# 30BQ060

**SMC Sangdest Microelectronicstronic Nanjing** · Schottky Diodes · SMC(DO-214AB)

30BQ060 from SMC Sangdest Microelectronicstronic Nanjing, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SMC Sangdest Microelectronicstronic Nanjing |
| Package | SMC(DO-214AB) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Repetitive Reverse Voltage | VRRM |  |  | 60 | V |  | 1 |
| Working Peak Reverse Voltage | VRWM |  |  | 60 | V |  | 1 |
| DC Blocking Voltage | VR |  |  | 60 | V |  | 1 |
| Average Rectified Forward Current | IF (AV) |  |  | 3 | A | 50% duty cycle @TC =123°C, rectangular wave form | 1 |
| Peak One Cycle Non-Repetitive Surge Current | IFSM |  |  | 156 | A | 8.3 ms, half Sine pulse, TC =25°C | 1 |
| Forward Voltage Drop | VF1 |  | 0.55 | 0.66 | V | @ 3 A, Pulse, TJ = 25 °C | 1 |
| Forward Voltage Drop | VF1 |  | 0.58 | 0.76 | V | @ 6 A, Pulse, TJ = 25 °C | 1 |
| Forward Voltage Drop | VF2 |  | 0.45 | 0.58 | V | @ 3 A, Pulse, TJ = 125 °C | 1 |
| Forward Voltage Drop | VF2 |  | 0.52 | 0.66 | V | @ 6 A, Pulse, TJ = 125°C | 1 |
| Reverse Current | IR1 |  | 0.03 | 0.5 | mA | @VR = Rated VR, Pulse, TJ = 25 °C | 1 |
| Reverse Current | IR2 |  | 12 | 20 | mA | @VR = Rated VR, Pulse, TJ = 100 °C | 1 |
| Junction Capacitance | CT |  | 130 | 180 | pF | @VR = 5V, TC = 25 °C fSIG = 1MHz | 1 |
| Voltage Rate of Change | dv/dt |  |  | 10000 | V/s |  | 1 |
| Series Inductance | LS |  | 3 |  | nH | Measured lead to lead 5 mm from package body | 1 |
| Junction Temperature | TJ | -55 |  | 150 | C |  | 2 |
| Storage Temperature | Tstg | -55 |  | 150 | C |  | 2 |
| Typical Thermal Resistance Junction to Lead | RJL |  | 12 |  | C/W |  | 2 |
| Typical Thermal Resistance Junction to Case | RJA |  | 46 |  | °C/W | DC operation | 2 |

## CAD (KiCad official)

- Symbol: `30BQ060`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files: `30bq060-etched.step` / `30bq060-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `30bq060.step` / `30bq060.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SMC Sangdest Microelectronicstronic Nanjing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588893552469790720) (4 pp, sha256 `0be62539180cec55`, retrieved 2026-10-14, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/30bq060-datasheet.pdf)