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Name Last commit message Last updated
docs xp4302: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
package.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray 1mo ago
page.json Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout") · Ray 11d ago
README.md xp4302: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 17d ago
xp4302-etched.fit.json xp4302: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
xp4302-etched.glb xp4302: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
xp4302-etched.step xp4302: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 4d ago
xp4302.glb fix footprint: SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm -> SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm (3d refresh; body regenerated from the footprint F.Fab outline) · Ray 1mo ago
xp4302.kicad_mod Publish 0.1.0 · Ray 1mo ago
xp4302.kicad_sym Publish 0.1.0 · Ray 1mo ago
xp4302.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect and oval pad as a SQUARE EAGLE smd; this carries the real pad shape across (0 -> 8 rounded pads) and stops dropping geometry drawn on KiCad User.N layers. Attributes, connects, pads and the pin-1 marker are gated against decreasing and are unchanged. · Ray 1mo ago
xp4302.step fix footprint: SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm -> SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm (3d refresh; body regenerated from the footprint F.Fab outline) · Ray 1mo ago

XP4302

Shenzhen Fuman · Battery Management · ESOP-8

XP4302 from Shenzhen Fuman, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Charger power input. Recommended operating range 4.6V to 5.5V (typ. 5V); VIN UVLO ~4.6V rising / 4.4V falling; VIN OVP ~5.6V; absolute max 8V. Bypass with >=10uF (20uF recommended).
2 LED1 output Charge status indicator 1 (open-drain style LED driver). ON while charging (trickle/CC/CV), OFF when charging is complete. Blinks on OTP or NTC out-of-range fault. May be left floating if unused.
3 LED2 output Charge status indicator 2. OFF while charging, ON when charge is complete (full). May be left floating if unused.
4 VSET input Battery full-charge (regulation) voltage set pin. Default connection: tie to GND for the standard 4.2V full-charge voltage.
5 NTC input Battery temperature sense input. Internal ~70k pull-up to VIN forms a divider with an external 100k NTC (25 degC) in parallel with 300k; charging halts when VNTC > 70%*VIN or < 30%*VIN. Tie to a 75k resistor to GND to disable NTC; must not be left floating.
6 BAT power_out Battery connection / voltage feedback input. Charges single-cell Li-ion to 4.2V (VBAT_FULL), 3.95V recharge threshold, 104%*VBAT OVP. Bypass with >=10uF.
7 SEN input Charge current sense input. Connects to the high side of an external ~5 mOhm sense resistor between the buck inductor/output cap node and BAT for closed-loop current regulation (2A CC).
8 SW output Synchronous buck switch node. Connect to a 10uH inductor to the SEN/output capacitor node. Internal high-side (~60 mOhm) and low-side (~70 mOhm) MOSFETs, 750 kHz fixed switching frequency.
9 GND (Power Pad) power_in Exposed thermal/power ground pad on the bottom of the ESOP-8 package. Must be soldered to the PCB ground plane for proper electrical return and thermal dissipation (RthetaJA ~42 degC/W).

Key specifications

Parameter Value
Manufacturer Shenzhen Fuman
Package ESOP-8
Category PMIC
Pins 9

CAD (KiCad official)

  • Symbol: XP4302
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: xp4302-etched.step / xp4302-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); xp4302.step / xp4302.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen Fuman datasheet (10 pp, sha256 515ad9c2d6efcde2, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF