply Voltage VCC -0.3 18 V VCC, with respect to GND 2
Logic Input Terminals VIB -0.3 6 V HS, LS, RESETn 2
Low-Side Gate Drive Output Terminal VGL -0.3 18 V GL 2
Ambient Operating Temperature Range TA -40 105 °C Range G, limited by power dissipation 2
Maximum Continuous Junction Temperature TJ(max) 165 °C 2
Transient Junction Temperature TJt 180 °C Overtemperature event not exceeding 10 seconds; lifetime duration not exceeding 10 hours; guaranteed by design characterization 2
Storage Temperature Range Tstg -55 150 °C 2
Package Thermal Resistance RθJA 28 °C/W 4-layer PCB based on JEDEC standard 2
Package Thermal Resistance RθJA 38 °C/W 2-layer PCB with 3.8 in.2 copper each side 2
Package Thermal Resistance, junction to pad RθJP 2 °C/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin wettable flank and exposed thermal pad. This package is lead (Pb) free, with 100% matte-tin leadframe plating. 1

CAD (KiCad official)

  • Symbol: A89500GEJTR-T
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: DFN-10(3x3) (KiCad packages3D, STEP)
  • 3D model files: a89500gejtr-t-etched.step / a89500gejtr-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); a89500gejtr-t.step / a89500gejtr-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Allegro MicroSystems, LLC datasheet (13 pp, sha256 0d8c9a6705f8449e, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF