XL7005A from XLSEMI, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VIN	power_in	Supply Voltage Input Pin. Operates from 5V to 80V DC. Bypass VIN to GND with a suitably large capacitor (typ. 33uF/100V) to eliminate input noise.
2	SW	output	Power Switch Output Pin. Switch node that supplies power to the output inductor; connects to the external Schottky freewheeling diode and inductor. Absolute max VSW: -0.3V to VIN.
3	FB	input	Feedback Pin. Senses the output voltage through an external resistor divider and regulates it to a threshold of 1.25V (typ). Vout = 1.25 * (1 + R2/R1).
4	EN	input	Enable Pin (TTL). Drive EN low (<0.8V typ) to turn ON the regulator; drive high (>1.6V typ) to turn it OFF. Floating defaults to low (ON). Input leakage ~1uA (ON) / ~6uA (OFF).
5	GND	power_in	Ground Pin. Must be placed outside the Schottky-to-Cout ground return path to prevent switching current spikes from injecting noise. Tie together with pins 6-8 and the exposed pad.
6	GND	power_in	Ground Pin. Must be placed outside the Schottky-to-Cout ground return path to prevent switching current spikes from injecting noise. Tie together with pins 5,7,8 and the exposed pad.
7	GND	power_in	Ground Pin. Must be placed outside the Schottky-to-Cout ground return path to prevent switching current spikes from injecting noise. Tie together with pins 5,6,8 and the exposed pad.
8	GND	power_in	Ground Pin. Must be placed outside the Schottky-to-Cout ground return path to prevent switching current spikes from injecting noise. Tie together with pins 5-7 and the exposed pad.
9	EP	power_in	Exposed thermal PAD on the underside of the SOP8-EP package. Electrically GND. Solder to the PCB ground plane for thermal dissipation (RJA = 60 degC/W).

Key specifications

Parameter	Value
Manufacturer	XLSEMI
Package	SOIC-8-EP
Category	PMIC
Pins	9

Ordering variants

Same part, different packaging or reel option.

XL7005A

CAD (KiCad official)

Symbol: XL7005A
Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
3D model: SOIC-8-EP (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`xl7005a.step`	193 KB	You want the bare part, or you mark your own boards.
`xl7005a-etched.step`	1.2 MB	You want the part with `XL7005A` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 305 faces against 63 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: XLSEMI datasheet (10 pp, sha256 6a632bb19da8e766, retrieved 2026-08-17, tier: manufacturer)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF