W25X40CLSSIG from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	/CS	input	Chip Select input; when high the device is deselected and DO (IO1) and IO0/IO1 outputs are high impedance, and /CS must track VCC at power-up (a pull-up resistor may be used).
2	DO (IO1)	bidirectional	Serial data output for standard SPI, read on the falling edge of CLK, and IO1 for Dual SPI instructions; it is high impedance when the device is deselected or in /HOLD.
3	/WP	input	Active-low Write Protect input that, together with the SRP and TB/BP2-BP0 status register bits, can hardware-protect the status register or part of the memory array.
4	GND	power_in	Ground reference for the device.
5	DI (IO0)	bidirectional	Serial data input for standard SPI, sampled on the rising edge of CLK, and IO0 for Dual SPI instructions.
6	CLK	input	Serial clock input that provides the timing for serial input and output operations, up to 104 MHz per the AC characteristics.
7	/HOLD	input	Hold input that pauses device operation while /CS is low; when driven low, DO goes high impedance and DI and CLK are ignored.
8	VCC	power_in	Power supply, specified at 2.3 V to 3.6 V in the operating ranges.

Key specifications

Parameter	Value
Manufacturer	Winbond Elec
Package	SOIC-8-208mil
Category	Memory
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage (absolute maximum)	VCC	-0.6		4.6	V		37
Voltage Applied to Any Pin (max printed as VCC +0.4)	VIO	-0.6			V	Relative to Ground	37
Transient Voltage on any Pin (max printed as VCC+2.0)	VIOT	-2			V	<20nS Transient, Relative to Ground	37
Storage Temperature	TSTG	-65		150	°C		37
Electrostatic Discharge Voltage	VESD	-2000		2000	V	Human Body Model	37
Supply Voltage	VCC	2.3		3.6	V	FR = 80MHz, fR = 33MHz	37
Supply Voltage	VCC	2.7		3.6	V	FR = 104MHz, fR = 50MHz	37
Ambient Temperature, Operating	TA	-40		85	°C	Industrial	37
VCC (min) to /CS Low	tVSL	10			µs		38
Time Delay Before Write Instruction	tPUW	5			ms		38
Write Inhibit Threshold Voltage	VWI	1		2	V		38
Input Capacitance	CIN			6	pF	VIN = 0V	39
Output Capacitance	Cout			8	pF	VOUT = 0V	39
Input Leakage	ILI	-2		2	µA		39
I/O Leakage	ILO	-2		2	µA		39
Standby Current	ICC1		10	50	µA	/CS = VCC, VIN = GND or VCC	39
Power-down Current	ICC2		1	5	µA	/CS = VCC, VIN = GND or VCC	39
Current Write Status Register	ICC4		8	12	mA	/CS = VCC	39
Current Page Program	ICC5		10	15	mA	/CS = VCC	39
Current Sector/Block Erase	ICC6		10	15	mA	/CS = VCC	39
Current Chip Erase	ICC7		10	15	mA	/CS = VCC	39
Input Low Voltage (max printed as VCC×0.3)	VIL	-0.5			V		39
Output Low Voltage	VOL			0.4	V	IOL = 100 µA	39
Clock frequency for all instructions except Read Data (03h)	FR			104	MHz	2.7V-3.6V VCC & Industrial Temperature	41
Clock frequency for all instructions except Read Data (03h)	FR			80	MHz	2.3V-2.7V VCC & Industrial Temperature	41
Clock frequency, Read Data instruction (03h)	fR			50	MHz	2.7V-3.6V VCC & Industrial Temperature	41
Clock frequency, Read Data instruction (03h)	fR			33	MHz	2.3V-2.7V VCC & Industrial Temperature	41
Clock High, Low Time, for Fast Read (0Bh, 3Bh) / other instructions except Read Data (03h)	tCLH, tCLL	4			ns		41
Clock High, Low Time for Read Data (03h) instruction	tCRLH, tCRLL	6			ns		41
/CS Active Setup Time relative to CLK	tSLCH	5			ns		41
/CS Not Active Hold Time relative to CLK	tCHSL	5			ns		41
Data In Setup Time	tDVCH	2			ns		41
Data In Hold Time	tCHDX	5			ns		41
/CS Active Hold Time relative to CLK	tCHSH	5			ns		41
/CS Not Active Setup Time relative to CLK	tSHCH	5			ns		41
/CS Deselect Time (Array Read)	tSHSL1	50			ns		41
/CS Deselect Time (Erase/Program, Read SR)	tSHSL2	100			ns		41
/CS Deselect Time (Volatile Status Register Write Time)	tSHSL2	50			ns		41
Output Disable Time	tSHQZ			7	ns		41
Clock Low to Output Valid	tCLQV1			8	ns		41
Clock Low to Output Valid (for Read ID instructions)	tCLQV2			8	ns		41
Output Hold Time	tCLQX	0			ns		42
/HOLD Active Setup Time relative to CLK	tHLCH	5			ns		42
/HOLD Active Hold Time relative to CLK	tCHHH	5			ns		42
/HOLD Not Active Setup Time relative to CLK	tHHCH	5			ns		42
/HOLD Not Active Hold Time relative to CLK	tCHHL	5			ns		42
/HOLD to Output Low-Z	tHHQX			7	ns		42
/HOLD to Output High-Z	tHLQZ			12	ns		42
Write Protect Setup Time Before /CS Low	tWHSL	20			ns		42
Write Protect Hold Time After /CS High	tSHWL	100			ns		42
/CS High to Power-down Mode	tDP			3	µs		42
/CS High to Standby Mode without Electronic Signature Read	tRES1			3	µs		42
/CS High to Standby Mode with Electronic Signature Read	tRES2			1.8	µs		42
Write Status Register Time	tW		10	15	ms		42
Byte Program Time (First Byte)	tBP1		15	30	µs		42
Page Program Time	tPP		0.4	0.8	ms		42
Sector Erase Time (4KB)	tSE		30	300	ms		42
Block Erase Time (32KB)	tBE1		120	800	ms		42
Block Erase Time (64KB)	tBE2		150	1000	ms		42
Chip Erase Time	tCE		1	4	s		42

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	10.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 44 10.2 8-Pin VSOP8 150-mil (Package Code SV)...........................................	3

CAD (KiCad official)

Symbol: W25X40CLSSIG
Footprint: Package_SO:SOIC-8_5.3x5.3mm_P1.27mm
3D model: SOIC-8-208mil (KiCad packages3D, STEP)
3D model files: w25x40clssig-etched.step / w25x40clssig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25x40clssig.step / w25x40clssig.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Winbond Elec datasheet (53 pp, sha256 815a536a29f475d0, retrieved 2026-11-10, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

W25X40CLSSIG

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3D Model

Symbol & Footprint

Schematic Symbol

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Datasheet

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