component
XP4302
Public Unreviewedby Ray
Shenzhen Fuman Battery Management, ESOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
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markdownXP4302
Shenzhen Fuman · Battery Management · ESOP-8
XP4302 from Shenzhen Fuman, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Charger power input. Recommended operating range 4.6V to 5.5V (typ. 5V); VIN UVLO ~4.6V rising / 4.4V falling; VIN OVP ~5.6V; absolute max 8V. Bypass with >=10uF (20uF recommended). |
| 2 | LED1 | output | Charge status indicator 1 (open-drain style LED driver). ON while charging (trickle/CC/CV), OFF when charging is complete. Blinks on OTP or NTC out-of-range fault. May be left floating if unused. |
| 3 | LED2 | output | Charge status indicator 2. OFF while charging, ON when charge is complete (full). May be left floating if unused. |
| 4 | VSET | input | Battery full-charge (regulation) voltage set pin. Default connection: tie to GND for the standard 4.2V full-charge voltage. |
| 5 | NTC | input | Battery temperature sense input. Internal ~70k pull-up to VIN forms a divider with an external 100k NTC (25 degC) in parallel with 300k; charging halts when VNTC > 70%*VIN or < 30%*VIN. Tie to a 75k resistor to GND to disable NTC; must not be left floating. |
| 6 | BAT | power_out | Battery connection / voltage feedback input. Charges single-cell Li-ion to 4.2V (VBAT_FULL), 3.95V recharge threshold, 104%*VBAT OVP. Bypass with >=10uF. |
| 7 | SEN | input | Charge current sense input. Connects to the high side of an external ~5 mOhm sense resistor between the buck inductor/output cap node and BAT for closed-loop current regulation (2A CC). |
| 8 | SW | output | Synchronous buck switch node. Connect to a 10uH inductor to the SEN/output capacitor node. Internal high-side (~60 mOhm) and low-side (~70 mOhm) MOSFETs, 750 kHz fixed switching frequency. |
| 9 | GND (Power Pad) | power_in | Exposed thermal/power ground pad on the bottom of the ESOP-8 package. Must be soldered to the PCB ground plane for proper electrical return and thermal dissipation (RthetaJA ~42 degC/W). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Fuman |
| Package | ESOP-8 |
| Category | PMIC |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
XP4302 - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: ESOP-8 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen Fuman datasheet (10 pp, sha256
515ad9c2d6efcde2, retrieved 2026-08-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).