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30BQ060

Public Made by Adom

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SMC Sangdest Microelectronicstronic Nanjing Schottky Diodes, SMC(DO-214AB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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30bq060-hero.glb 30bq060: hero GLB from the etched model (keeps the MPN mark) · Ray 11d ago
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30BQ060

SMC Sangdest Microelectronicstronic Nanjing · Schottky Diodes · SMC(DO-214AB)

30BQ060 from SMC Sangdest Microelectronicstronic Nanjing, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer SMC Sangdest Microelectronicstronic Nanjing
Package SMC(DO-214AB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 60 V 1
Working Peak Reverse Voltage VRWM 60 V 1
DC Blocking Voltage VR 60 V 1
Average Rectified Forward Current IF (AV) 3 A 50% duty cycle @TC =123°C, rectangular wave form 1
Peak One Cycle Non-Repetitive Surge Current IFSM 156 A 8.3 ms, half Sine pulse, TC =25°C 1
Forward Voltage Drop VF1 0.55 0.66 V @ 3 A, Pulse, TJ = 25 °C 1
Forward Voltage Drop VF1 0.58 0.76 V @ 6 A, Pulse, TJ = 25 °C 1
Forward Voltage Drop VF2 0.45 0.58 V @ 3 A, Pulse, TJ = 125 °C 1
Forward Voltage Drop VF2 0.52 0.66 V @ 6 A, Pulse, TJ = 125°C 1
Reverse Current IR1 0.03 0.5 mA @VR = Rated VR, Pulse, TJ = 25 °C 1
Reverse Current IR2 12 20 mA @VR = Rated VR, Pulse, TJ = 100 °C 1
Junction Capacitance CT 130 180 pF @VR = 5V, TC = 25 °C fSIG = 1MHz 1
Voltage Rate of Change dv/dt 10000 V/s 1
Series Inductance LS 3 nH Measured lead to lead 5 mm from package body 1
Junction Temperature TJ -55 150 C 2
Storage Temperature Tstg -55 150 C 2
Typical Thermal Resistance Junction to Lead RJL 12 C/W 2
Typical Thermal Resistance Junction to Case RJA 46 °C/W DC operation 2

CAD (KiCad official)

  • Symbol: 30BQ060
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: 30bq060-etched.step / 30bq060-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 30bq060.step / 30bq060.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC Sangdest Microelectronicstronic Nanjing datasheet (4 pp, sha256 0be62539180cec55, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF