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XL1509-12
Public Unreviewedby Ray
UMW DC-DC Converters, SOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownXL1509-12
UMW · DC-DC Converters · SOP-8
XL1509-12 from UMW, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Supply Voltage Input Pin. Operates from 4.5V to 40V DC (absolute max 45V). Bypass VIN to GND with a suitably large capacitor to eliminate input noise. |
| 2 | OUTPUT | output | Power Switch Output Pin (SW). Internal power transistor switch node that supplies power to the output LC filter. Rated for 2A continuous, internal current limit ~4A. Absolute max -0.3V to VIN. |
| 3 | FEEDBACK | input | Feedback Pin (FB). Senses the output voltage through an external resistor divider and regulates it. Internal feedback threshold is 1.23V. For the fixed 12V variant the internal divider sets VOUT = 12V (typ, range 11.52V-12.48V). |
| 4 | ON/OFF | input | Enable/Shutdown pin with hysteresis. Drive low (<0.8V) to turn the regulator ON, drive high (>1.4V) to turn it OFF. TTL-compatible; floating defaults to low (ON). Input leakage ~5 uA. |
| 5 | GND | power_in | Ground pin. Route outside the Schottky-diode-to-output-capacitor ground path to avoid coupling switching current spikes into the IC. Tie all GND pins (5,6,7,8) together at the ground plane. |
| 6 | GND | power_in | Ground pin. Route outside the Schottky-diode-to-output-capacitor ground path to avoid coupling switching current spikes into the IC. Tie all GND pins (5,6,7,8) together at the ground plane. |
| 7 | GND | power_in | Ground pin. Route outside the Schottky-diode-to-output-capacitor ground path to avoid coupling switching current spikes into the IC. Tie all GND pins (5,6,7,8) together at the ground plane. |
| 8 | GND | power_in | Ground pin. Route outside the Schottky-diode-to-output-capacitor ground path to avoid coupling switching current spikes into the IC. Tie all GND pins (5,6,7,8) together at the ground plane. On ESOP-8 these pins are also connected to the exposed thermal pad for heatsinking. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | SOP-8 |
| Category | PMIC |
| Pins | 8 |
Ordering variants
Same part, different packaging or reel option.
XL1509-12E1
CAD (KiCad official)
- Symbol:
XL1509-12 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
xl1509-12.step |
122 KB | You want the bare part, or you mark your own boards. |
xl1509-12-etched.step |
1.7 MB | You want the part with XL1509-12 already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 435 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: UMW datasheet (15 pp, sha256
bd5713838034a224, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).