Solar MPPT Power System - kicad/mppt-power-system.kicad_dru

by TylerK

A 30 W solar battery charger with regulated 5 V and 3.3 V rails: an STM32G031 running perturb & observe MPPT and a CC/CV charge state machine, steering a TI LM5175 4-switch buck-boost through a single analog control input. Four-layer KiCad board, schematic and PCB generated from Python, with an electrothermal simulation run against the published board file.

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TylerK Publish 2.0.0 efbad62 1mo ago

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(version 1)

# Adom InstaPCB 4-layer design rules (standard process)
# 
# Min trace width: 0.09 mm (3.54 mil) - 1 oz copper, multilayer
# Min spacing: 0.09 mm (3.54 mil) - 1 oz copper, multilayer, different nets; 3 mil acceptable in BGA fan-outs
# Min drill: 0.15 mm (5.91 mil)
# Min via: 0.15 mm hole / 0.25 mm pad
# Annular ring: via 0.1 mm, pad 0.18 mm
# Copper to board edge: 0.2 mm
# Hole to hole: 0.2 mm
# Drill range: 0.15 mm to 6.3 mm
# Board thickness options: 1.6 mm
# Copper weight options: 1 oz
# 
# BGA pad diameter >= 0.25 mm. BGA pad to trace clearance min 0.09 mm. Vias can be placed within BGA pads using filled and plated-over vias.
# 
# Sources:
# - adom/fusion-bridge addin/AdomBridge/resources/dru/Adom-InstaPCB-4-Layer.edru (read 2026-09-03)

(rule "min-track-width"
  (constraint track_width (min 0.09mm))
  (layer "*.Cu")
  (condition "A.type == 'track'"))

(rule "min-clearance"
  (constraint clearance (min 0.09mm))
  (condition "A.type == 'track' && B.type == 'track'"))

(rule "min-hole"
  (constraint hole (min 0.15mm))
  (condition "A.type == 'pad' || A.type == 'via'"))

(rule "min-via-diameter"
  (constraint via_diameter (min 0.25mm))
  (condition "A.type == 'via'"))

(rule "min-edge-clearance"
  (constraint edge_clearance (min 0.2mm))
  (condition "A.type == 'track'"))