74hc165d: hero from the plain model
74hc165d: one-pass backfill (hero rebuilt in-pass (inputs changed))
74hc165d: one-pass backfill (re-etched)
74hc165d: model_3d back to the etched GLB (the publish pointed it at a hero GLB it never pushed)
74hc165d 0.1.1: component block filled (mpn, maker, package, datasheet, pins, symbol/footprint/lbr declared, license, L…
74hc165d: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
74hc165d: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
74hc165d: laser-etched CAD + chip hero (factory 2.0.0 backfill)
74hc165d: hero re-rendered with iso-front (part number upright)
74hc165d: laser-etched CAD + chip hero (factory 2.0.0 backfill)
74hc165d: stamp component.logic (74HC165) from component-ocean
74hc165d: backfill missing artifacts (etch)
Initial commit: component/74hc165d