component
A4933KJPTR-T
Public Made by Adomby adom
Allegro MicroSystems, LLC Motor Driver ICs, LQFP-48-EP(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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Datasheet
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Contents
README
markdownA4933KJPTR-T
Allegro MicroSystems, LLC · Motor Driver ICs · LQFP-48-EP(7x7)
A4933KJPTR-T from Allegro MicroSystems, LLC, in a LQFP-48-EP(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection; connect to AGND. |
| 2 | RESET | input | Standby mode control input. |
| 3 | ESF | input | Enable Stop on Fault input. |
| 4 | FF2 | bidirectional | Fault Flag 2 and serial clock input. |
| 5 | FF1 | bidirectional | Fault Flag 1 and serial data output. |
| 6 | ALO | input | Control input for phase A low-side gate drive. |
| 7 | AHI | input | Control input for phase A high-side gate drive. |
| 8 | BHI | input | Control input for phase B high-side gate drive. |
| 9 | BLO | input | Control input for phase B low-side gate drive. |
| 10 | CLO | input | Control input for phase C low-side gate drive. |
| 11 | CHI | input | Control input for phase C high-side gate drive. |
| 12 | PWML | input | Low-side PWM input. |
| 13 | CCEN | input | Cross-conduction enable input. |
| 14 | PWMH | input | High-side PWM input. |
| 15 | COAST | input | Coast input. |
| 16 | CSOUT | output | Current sense amplifier output. |
| 17 | VDD | power_in | Logic supply input. |
| 18 | CSN | input | Current sense negative input. |
| 19 | CSP | input | Current sense positive input. |
| 20 | VDSTH | input | Fault threshold voltage input for the VDS monitor. |
| 21 | LSS | passive | Low-side source connection. |
| 22 | GLC | output | Low-side gate drive output for phase C. |
| 23 | AGND | power_in | Analog ground. |
| 24 | NC | unconnected | No internal connection; connect to AGND. |
| 25 | NC | unconnected | No internal connection; connect to AGND. |
| 26 | SC | passive | Motor connection for phase C. |
| 27 | GHC | output | High-side gate drive output for phase C. |
| 28 | CC | passive | Bootstrap capacitor connection for phase C. |
| 29 | GLB | output | Low-side gate drive output for phase B. |
| 30 | SB | passive | Motor connection for phase B. |
| 31 | GHB | output | High-side gate drive output for phase B. |
| 32 | CB | passive | Bootstrap capacitor connection for phase B. |
| 33 | GLA | output | Low-side gate drive output for phase A. |
| 34 | SA | passive | Motor connection for phase A. |
| 35 | NC | unconnected | No internal connection; connect to AGND. |
| 36 | NC | unconnected | No internal connection; connect to AGND. |
| 37 | NC | unconnected | No internal connection; connect to AGND. |
| 38 | GHA | output | High-side gate drive output for phase A. |
| 39 | CA | passive | Bootstrap capacitor connection for phase A. |
| 40 | VREG | power_out | Gate drive supply output. |
| 41 | VDRAIN | input | High-side drain voltage sense input. |
| 42 | NC | unconnected | No internal connection; connect to AGND. |
| 43 | CP2 | passive | Pump capacitor connection 2. |
| 44 | CP1 | passive | Pump capacitor connection 1. |
| 45 | PGND | power_in | Power ground. |
| 46 | VBB | power_in | Main power supply input. |
| 47 | AGND | power_in | Analog ground. |
| 48 | RDEAD | passive | Dead time setting input. |
| 49 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems, LLC |
| Package | LQFP-48-EP(7x7) |
| Category | Power Management ICs |
| Pins | 49 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Load Supply Voltage Functional Operating Range | VBB | 5.5 | 50 | V | Functional operating range | 4 | |
| Load Supply Voltage | VBB | -0.3 | 50 | V | With respect to AGND | 2 | |
| Logic Supply Voltage | VDD | -0.3 | 7 | V | With respect to AGND | 2 | |
| VREG | VREG | -0.3 | 16 | V | With respect to AGND | 2 | |
| CP1 and CP2 | CP1, CP2 | -0.3 | 16 | V | With respect to AGND | 2 | |
| Logic Inputs and Outputs | -0.3 | 6.5 | V | With respect to AGND | 2 | ||
| CSP and CSN | CSP, CSN | -4 | 6.5 | V | With respect to AGND | 2 | |
| LSS | LSS | -4 | 6.5 | V | With respect to AGND | 2 | |
| CSO and VDSTH | CSO, VDSTH | -0.3 | 6.5 | V | With respect to AGND | 2 | |
| SA, SB, and SC | SA, SB, SC | -5 | 55 | V | With respect to AGND | 2 | |
| RDEAD | RDEAD | -0.3 | 6.5 | V | With respect to AGND | 2 | |
| VDRAIN | VDRAIN | -5 | 55 | V | With respect to AGND | 2 | |
| GLA, GLB, and GLC | GLA, GLB, GLC | -5 | 16 | V | With respect to AGND | 2 | |
| Operating Temperature Range | TA | -40 | 150 | ºC | Range K | 2 | |
| Junction Temperature | TJ(max) | 150 | ºC | 2 | |||
| Transient Junction Temperature | TtJ | 175 | ºC | Overtemperature event not exceeding 10 s, lifetime duration not exceeding 10 h, guaranteed by design characterization | 2 | ||
| Storage Temperature Range | Tstg | -55 | 150 | ºC | 2 | ||
| Load Supply Quiescent Current | IBBQ | 10 | 14 | mA | RESET = high, outputs = low, VBB = 12 V | 4 | |
| Load Supply Quiescent Current (sleep) | IBBS | 10 | μA | RESET = low, Sleep mode, VBB = 12 V | 4 | ||
| Logic Supply Voltage | VDD | 3 | 5.5 | V | 4 | ||
| Logic Supply Quiescent Current | IDDQ | 4 | 6 | mA | RESET = high, outputs = low | 4 | |
| Logic Supply Quiescent Current (reset) | IDDS | 10 | μA | RESET = low | 4 | ||
| VREG Output Voltage | VREG | 9 | 13 | 13.8 | V | VBB > 9 V, IREG = 0 to 50 mA | 4 |
| VREG Output Voltage | VREG | 8.5 | V | 6 V < VBB ≤ 7.5 V, IREG = 0 to 17 mA | 4 | ||
| VREG Output Voltage | VREG | 7.5 | 9.5 | V | 5.5 V < VBB ≤ 6 V, IREG < 13 mA | 4 | |
| Bootstrap Diode Forward Voltage | VfBOOT | 0.4 | 0.7 | 1 | V | ID = 10 mA | 4 |
| Bootstrap Diode Forward Voltage | VfBOOT | 0.6 | 1 | 1.2 | V | ID = 100 mA | 4 |
| Bootstrap Diode Current Limit | IDBOOT | 500 | 1000 | 1500 | mA | 4 | |
| Pullup On Resistance | RDS(on)UP | 3 | 4 | 6 | Ω | TJ = 25°C, IGHx = -300 mA | 4 |
| Pullup On Resistance | RDS(on)UP | 5 | 6.5 | 8 | Ω | TJ = 150°C, IGHx = -300 mA | 4 |
| Pulldown On Resistance | RDS(on)DN | 1 | 1.5 | 2 | Ω | TJ = 25°C, IGLx = 300 mA | 4 |
| Pulldown On Resistance | RDS(on)DN | 1.5 | 2 | 3 | Ω | TJ = 150°C, IGLx = 300 mA | 4 |
| Turn-Off Propagation Delay | tP(off) | 60 | 90 | 130 | ns | Input change to unloaded gate output change | 4 |
| Turn-On Propagation Delay | tP(on) | 60 | 90 | 130 | ns | Input change to unloaded gate output change | 4 |
| Dead Time | tDEAD | 815 | 960 | 1110 | ns | RDEAD = 30 kΩ | 5 |
| FF1 and FF2 Fault Output | VFF(L) | 0.4 | V | IFF = 1 mA, fault not present | 5 | ||
| FF1 and FF2 Fault Output Leakage Current | IFF(H) | -1 | 1 | μA | VFF = 5 V, fault present | 5 | |
| RDEAD Input Low Voltage | VDEAD(L) | 0.2 | V | 5 | |||
| RDEAD Current | IDEAD | -200 | -70 | μA | RDEAD = GND | 5 | |
| Input Hysteresis | VINhys | 300 | 500 | mV | 5 | ||
| RESET Pulse Time | tRES | 0.1 | 3.5 | μs | 5 | ||
| FF2 Clock Low to Valid Data Delay | tDF | 100 | ns | 5 | |||
| FF2 Clock High Time | tHF | 500 | ns | 5 | |||
| Input Offset Voltage | VIOS | -10 | 10 | mV | CSP = CSN = 0 V | 5 | |
| Input Common Mode Range | CMR | -1.5 | 4 | V | CSP = CSN | 5 | |
| Closed Loop Gain | AVclos | 5 | V/V | 40 mV< VID < 175 mV, VCM in range | 6 | ||
| Output Current Sink | ICSsink | 1 | mA | VID = -400 mV, VCSOUT = 1.5 V | 6 | ||
| VREG Undervoltage Lockout Threshold (rising) | VREGUVon | 7.5 | 8 | 8.5 | V | VREG rising | 6 |
| VREG Undervoltage Lockout Threshold (falling) | VREGUVoff | 6.75 | 7.25 | 7.75 | V | VREG falling | 6 |
| Bootstrap Undervoltage Threshold | VBOOTUV | 59 | 69 | %VREG | Cx with respect to Sx | 6 | |
| VDD Undervoltage Turn-Off Threshold | VDDUV | 2.45 | 2.7 | 2.85 | V | VDD falling | 6 |
| VDSTH Input Range | VDSTH | 0.1 | 2 | V | 6 | ||
| Short-to-Ground Threshold Offset | VSTGO | -100 | 100 | mV | High-side on, VDSTH ≥ 1 V | 6 | |
| Short-to-Ground Threshold Offset | VSTGO | -150 | 150 | mV | High-side on, VDSTH < 1 V | 6 | |
| Overtemperature Fault Flag Threshold | TJF | 150 | 170 | ºC | Temperature increasing | 6 | |
| Junction-to-ambient Thermal Resistance (4-layer PCB) | RθJA | 23 | ºC/W | 4-layer PCB based on JEDEC standard | 2 | ||
| Junction-to-ambient Thermal Resistance (2-layer PCB) | RθJA | 44 | ºC/W | 2-layer PCB with 3 in.2 of copper area each side | 2 | ||
| Junction-to-exposed-pad Thermal Resistance | RθJP | 2 | ºC/W | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | lead (Pb) free with 100% matte tin leadframe plating. Description (continued) | 2 |
CAD (KiCad official)
- Symbol:
A4933KJPTR-T - Footprint:
Package_QFP:LQFP-48-1EP_7x7mm_P0.5mm_EP3.6x3.6mm - 3D model: LQFP-48-EP(7x7) (KiCad packages3D, STEP)
- 3D model files:
a4933kjptr-t-etched.step/a4933kjptr-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);a4933kjptr-t.step/a4933kjptr-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Allegro MicroSystems, LLC datasheet (25 pp, sha256
6e13e125f72c0af8, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).