component
220N03MD-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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220N03MD-VB
VBsemi Elec · MOSFETs · SO-8
220N03MD-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of N-channel MOSFET 1 (VDS 20 V, ID 7.1 A at TA = 25 °C). |
| 2 | G1 | input | Gate of N-channel MOSFET 1 (VGS ±12 V max, threshold 0.6 to 1.5 V at 250 µA). |
| 3 | S2 | passive | Source of N-channel MOSFET 2 (VDS 20 V, ID 7.1 A at TA = 25 °C). |
| 4 | G2 | input | Gate of N-channel MOSFET 2 (VGS ±12 V max, threshold 0.6 to 1.5 V at 250 µA). |
| 5 | D2 | passive | Drain of N-channel MOSFET 2, tied to pin 6 (VDS 20 V, pulsed IDM 40 A). |
| 6 | D2 | passive | Drain of N-channel MOSFET 2, tied to pin 5 (VDS 20 V, pulsed IDM 40 A). |
| 7 | D1 | passive | Drain of N-channel MOSFET 1, tied to pin 8 (VDS 20 V, pulsed IDM 40 A). |
| 8 | D1 | passive | Drain of N-channel MOSFET 1, tied to pin 7 (VDS 20 V, pulsed IDM 40 A). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SO-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate Threshold Voltage | VGS(th) | 0.6 | 1.5 | V | VDS = VGS, ID = 250 µA | 2 | |
| Gate-Body Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 12 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 20 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 5 | µA | VDS = 20 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | 20 | A | VDS ≥ 5 V, VGS = 4.5 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.019 | Ω | VGS = 4.5 V, ID = 7.1 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.026 | Ω | VGS = 2.5 V, ID = 6.0 A | 2 | ||
| Diode Forward Voltage | VSD | 1.2 | V | IS = 1.7 A, VGS = 0 V | 2 | ||
| Gate Resistance | Rg | 1.6 | 2.7 | Ω | f = 1 MHz | 2 | |
| Drain-Source Voltage | VDS | 20 | V | TA = 25 °C | 1 | ||
| Gate-Source Voltage | VGS | -12 | 12 | V | TA = 25 °C | 1 | |
| Continuous Drain Current | ID | 7.1 | A | TJ = 150 °C, TA = 25 °C | 1 | ||
| Continuous Drain Current | ID | 5.7 | A | TJ = 150 °C, TA = 70 °C | 1 | ||
| Pulsed Drain Current | IDM | 40 | A | 10 µs pulse width | 1 | ||
| Continuous Source Current (Diode Conduction) | IS | 1.7 | A | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 2 | W | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.3 | W | TA = 70 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 62.5 | °C/W | Surface mounted on FR4 board, t ≤ 10 s | 1 | ||
| Forward Transconductance | gfs | 27 | S | VDS = 10 V, ID = 7.1 A | 2 | ||
| Total Gate Charge | Qg | 9.5 | nC | VDS = 10 V, VGS = 4.5 V, ID = 7.1 A | 2 | ||
| Gate-Source Charge | Qgs | 1.5 | nC | VDS = 10 V, VGS = 4.5 V, ID = 7.1 A | 2 | ||
| Gate-Drain Charge | Qgd | 2.5 | nC | VDS = 10 V, VGS = 4.5 V, ID = 7.1 A | 2 | ||
| Turn-On Delay Time | td(on) | 10 | ns | VDD = 10 V, RL = 10 Ω, ID ≅ 1 A, VGEN = 4.5 V, Rg = 10 Ω | 2 | ||
| Rise Time | tr | 15 | ns | VDD = 10 V, RL = 10 Ω, ID ≅ 1 A, VGEN = 4.5 V, Rg = 10 Ω | 2 | ||
| Turn-Off Delay Time | td(off) | 38 | ns | VDD = 10 V, RL = 10 Ω, ID ≅ 1 A, VGEN = 4.5 V, Rg = 10 Ω | 2 | ||
| Fall Time | tf | 25 | ns | VDD = 10 V, RL = 10 Ω, ID ≅ 1 A, VGEN = 4.5 V, Rg = 10 Ω | 2 | ||
| Source-Drain Reverse Recovery Time | trr | 26 | ns | IF = 1.7 A, dI/dt = 100 A/µs | 2 |
CAD (KiCad official)
- Symbol:
220N03MD-VB - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
220n03md-vb-etched.step/220n03md-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);220n03md-vb.step/220n03md-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (7 pp, sha256
362c8707f177ecb1, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# 220N03MD-VB
**VBsemi Elec** · MOSFETs · SO-8
220N03MD-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of N-channel MOSFET 1 (VDS 20 V, ID 7.1 A at TA = 25 °C). |
| 2 | G1 | input | Gate of N-channel MOSFET 1 (VGS ±12 V max, threshold 0.6 to 1.5 V at 250 µA). |
| 3 | S2 | passive | Source of N-channel MOSFET 2 (VDS 20 V, ID 7.1 A at TA = 25 °C). |
| 4 | G2 | input | Gate of N-channel MOSFET 2 (VGS ±12 V max, threshold 0.6 to 1.5 V at 250 µA). |
| 5 | D2 | passive | Drain of N-channel MOSFET 2, tied to pin 6 (VDS 20 V, pulsed IDM 40 A). |
| 6 | D2 | passive | Drain of N-channel MOSFET 2, tied to pin 5 (VDS 20 V, pulsed IDM 40 A). |
| 7 | D1 | passive | Drain of N-channel MOSFET 1, tied to pin 8 (VDS 20 V, pulsed IDM 40 A). |
| 8 | D1 | passive | Drain of N-channel MOSFET 1, tied to pin 7 (VDS 20 V, pulsed IDM 40 A). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SO-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate Threshold Voltage | VGS(th) | 0.6 | | 1.5 | V | VDS = VGS, ID = 250 µA | 2 |
| Gate-Body Leakage | IGSS | -100 | | 100 | nA | VDS = 0 V, VGS = ± 12 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VDS = 20 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 5 | µA | VDS = 20 V, VGS = 0 V, TJ = 55 °C | 2 |
| On-State Drain Current | ID(on) | 20 | | | A | VDS ≥ 5 V, VGS = 4.5 V | 2 |
| Drain-Source On-State Resistance | RDS(on) | | | 0.019 | Ω | VGS = 4.5 V, ID = 7.1 A | 2 |
| Drain-Source On-State Resistance | RDS(on) | | | 0.026 | Ω | VGS = 2.5 V, ID = 6.0 A | 2 |
| Diode Forward Voltage | VSD | | | 1.2 | V | IS = 1.7 A, VGS = 0 V | 2 |
| Gate Resistance | Rg | | 1.6 | 2.7 | Ω | f = 1 MHz | 2 |
| Drain-Source Voltage | VDS | | | 20 | V | TA = 25 °C | 1 |
| Gate-Source Voltage | VGS | -12 | | 12 | V | TA = 25 °C | 1 |
| Continuous Drain Current | ID | | | 7.1 | A | TJ = 150 °C, TA = 25 °C | 1 |
| Continuous Drain Current | ID | | | 5.7 | A | TJ = 150 °C, TA = 70 °C | 1 |
| Pulsed Drain Current | IDM | | | 40 | A | 10 µs pulse width | 1 |
| Continuous Source Current (Diode Conduction) | IS | | | 1.7 | A | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 2 | W | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 1.3 | W | TA = 70 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Maximum Junction-to-Ambient | RthJA | | | 62.5 | °C/W | Surface mounted on FR4 board, t ≤ 10 s | 1 |
| Forward Transconductance | gfs | | 27 | | S | VDS = 10 V, ID = 7.1 A | 2 |
| Total Gate Charge | Qg | | 9.5 | | nC | VDS = 10 V, VGS = 4.5 V, ID = 7.1 A | 2 |
| Gate-Source Charge | Qgs | | 1.5 | | nC | VDS = 10 V, VGS = 4.5 V, ID = 7.1 A | 2 |
| Gate-Drain Charge | Qgd | | 2.5 | | nC | VDS = 10 V, VGS = 4.5 V, ID = 7.1 A | 2 |
| Turn-On Delay Time | td(on) | | 10 | | ns | VDD = 10 V, RL = 10 Ω, ID ≅ 1 A, VGEN = 4.5 V, Rg = 10 Ω | 2 |
| Rise Time | tr | | 15 | | ns | VDD = 10 V, RL = 10 Ω, ID ≅ 1 A, VGEN = 4.5 V, Rg = 10 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 38 | | ns | VDD = 10 V, RL = 10 Ω, ID ≅ 1 A, VGEN = 4.5 V, Rg = 10 Ω | 2 |
| Fall Time | tf | | 25 | | ns | VDD = 10 V, RL = 10 Ω, ID ≅ 1 A, VGEN = 4.5 V, Rg = 10 Ω | 2 |
| Source-Drain Reverse Recovery Time | trr | | 26 | | ns | IF = 1.7 A, dI/dt = 100 A/µs | 2 |
## CAD (KiCad official)
- Symbol: `220N03MD-VB`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files: `220n03md-vb-etched.step` / `220n03md-vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `220n03md-vb.step` / `220n03md-vb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](docs/220n03md-vb-datasheet.pdf) (7 pp, sha256 `362c8707f177ecb1`, retrieved 2026-10-31, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/220n03md-vb-datasheet.pdf)