# A1171EEWLT-P

**Allegro MicroSystems, LLC** · Magnetic Sensors · DFN-6-EP(1.5x2)

A1171EEWLT-P from Allegro MicroSystems, LLC, in a DFN-6-EP(1.5x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VOUTPS | output | Push-pull output providing selectable omnipolar activation or unipolar south pole activation, with output current limited to 1 mA source and -1 mA sink in the absolute maximum ratings. |
| 2 | VOUTPN | output | Push-pull output providing selectable inverted omnipolar activation or unipolar north pole activation, with output current limited to 1 mA source and -1 mA sink in the absolute maximum ratings. |
| 3 | SELECT | input | Sets the activation mode for the VOUTPx outputs: omnipolar when tied to VDD or left floating, unipolar when grounded; the SELECT current is 2 µA maximum and its voltage must be between 0 and 1/3 VDD for low or 2/3 VDD to VDD for high. |
| 4 | GND | power_in | Ground connection for the device. |
| 5 | NC | unconnected | No connection. |
| 6 | VDD | power_in | Connects the power supply to the chip, operating from 1.65 to 3.5 V with absolute maximum supply voltage of 5 V. |
| 7 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Allegro MicroSystems, LLC |
| Package | DFN-6-EP(1.5x2) |
| Category | Sensors |
| Pins | 7 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VDD |  |  | 5 | V |  | 2 |
| Reverse Supply Voltage | VRDD | -0.3 |  |  | V |  | 2 |
| Output Off Voltage | VOUTPx |  |  | 5 | V |  | 2 |
| Reverse Output Voltage | VROUTPx | -0.3 |  |  | V |  | 2 |
| Output Current (Source) | IOUTPx(Source) |  |  | 1 | mA |  | 2 |
| Output Current (Sink) | IOUTPx(Sink) | -1 |  |  | mA |  | 2 |
| Operating Ambient Temperature | TA | -40 |  | 85 | ºC | Range E | 2 |
| Maximum Junction Temperature | TJ(max) |  |  | 165 | ºC |  | 2 |
| Storage Temperature | Tstg | -65 |  | 170 | ºC |  | 2 |
| Supply Voltage Range (operating) | VDD | 1.65 |  | 3.5 | V | Operating, TA = 25°C | 3 |
| Supply Voltage Range (operating, full ambient temperature) | VDD | 1.8 |  |  | V | Operating, over full ambient temperature range | 3 |
| Output Voltage (low, NMOS on) | VOUT(SAT) |  | 100 | 300 | mV | NMOS on, ISINK = 1 mA, VDD = 2.75 V | 3 |
| Period | tPERIOD |  | 50 | 100 | ms |  | 3 |
| Chopping Frequency | fC |  | 200 |  | kHz |  | 3 |
| Supply Slew Rate | SR | 20 |  |  | V/ms |  | 3 |
| Supply Current (enabled) | IDD(EN) |  |  | 2 | mA | Device in awake mode (enabled) | 3 |
| Supply Current (disabled) | IDD(DIS) |  |  | 8 | µA | Device in sleep mode (disabled) | 3 |
| Average Supply Current | IDD(AV) |  | 3.5 | 8 | µA | VDD = 1.8 V, TA = 25°C | 3 |
| Average Supply Current | IDD(AV) |  | 7.1 | 12 | µA | VDD = 3.5 V, TA = 25°C | 3 |
| SELECT Current | ISELECT | 0 | 1 | 2 | µA |  | 3 |
| Operate Point (south) | BOPS |  | 32 | 55 | G | valid at 1.8 V ≤ VDD ≤ 3.5 V and TA = 25°C | 3 |
| Operate Point (north) | BOPN | -55 | -32 |  | G | valid at 1.8 V ≤ VDD ≤ 3.5 V and TA = 25°C | 3 |
| Release Point (south) | BRPS | 6 | 26 |  | G | valid at 1.8 V ≤ VDD ≤ 3.5 V and TA = 25°C | 3 |
| Release Point (north) | BRPN |  | -26 | -6 | G | valid at 1.8 V ≤ VDD ≤ 3.5 V and TA = 25°C | 3 |
| Hysteresis | BHYS |  | 6 |  | G | valid at 1.8 V ≤ VDD ≤ 3.5 V and TA = 25°C | 3 |
| Package Thermal Resistance (2-layer PCB) | RθJA |  | 125 |  | ºC/W | 2-layer PCB, with 0.23 in.2 copper area each side | 4 |
| Package Thermal Resistance (4-layer PCB) | RθJA |  | 64 |  | ºC/W | 4-layer PCB, based on JEDEC standard | 4 |

## CAD (KiCad official)

- Symbol: `A1171EEWLT-P`
- Footprint: `Package_DFN_QFN:DFN-6-1EP_2x1.6mm_P0.5mm_EP1.15x1.3mm`
- 3D model: DFN-6-EP(1.5x2), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `a1171eewlt-p-etched.step` / `a1171eewlt-p-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `a1171eewlt-p.step` / `a1171eewlt-p.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Allegro MicroSystems, LLC datasheet](docs/a1171eewlt-p-datasheet.pdf) (10 pp, sha256 `cbe81bcf0079817d`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/a1171eewlt-p-datasheet.pdf)