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25AA160B-I

Microchip Tech · Pre-ordered Chips · SOIC-8

25AA160B-I from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS input Chip Select input: a low level selects the device, a high level deselects it and forces Standby mode, and SO goes high-impedance when deselected.
2 SO tri_state Serial Data Output: data is shifted out after the falling edge of the serial clock, and the pin is high-impedance when the device is deselected or held.
3 WP input Write-Protect pin: with WPEN set, WP low disables writes to the nonvolatile STATUS register bits, and WP high allows all functions to operate normally.
4 VSS power_in Ground.
5 SI input Serial Data Input: receives instructions, addresses and data, latched on the rising edge of the serial clock.
6 SCK input Serial Clock input that synchronizes communication, with SI latched on the rising edge and SO updated after the falling edge (max clock 10 MHz).
7 HOLD input Hold input: pulled low (while SCK is low) to pause serial communication without resetting the sequence, and must be held high when not in use.
8 VCC power_in Supply voltage, 1.8V to 5.5V for the 25AA160B (absolute maximum 7.0V).

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) VCC 7 V 2
Voltage on all inputs and outputs w.r.t. VSS -0.6 V -0.6V to VCC +1.0V 2
Storage temperature -65 150 °C 2
Ambient temperature under bias -40 125 °C 2
ESD protection on all pins 4 kV 2
Supply voltage (Industrial) VCC 1.8 5.5 V Industrial (I): TAMB = -40°C to +85°C 2
High-level input voltage VIH1 2 V VCC ≥ 2.7V (Note); max printed as VCC +1 2
Low-level input voltage VIL1 -0.3 0.8 V VCC ≥ 2.7V (Note) 2
Low-level input voltage VIL2 -0.3 V VCC < 2.7V (Note); max printed as 0.2 VCC 2
Low-level output voltage VOL 0.4 V IOL = 2.1 mA 2
Low-level output voltage VOL 0.2 V IOL = 1.0 mA, VCC < 2.5V 2
Input leakage current ILI -1 1 μA CS = VCC, VIN = VSS TO VCC 2
Output leakage current ILO -1 1 μA CS = VCC, VOUT = VSS TO VCC 2
Internal capacitance (all inputs and outputs) CINT 7 pF TAMB = 25°C, CLK = 1.0 MHz, VCC = 5.0V (Note) 2
Read operating current ICC Read 6 mA VCC = 5.5V; FCLK = 10.0 MHz; SO = Open 2
Read operating current ICC Read 2.5 mA VCC = 2.5V; FCLK = 5.0 MHz; SO = Open 2
Write operating current ICC Write 3 mA VCC = 5.5V 2
Standby current ICCS 5 μA CS = VCC = 5.5V, Inputs tied to VCC or VSS, TAMB = -40°C TO +125°C 2
Standby current ICCS 1 μA CS = VCC = 2.5V, Inputs tied to VCC or VSS, TAMB = -40°C TO +85°C 2
Clock frequency FCLK 10 MHz 4.5V ≤ VCC ≤ 5.5V 3
Clock frequency FCLK 5 MHz 2.5V ≤ VCC < 4.5V 3
Clock frequency FCLK 3 MHz 1.8V ≤ VCC < 2.5V 3
CS setup time TCSS 50 ns 4.5V ≤ VCC ≤ 5.5V 3
CS setup time TCSS 100 ns 2.5V ≤ VCC < 4.5V 3
CS setup time TCSS 150 ns 1.8V ≤ VCC < 2.5V 3
CS hold time TCSH 100 ns 4.5V ≤ VCC ≤ 5.5V 3
CS hold time TCSH 200 ns 2.5V ≤ VCC < 4.5V 3
CS hold time TCSH 250 ns 1.8V ≤ VCC < 2.5V 3
Data setup time Tsu 10 ns 4.5V ≤ VCC ≤ 5.5V 3
Data setup time Tsu 20 ns 2.5V ≤ VCC < 4.5V 3
Data setup time Tsu 30 ns 1.8V ≤ VCC < 2.5V 3
Data hold time THD 20 ns 4.5V ≤ VCC ≤ 5.5V 3
Data hold time THD 40 ns 2.5V ≤ VCC < 4.5V 3
Data hold time THD 50 ns 1.8V ≤ VCC < 2.5V 3
Clock high time THI 50 ns 4.5V ≤ VCC ≤ 5.5V 3
Clock high time THI 100 ns 2.5V ≤ VCC < 4.5V 3
Clock high time THI 150 ns 1.8V ≤ VCC < 2.5V 3
Clock low time TLO 50 ns 4.5V ≤ VCC ≤ 5.5V 3
Clock low time TLO 100 ns 2.5V ≤ VCC < 4.5V 3
Clock low time TLO 150 ns 1.8V ≤ VCC < 2.5V 3
Output valid from clock low TV 50 ns 4.5V ≤ VCC ≤ 5.5V 3
Output valid from clock low TV 100 ns 2.5V ≤ VCC < 4.5V 3
Output valid from clock low TV 160 ns 1.8V ≤ VCC < 2.5V 3
Output disable time TDIS 40 ns 4.5V ≤ VCC ≤ 5.5V (Note 1) 3
Output disable time TDIS 80 ns 2.5V ≤ VCC ≤ 4.5V (Note 1) 3
Output disable time TDIS 160 ns 1.8V ≤ VCC ≤ 2.5V (Note 1) 3
HOLD setup time THS 20 ns 4.5V ≤ VCC ≤ 5.5V 3
HOLD setup time THS 40 ns 2.5V ≤ VCC < 4.5V 3
HOLD setup time THS 80 ns 1.8V ≤ VCC < 2.5V 3
HOLD hold time THH 20 ns 4.5V ≤ VCC ≤ 5.5V 4
HOLD hold time THH 40 ns 2.5V ≤ VCC < 4.5V 4
HOLD hold time THH 80 ns 1.8V ≤ VCC < 2.5V 4
HOLD low to output high-Z THZ 30 ns 4.5V ≤ VCC ≤ 5.5V (Note 1) 4
HOLD low to output high-Z THZ 60 ns 2.5V ≤ VCC < 4.5V (Note 1) 4
HOLD low to output high-Z THZ 160 ns 1.8V ≤ VCC < 2.5V (Note 1) 4
HOLD high to output valid THV 30 ns 4.5V ≤ VCC ≤ 5.5V 4
HOLD high to output valid THV 60 ns 2.5V ≤ VCC < 4.5V 4
HOLD high to output valid THV 160 ns 1.8V ≤ VCC < 2.5V 4
Internal write cycle time TWC 5 ms (NOTE 3) 4

CAD (KiCad official)

  • Symbol: 25AA160B-I
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: 25aa160b-i-etched.step / 25aa160b-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 25aa160b-i.step / 25aa160b-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (26 pp, sha256 c603a0d9ffe61e4b, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF