XR21V1412IL32TR-F from MaxLinear, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND	power_in	Power-supply common (ground).
2	LOWPOWER	output	Low-power status output. Asserted while it is not safe to draw the current requested in the Configuration Descriptor bMaxPower; sampled at power-up / USB bus reset with an external 10 K pull-up (active-HIGH in suspend) or 3.3 K pull-down (active-LOW in suspend) to set its polarity.
3	GND	power_in	Power-supply common (ground).
4	VCC	power_in	+3.3 V power supply.
5	TXA	output	UART Channel A transmit data output.
6	RXA	input	UART Channel A receive data input. Internal pull-up is present and is NOT disabled during suspend mode.
7	GPIOA5/RTSA#/RS485A	bidirectional	Channel A GPIO, active-low Request-To-Send output, or automatic RS-485 half-duplex control. Internal pull-up disabled during suspend; add an external pull-up when used as an input.
8	GPIOA4/CTSA#	bidirectional	Channel A GPIO or active-low Clear-To-Send input used with automatic RTS/CTS hardware flow control. Internal pull-up disabled during suspend.
9	GPIOA3/DTRA#	bidirectional	Channel A GPIO or active-low Data-Terminal-Ready output used with automatic DTR/DSR hardware flow control. Internal pull-up disabled during suspend.
10	GPIOA2/DSRA#	bidirectional	Channel A GPIO or active-low Data-Set-Ready input used with automatic DTR/DSR hardware flow control. Internal pull-up disabled during suspend.
11	GPIOA1/CDA#	bidirectional	Channel A GPIO or active-low Carrier-Detect input. Internal pull-up disabled during suspend.
12	GPIOA0/RIA#/RWKA#	bidirectional	Channel A GPIO, active-low Ring-Indicator input, or Remote Wakeup input (a HIGH-to-LOW transition on this pin during USB suspend signals a remote-wakeup to the host). Internal pull-up disabled during suspend.
13	VCC	power_in	+3.3 V power supply.
14	GND	power_in	Power-supply common (ground).
15	TXB	output	UART Channel B transmit data output.
16	RXB	input	UART Channel B receive data input. Internal pull-up is present and is NOT disabled during suspend mode.
17	GPIOB5/RTSB#/RS485B	bidirectional	Channel B GPIO, active-low Request-To-Send output, or automatic RS-485 half-duplex control. Internal pull-up disabled during suspend.
18	GPIOB4/CTSB#	bidirectional	Channel B GPIO or active-low Clear-To-Send input used with automatic RTS/CTS hardware flow control. Internal pull-up disabled during suspend.
19	GPIOB3/DTRB#	bidirectional	Channel B GPIO or active-low Data-Terminal-Ready output used with automatic DTR/DSR hardware flow control. Internal pull-up disabled during suspend.
20	GPIOB2/DSRB#	bidirectional	Channel B GPIO or active-low Data-Set-Ready input used with automatic DTR/DSR hardware flow control. Internal pull-up disabled during suspend.
21	GPIOB1/CDB#	bidirectional	Channel B GPIO or active-low Carrier-Detect input. Internal pull-up disabled during suspend.
22	GPIOB0/RIB#/RWKB#	bidirectional	Channel B GPIO, active-low Ring-Indicator input, or Remote Wakeup input for Channel B. Internal pull-up disabled during suspend.
23	GND	power_in	Power-supply common (ground).
24	VCC	power_in	+3.3 V power supply.
25	SDA	bidirectional	I2C-controller open-drain data line for the optional external EEPROM used to override the USB Vendor ID / Device ID and other descriptors. Requires an external 4.7 - 10 kΩ pull-up. When no EEPROM is fitted, SDA is strapped with SCL to select Remote-Wakeup and Power modes (see Table 2).
26	SCL	bidirectional	I2C-controller open-drain serial clock for the optional external EEPROM. Requires an external 4.7 - 10 kΩ pull-up. When no EEPROM is fitted, SCL is strapped with SDA to select Remote-Wakeup and Power modes (see Table 2).
27	GND	power_in	Power-supply common (ground).
28	GND	power_in	Power-supply common (ground).
29	USBD-	bidirectional	USB port differential data minus. ±5 kV HBM ESD protected.
30	USBD+	bidirectional	USB port differential data plus. Contains an internal 1.5 kΩ pull-up so the device enumerates as a full-speed USB device. ±5 kV HBM ESD protected.
31	VCC	power_in	+3.3 V power supply.
32	VCC	power_in	+3.3 V power supply.
33	GND (Thermal Pad)	power_in	Exposed center pad on the back of the QFN package; must be soldered to the PCB GND plane. The datasheet specifies a solder-mask-defined thermal land approximately the same size as the pad, with the solder-mask opening set back at least 0.0025 inch inside the pad edge.

Key specifications

Parameter	Value
Manufacturer	MaxLinear
Package	QFN-32-EP(5x5)
Category	Interface
Pins	33

Ordering variants

Same part, different packaging or reel option.

XR21V1412IL32-F
XR21V1412IL32TR-F

CAD (KiCad official)

Symbol: XR21V1412IL32TR-F
Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: MaxLinear datasheet (33 pp, sha256 2657bc3f2b9ad1ea, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF