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8305AGILF

RENESAS · Clock Buffers, Drivers · TSSOP-16

8305AGILF from RENESAS, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Power supply ground.
2 OE input Output enable pin with internal pull-up: when LOW the outputs are in the active state, and when HIGH the outputs are in the high impedance state, with LVCMOS/LVTTL interface levels.
3 VDD power_in Core power supply.
4 CLK_EN input Synchronized clock enable with internal pull-up: when HIGH the clock outputs follow the clock input, and when LOW the clock outputs are forced LOW, with LVCMOS/LVTTL interface levels.
5 CLK input Non-inverting differential clock input with internal pull-down, used when CLK_SEL is HIGH.
6 nCLK input Inverting differential clock input with internal pull-up and pull-down, defaulting to VDD/2 when left floating.
7 CLK_SEL input Clock select input with internal pull-up: when HIGH it selects the CLK/nCLK differential input, and when LOW it selects the LVCMOS_CLK input, with LVCMOS/LVTTL interface levels.
8 LVCMOS_CLK input Single-ended LVCMOS/LVTTL clock input with internal pull-down, used when CLK_SEL is LOW.
9 GND power_in Power supply ground.
10 Q3 output LVCMOS/LVTTL clock output 3.
11 VDDO power_in Output supply voltage for Q0 to Q3.
12 Q2 output LVCMOS/LVTTL clock output 2.
13 GND power_in Power supply ground.
14 Q1 output LVCMOS/LVTTL clock output 1.
15 VDDO power_in Output supply voltage for Q0 to Q3.
16 Q0 output LVCMOS/LVTTL clock output 0.

Key specifications

Parameter Value
Manufacturer RENESAS
Package TSSOP-16
Category Clock and Timing
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input high voltage VIH 2 V OE, CLK_SEL, CLK_EN 4
Input high current IIH 5 µA OE, CLK_SEL, CLK_EN, VDD = 3.465V 4
Maximum output frequency fMAX 350 MHz 1
Output skew tsk(o) 40 ps 5
Supply voltage VDD 4.6 V 4
Inputs voltage VI -0.5 V Maximum is VDD + 0.5V 4
Outputs voltage VO -0.5 V Maximum is VDDO + 0.5V 4
Storage temperature TSTG -65 150 °C 4
Ambient operating temperature TA -40 85 °C 1
Package thermal impedance, junction to ambient θJA 89 °C/W 0 lfpm, multi-layer PCB 12

CAD (KiCad official)

  • Symbol: 8305AGILF
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: 8305agilf-etched.step / 8305agilf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 8305agilf.step / 8305agilf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (17 pp, sha256 d908743cb8e9fa41, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF