component
XPD930B
Public Unreviewedby Ray
Shenzhen Fuman Battery Management, TSSOP-20. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownXPD930B
Shenzhen Fuman · Battery Management · TSSOP-20
XPD930B from Shenzhen Fuman, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VPWR | power_in | Chip supply / VBUS input source from the front-stage AC-DC or DC-DC output. Recommended 10 µF decoupling to GND; operating range 3.6-21 V (UVLO rising 3.3 V, falling 2.9 V). |
| 2 | VPWR | power_in | Chip supply input, internally tied to pin 1. Both pins carry the front-stage supply current into the die. |
| 3 | OPTO | output | Opto-coupler drive output that closes the primary-side feedback loop of the AC-DC front stage, letting the chip adjust the VBUS rail dynamically for PD/PPS. |
| 4 | VFB | input | System voltage regulation feedback pin, tied to the system voltage feedback divider (recommended R_FB1 = 100 kΩ, R_FB2 = 33 kΩ). |
| 5 | IREF | passive | CC loop compensation node; connect a compensation network (typ. R = 10 kΩ, C = 10 nF) to GND. Leave floating if the constant-current function is not used. |
| 6 | GND | power_in | Device ground reference for analog, digital and power sections. |
| 7 | CSN | input | Current-sense negative input across the external 10 mΩ shunt R_S1. Tie to GND if the constant-current function is not used; must not be left floating. |
| 8 | CSP | input | Current-sense positive input across the external 10 mΩ shunt R_S1. Tie to GND if the constant-current function is not used; must not be left floating. |
| 9 | LINK | bidirectional | XPD-LINK™ shared bus terminal for inter-chip communication in multi-port chargers; pull the shared bus to GND via a 10 kΩ resistor. May be left floating if not used. |
| 10 | DIS | output | Gate-drive output for the external discharge NMOS (bleeder). R_ON of internal N1 is 40 Ω typ (100 Ω max). |
| 11 | AISN | input | Cascade current-sense negative input, used only when cascading with a non-XPD-series part. Connect to GND when not used. |
| 12 | AISP | input | Cascade current-sense positive input, used only when cascading with a non-XPD-series part. Connect to GND when not used. |
| 13 | NC | unconnected | No internal connection; leave floating. |
| 14 | NC | unconnected | No internal connection; leave floating. |
| 15 | CC1 | bidirectional | USB Type-C configuration channel 1: performs DFP Rp advertisement (3 A / 1.5 A) and BMC PD communication. 24 V abs-max, OVP protected. |
| 16 | DP | bidirectional | USB Type-C D+ data line, used for BC1.2, Apple 2.4 A, QC and HVDCP handshakes. 24 V abs-max, OVP protected. |
| 17 | DM | bidirectional | USB Type-C D− data line, used for BC1.2, Apple 2.4 A, QC/FCP/SCP/AFC handshakes. 24 V abs-max, OVP protected. |
| 18 | CC2 | bidirectional | USB Type-C configuration channel 2: performs DFP Rp advertisement (3 A / 1.5 A) and BMC PD communication. 24 V abs-max, OVP protected. |
| 19 | VBUS | power_out | USB Type-C VBUS output from the integrated 10 mΩ high-side switch; supports up to 20 V/3.25 A (65 W). Requires a 2.2-10 µF cap to GND; pins 19 and 20 must be tied together. |
| 20 | VBUS | power_out | USB Type-C VBUS output, internally tied to pin 19; carries the output current of the internal switch MOSFET. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Fuman |
| Package | TSSOP-20 |
| Category | PMIC |
| Pins | 20 |
Ordering variants
Same part, different packaging or reel option.
XPD930AXPD930BXPD930D30AXPD930D30XPD930DP30XPD930D45XPD930DP45XPD930D60XPD930DP60XPD930D65XPD930DP65XPD930D6545XPD930QXXXXX
CAD (KiCad official)
- Symbol:
XPD930B - Footprint:
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm - 3D model: TSSOP-20 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen Fuman datasheet (19 pp, sha256
48a8084240110c9d, retrieved 2026-08-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).