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π130M31

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2Pai Semi Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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π130M31

2Pai Semi · Digital Isolators · SOIC-16

π130M31 from 2Pai Semi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Supply Voltage for Isolator Side 1, operating from 3.0 V to 5.5 V per the datasheet overview.
2 GND1 power_in Ground 1, the ground reference for Isolator Side 1.
3 VIA input Logic Input A on Side 1; high-level input must be at least 0.7VDDx1 and low-level input at most 0.3VDDx1.
4 VIB input Logic Input B on Side 1; high-level input must be at least 0.7VDDx1 and low-level input at most 0.3VDDx1.
5 VIC input Logic Input C on Side 1; high-level input must be at least 0.7VDDx1 and low-level input at most 0.3VDDx1.
6 NC unconnected No connect.
7 NC unconnected No connect.
8 GND1 power_in Ground 1, the ground reference for Isolator Side 1.
9 GND2 power_in Ground 2, the ground reference for Isolator Side 2.
10 NC unconnected No connect for π130M3X; the EN2 output-enable function applies only to the π130M6X variant.
11 NC unconnected No connect.
12 VOC output Logic Output C on Side 2; recommended IOH of -6 mA and IOL of 6 mA, with absolute maximum average output current of ±10 mA per pin.
13 VOB output Logic Output B on Side 2; recommended IOH of -6 mA and IOL of 6 mA, with absolute maximum average output current of ±10 mA per pin.
14 VOA output Logic Output A on Side 2; recommended IOH of -6 mA and IOL of 6 mA, with absolute maximum average output current of ±10 mA per pin.
15 GND2 power_in Ground 2, the ground reference for Isolator Side 2.
16 VDD2 power_in Supply Voltage for Isolator Side 2, operating from 3.0 V to 5.5 V per the datasheet overview.

Key specifications

Parameter Value
Manufacturer 2Pai Semi
Package SOIC-16
Category Signal Isolation Devices
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDDx 3 5.5 V 3
Low Level Input Signal Voltage VIL 0 V 3
High Level Output Current IOH -6 mA 3
Low Level Output Current IOL 6 mA 3
Maximum Data Rate 0 10 Mbps 3
Junction Temperature TJ -40 150 °C 3
Ambient Operating Temperature TA -40 125 °C 3
Supply Voltages (VDD1-GND1, VDD2-GND2) -0.5 7 V 3
Input Voltages (VIA, VIB) -0.5 V 3
Output Voltages (VOA, VOB) -0.5 V 3
Average Output Current per Pin, Side 1 IO1 -10 10 mA 3
Average Output Current per Pin, Side 2 IO2 -10 10 mA 3
Common-Mode Transients Immunity -150 150 kV/µs 3
Storage Temperature (TST) Range TST -65 150 °C 3
Ambient Operating Temperature (TA) Range TA -40 125 °C 3
Minimum Pulse Width PW 100 ns Within pulse width distortion (PWD) limit 4
Maximum Data Rate 10 Mbps Within PWD limit 4
Propagation Delay Time tpHL, tpLH 5.5 8 12.5 ns 50% input to 50% output, 50% @ 5VDC supply 4
Propagation Delay Time tpHL, tpLH 6.5 9 13.5 ns @ 3.3VDC supply 4
Pulse Width Distortion PWD 0 0.3 0.8 ns /tpHL - tpLH/, @ 5VDC supply 4
Part to Part Propagation Delay Skew tPSK 1 ns Same temperature, load and voltage, @ 5VDC supply 4
Channel to Channel Propagation Delay Skew tCSK 0 1 ns @ 5VDC supply 4
Channel to Channel Propagation Delay Skew tCSK 0 0.8 ns @ 3.3VDC supply 4
Output Signal Rise/Fall Time tr/tf 1.5 ns 10% to 90% signal, terminated 50 4
ESD (HBM - Human Body Model) ESD -8 8 kV All pins 5
Low Level Output Voltage VOL 0 0.1 V 20 µA output current 5
Low Level Output Voltage VOL 0.1 0.2 V 2 mA output current 5
Input Current per Signal Channel IIN -10 0.5 10 µA 0 V ≤ Signal voltage ≤ VDDX1 5
VDDx1 Undervoltage Rising Threshold VDDxUV+ 2.45 2.65 2.9 V 5
VDDx1 Undervoltage Falling Threshold VDDxUV- 2.3 2.5 2.75 V 5
π130Mxx Quiescent Supply Current, IDD1 @5VDC IDD1 (Q) 125 156 203 µA @ 5VDC supply, 0V input signal, CL = 0 pF 5
π130Mxx Quiescent Supply Current, IDD2 @5VDC IDD2 (Q) 1249 1562 2030 µA @ 5VDC supply, 0V input signal, CL = 0 pF 5
π130Mxx Quiescent Supply Current, IDD1 @5VDC IDD1 (Q) 310 387 503 µA @ 5VDC supply, 5V input signal, CL = 0 pF 5
π130Mxx Quiescent Supply Current, IDD2 @5VDC IDD2 (Q) 1181 1477 1920 µA @ 5VDC supply, 5V input signal, CL = 0 pF 5
π130Mxx Quiescent Supply Current, IDD1 @3.3VDC IDD1 (Q) 123 154 200 µA @ 3.3VDC supply, 0V input signal, CL = 0 pF 5
π130Mxx Quiescent Supply Current, IDD2 @3.3VDC IDD2 (Q) 1235 1544 2007 µA @ 3.3VDC supply, 0V input signal, CL = 0 pF 5
π130Mxx Quiescent Supply Current, IDD1 @3.3VDC IDD1 (Q) 228 285 371 µA @ 3.3VDC supply, 3.3V input signal, CL = 0 pF 5
π130Mxx Quiescent Supply Current, IDD2 @3.3VDC IDD2 (Q) 1134 1418 1843 µA @ 3.3VDC supply, 3.3V input signal, CL = 0 pF 6
Total Supply Current vs. Data Throughput, IDD1 @5VDC IDD1 0.26 0.39 mA 150 Kbps, CL = 0 pF, @ 5VDC supply 6
Total Supply Current vs. Data Throughput, IDD1 @5VDC IDD1 0.28 0.42 mA 1 Mbps, CL = 0 pF, @ 5VDC supply 6
Total Supply Current vs. Data Throughput, IDD1 @5VDC IDD1 0.44 0.66 mA 10 Mbps, CL = 0 pF, @ 5VDC supply 6
Total Supply Current vs. Data Throughput, IDD2 @5VDC IDD2 1.52 2.28 mA 150 Kbps, CL = 0 pF, @ 5VDC supply 6
Total Supply Current vs. Data Throughput, IDD2 @5VDC IDD2 1.63 2.45 mA 1 Mbps, CL = 0 pF, @ 5VDC supply 6
Total Supply Current vs. Data Throughput, IDD2 @5VDC IDD2 2.82 4.22 mA 10 Mbps, CL = 0 pF, @ 5VDC supply 6
Total Supply Current vs. Data Throughput, IDD1 @3.3VDC IDD1 0.21 0.32 mA 150 Kbps, CL = 0 pF, @ 3.3VDC supply 6
Total Supply Current vs. Data Throughput, IDD1 @3.3VDC IDD1 0.23 0.35 mA 1 Mbps, CL = 0 pF, @ 3.3VDC supply 6
Total Supply Current vs. Data Throughput, IDD1 @3.3VDC IDD1 0.34 0.51 mA 10 Mbps, CL = 0 pF, @ 3.3VDC supply 6
Total Supply Current vs. Data Throughput, IDD2 @3.3VDC IDD2 1.49 2.23 mA 150 Kbps, CL = 0 pF, @ 3.3VDC supply 6
Total Supply Current vs. Data Throughput, IDD2 @3.3VDC IDD2 1.55 2.33 mA 1 Mbps, CL = 0 pF, @ 3.3VDC supply 6
Total Supply Current vs. Data Throughput, IDD2 @3.3VDC IDD2 2.29 3.43 mA 10 Mbps, CL = 0 pF, @ 3.3VDC supply 6
Rated Dielectric Insulation Voltage 3000 V rms 1-minute duration (π13xM3x) 7
Maximum Working Insulation Voltage VIORM 707 V peak DIN V VDE V 0884-10, basic insulation (π13xM3x) 8
Total Power Dissipation at 25°C PS 1.56 W Safety limiting value (π13xM3x) 8
Maximum Junction Temperature TS 150 °C Safety limiting value (π13xM3x) 8
IC Junction to Ambient Thermal Resistance θJA 100 °C/W Thermocouple located at center of package underside (π13xM3x, SOIC-16) 7
Common-Mode Transient Immunity CMTI 75 kV/µs VIN = VDDx2 or 0V, VCM = 1000 V 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pC In accordance with DIN V VDE V 0884-10, each π130M3X/π131M3X is proof tested by applying an insulation test voltage ≥ 1326 V peak for 1 sec (partial discharge detection limit = 5 pC); each π130M6X/π13 7

CAD (KiCad official)

  • Symbol: π130M31
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: 130m31-etched.step / 130m31-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 130m31.step / 130m31.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: 2Pai Semi datasheet (16 pp, sha256 829d753562181a6e, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF