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π130M31
Public Made by Adomby adom
2Pai Semi Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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Contents
README
markdownπ130M31
2Pai Semi · Digital Isolators · SOIC-16
π130M31 from 2Pai Semi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | Supply Voltage for Isolator Side 1, operating from 3.0 V to 5.5 V per the datasheet overview. |
| 2 | GND1 | power_in | Ground 1, the ground reference for Isolator Side 1. |
| 3 | VIA | input | Logic Input A on Side 1; high-level input must be at least 0.7VDDx1 and low-level input at most 0.3VDDx1. |
| 4 | VIB | input | Logic Input B on Side 1; high-level input must be at least 0.7VDDx1 and low-level input at most 0.3VDDx1. |
| 5 | VIC | input | Logic Input C on Side 1; high-level input must be at least 0.7VDDx1 and low-level input at most 0.3VDDx1. |
| 6 | NC | unconnected | No connect. |
| 7 | NC | unconnected | No connect. |
| 8 | GND1 | power_in | Ground 1, the ground reference for Isolator Side 1. |
| 9 | GND2 | power_in | Ground 2, the ground reference for Isolator Side 2. |
| 10 | NC | unconnected | No connect for π130M3X; the EN2 output-enable function applies only to the π130M6X variant. |
| 11 | NC | unconnected | No connect. |
| 12 | VOC | output | Logic Output C on Side 2; recommended IOH of -6 mA and IOL of 6 mA, with absolute maximum average output current of ±10 mA per pin. |
| 13 | VOB | output | Logic Output B on Side 2; recommended IOH of -6 mA and IOL of 6 mA, with absolute maximum average output current of ±10 mA per pin. |
| 14 | VOA | output | Logic Output A on Side 2; recommended IOH of -6 mA and IOL of 6 mA, with absolute maximum average output current of ±10 mA per pin. |
| 15 | GND2 | power_in | Ground 2, the ground reference for Isolator Side 2. |
| 16 | VDD2 | power_in | Supply Voltage for Isolator Side 2, operating from 3.0 V to 5.5 V per the datasheet overview. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | 2Pai Semi |
| Package | SOIC-16 |
| Category | Signal Isolation Devices |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VDDx | 3 | 5.5 | V | 3 | ||
| Low Level Input Signal Voltage | VIL | 0 | V | 3 | |||
| High Level Output Current | IOH | -6 | mA | 3 | |||
| Low Level Output Current | IOL | 6 | mA | 3 | |||
| Maximum Data Rate | 0 | 10 | Mbps | 3 | |||
| Junction Temperature | TJ | -40 | 150 | °C | 3 | ||
| Ambient Operating Temperature | TA | -40 | 125 | °C | 3 | ||
| Supply Voltages (VDD1-GND1, VDD2-GND2) | -0.5 | 7 | V | 3 | |||
| Input Voltages (VIA, VIB) | -0.5 | V | 3 | ||||
| Output Voltages (VOA, VOB) | -0.5 | V | 3 | ||||
| Average Output Current per Pin, Side 1 | IO1 | -10 | 10 | mA | 3 | ||
| Average Output Current per Pin, Side 2 | IO2 | -10 | 10 | mA | 3 | ||
| Common-Mode Transients Immunity | -150 | 150 | kV/µs | 3 | |||
| Storage Temperature (TST) Range | TST | -65 | 150 | °C | 3 | ||
| Ambient Operating Temperature (TA) Range | TA | -40 | 125 | °C | 3 | ||
| Minimum Pulse Width | PW | 100 | ns | Within pulse width distortion (PWD) limit | 4 | ||
| Maximum Data Rate | 10 | Mbps | Within PWD limit | 4 | |||
| Propagation Delay Time | tpHL, tpLH | 5.5 | 8 | 12.5 | ns | 50% input to 50% output, 50% @ 5VDC supply | 4 |
| Propagation Delay Time | tpHL, tpLH | 6.5 | 9 | 13.5 | ns | @ 3.3VDC supply | 4 |
| Pulse Width Distortion | PWD | 0 | 0.3 | 0.8 | ns | /tpHL - tpLH/, @ 5VDC supply | 4 |
| Part to Part Propagation Delay Skew | tPSK | 1 | ns | Same temperature, load and voltage, @ 5VDC supply | 4 | ||
| Channel to Channel Propagation Delay Skew | tCSK | 0 | 1 | ns | @ 5VDC supply | 4 | |
| Channel to Channel Propagation Delay Skew | tCSK | 0 | 0.8 | ns | @ 3.3VDC supply | 4 | |
| Output Signal Rise/Fall Time | tr/tf | 1.5 | ns | 10% to 90% signal, terminated 50 | 4 | ||
| ESD (HBM - Human Body Model) | ESD | -8 | 8 | kV | All pins | 5 | |
| Low Level Output Voltage | VOL | 0 | 0.1 | V | 20 µA output current | 5 | |
| Low Level Output Voltage | VOL | 0.1 | 0.2 | V | 2 mA output current | 5 | |
| Input Current per Signal Channel | IIN | -10 | 0.5 | 10 | µA | 0 V ≤ Signal voltage ≤ VDDX1 | 5 |
| VDDx1 Undervoltage Rising Threshold | VDDxUV+ | 2.45 | 2.65 | 2.9 | V | 5 | |
| VDDx1 Undervoltage Falling Threshold | VDDxUV- | 2.3 | 2.5 | 2.75 | V | 5 | |
| π130Mxx Quiescent Supply Current, IDD1 @5VDC | IDD1 (Q) | 125 | 156 | 203 | µA | @ 5VDC supply, 0V input signal, CL = 0 pF | 5 |
| π130Mxx Quiescent Supply Current, IDD2 @5VDC | IDD2 (Q) | 1249 | 1562 | 2030 | µA | @ 5VDC supply, 0V input signal, CL = 0 pF | 5 |
| π130Mxx Quiescent Supply Current, IDD1 @5VDC | IDD1 (Q) | 310 | 387 | 503 | µA | @ 5VDC supply, 5V input signal, CL = 0 pF | 5 |
| π130Mxx Quiescent Supply Current, IDD2 @5VDC | IDD2 (Q) | 1181 | 1477 | 1920 | µA | @ 5VDC supply, 5V input signal, CL = 0 pF | 5 |
| π130Mxx Quiescent Supply Current, IDD1 @3.3VDC | IDD1 (Q) | 123 | 154 | 200 | µA | @ 3.3VDC supply, 0V input signal, CL = 0 pF | 5 |
| π130Mxx Quiescent Supply Current, IDD2 @3.3VDC | IDD2 (Q) | 1235 | 1544 | 2007 | µA | @ 3.3VDC supply, 0V input signal, CL = 0 pF | 5 |
| π130Mxx Quiescent Supply Current, IDD1 @3.3VDC | IDD1 (Q) | 228 | 285 | 371 | µA | @ 3.3VDC supply, 3.3V input signal, CL = 0 pF | 5 |
| π130Mxx Quiescent Supply Current, IDD2 @3.3VDC | IDD2 (Q) | 1134 | 1418 | 1843 | µA | @ 3.3VDC supply, 3.3V input signal, CL = 0 pF | 6 |
| Total Supply Current vs. Data Throughput, IDD1 @5VDC | IDD1 | 0.26 | 0.39 | mA | 150 Kbps, CL = 0 pF, @ 5VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD1 @5VDC | IDD1 | 0.28 | 0.42 | mA | 1 Mbps, CL = 0 pF, @ 5VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD1 @5VDC | IDD1 | 0.44 | 0.66 | mA | 10 Mbps, CL = 0 pF, @ 5VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD2 @5VDC | IDD2 | 1.52 | 2.28 | mA | 150 Kbps, CL = 0 pF, @ 5VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD2 @5VDC | IDD2 | 1.63 | 2.45 | mA | 1 Mbps, CL = 0 pF, @ 5VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD2 @5VDC | IDD2 | 2.82 | 4.22 | mA | 10 Mbps, CL = 0 pF, @ 5VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD1 @3.3VDC | IDD1 | 0.21 | 0.32 | mA | 150 Kbps, CL = 0 pF, @ 3.3VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD1 @3.3VDC | IDD1 | 0.23 | 0.35 | mA | 1 Mbps, CL = 0 pF, @ 3.3VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD1 @3.3VDC | IDD1 | 0.34 | 0.51 | mA | 10 Mbps, CL = 0 pF, @ 3.3VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD2 @3.3VDC | IDD2 | 1.49 | 2.23 | mA | 150 Kbps, CL = 0 pF, @ 3.3VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD2 @3.3VDC | IDD2 | 1.55 | 2.33 | mA | 1 Mbps, CL = 0 pF, @ 3.3VDC supply | 6 | |
| Total Supply Current vs. Data Throughput, IDD2 @3.3VDC | IDD2 | 2.29 | 3.43 | mA | 10 Mbps, CL = 0 pF, @ 3.3VDC supply | 6 | |
| Rated Dielectric Insulation Voltage | 3000 | V rms | 1-minute duration (π13xM3x) | 7 | |||
| Maximum Working Insulation Voltage | VIORM | 707 | V peak | DIN V VDE V 0884-10, basic insulation (π13xM3x) | 8 | ||
| Total Power Dissipation at 25°C | PS | 1.56 | W | Safety limiting value (π13xM3x) | 8 | ||
| Maximum Junction Temperature | TS | 150 | °C | Safety limiting value (π13xM3x) | 8 | ||
| IC Junction to Ambient Thermal Resistance | θJA | 100 | °C/W | Thermocouple located at center of package underside (π13xM3x, SOIC-16) | 7 | ||
| Common-Mode Transient Immunity | CMTI | 75 | kV/µs | VIN = VDDx2 or 0V, VCM = 1000 V | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pC | In accordance with DIN V VDE V 0884-10, each π130M3X/π131M3X is proof tested by applying an insulation test voltage ≥ 1326 V peak for 1 sec (partial discharge detection limit = 5 pC); each π130M6X/π13 | 7 |
CAD (KiCad official)
- Symbol:
π130M31 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
130m31-etched.step/130m31-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);130m31.step/130m31.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: 2Pai Semi datasheet (16 pp, sha256
829d753562181a6e, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).