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W25X40CLSSIG

Public Made by Adom

by adom

Winbond Elec NOR FLASH, SOIC-8-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

markdown

W25X40CLSSIG

Winbond Elec · NOR FLASH · SOIC-8-208mil

W25X40CLSSIG from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select input that enables and disables the device; when high the device is deselected and DO is high impedance, and it must transition high to low before a new instruction is accepted.
2 DO (IO1) bidirectional Serial data output in standard SPI and bidirectional IO1 in Dual SPI, with data read on the falling edge of CLK.
3 /WP input Active-low Write Protect input that prevents the Status Register from being written, used with the TB, BP2, BP1, BP0 and SRP bits.
4 GND power_in Ground.
5 DI (IO0) bidirectional Serial data input in standard SPI and bidirectional IO0 in Dual SPI, with data written on the rising edge of CLK.
6 CLK input Serial Clock input that provides the timing for serial input and output operations.
7 /HOLD input Hold input that pauses the device while /CS is low, putting DO at high impedance and ignoring DI and CLK until it is brought high.
8 VCC power_in Power supply input for a single 2.3V to 3.6V supply.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-8-208mil
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (operating) VCC 2.3 3.6 V FR = 80MHz, fR = 33MHz / FR = 104MHz, fR = 50MHz 37
Ambient Temperature, Operating TA -40 85 °C Industrial 37
Supply Voltage VCC -0.6 4.6 V 37
Voltage Applied to Any Pin VIO -0.6 V Relative to Ground; max is VCC +0.4 37
Transient Voltage on any Pin VIOT -2 V <20nS Transient, Relative to Ground; max is VCC+2.0V 37
Storage Temperature TSTG -65 150 °C 37
Electrostatic Discharge Voltage VESD -2000 2000 V Human Body Model 37
VCC (min) to /CS Low tVSL 10 µs Characterized only 38
Time Delay Before Write Instruction tPUW 5 ms Characterized only 38
Write Inhibit Threshold Voltage VWI 1 2 V Characterized only 38
Input Capacitance CIN 6 pF VIN = 0V 39
Output Capacitance Cout 8 pF VOUT = 0V 39
Input Leakage ILI -2 2 µA 39
I/O Leakage ILO -2 2 µA 39
Standby Current ICC1 10 50 µA /CS = VCC, VIN = GND or VCC 39
Power-down Current ICC2 1 5 µA /CS = VCC, VIN = GND or VCC 39
Current Write Status Register ICC4 8 12 mA /CS = VCC 39
Current Page Program ICC5 10 15 mA /CS = VCC 39
Current Sector/Block Erase ICC6 10 15 mA /CS = VCC 39
Current Chip Erase ICC7 10 15 mA /CS = VCC 39
Input Low Voltage VIL -0.5 V max is VCCx0.3 39
Output Low Voltage VOL 0.4 V IOL = 100 µA 39
Clock frequency, all instructions except Read Data (03h) FR 0 104 MHz 2.7V-3.6V VCC & Industrial Temperature 41
Clock frequency, all instructions except Read Data (03h) FR 0 80 MHz 2.3V-2.7V VCC & Industrial Temperature 41
Clock freq. Read Data instruction 03h fR 0 50 MHz 2.7V-3.6V VCC & Industrial Temperature 41
Clock freq. Read Data instruction 03h fR 0 33 MHz 2.3V-2.7V VCC & Industrial Temperature 41
Clock High, Low Time (Fast Read / other except 03h) tCLH, tCLL 4 ns 41
Clock High, Low Time for Read Data (03h) tCRLH, tCRLL 6 ns 41
/CS Active Setup Time relative to CLK tSLCH 5 ns 41
/CS Not Active Hold Time relative to CLK tCHSL 5 ns 41
Data In Setup Time tDVCH 2 ns 41
Data In Hold Time tCHDX 5 ns 41
/CS Active Hold Time relative to CLK tCHSH 5 ns 41
/CS Not Active Setup Time relative to CLK tSHCH 5 ns 41
/CS Deselect Time (Array Read to Array Read) tSHSL1 50 ns 41
Output Disable Time tSHQZ 7 ns 41
Clock Low to Output Valid tCLQV1 8 ns 41
Clock Low to Output Valid (Read ID instructions) tCLQV2 8 ns 41
Output Hold Time tCLQX 0 ns 42
/HOLD Active Setup Time relative to CLK tHLCH 5 ns 42
/HOLD Active Hold Time relative to CLK tCHHH 5 ns 42
/HOLD Not Active Setup Time relative to CLK tHHCH 5 ns 42
/HOLD Not Active Hold Time relative to CLK tCHHL 5 ns 42
/HOLD to Output Low-Z tHHQX 7 ns 42
/HOLD to Output High-Z tHLQZ 12 ns 42
Write Protect Setup Time Before /CS Low tWHSL 20 ns Only for Write Status Register when SRP is set to 1 42
Write Protect Hold Time After /CS High tSHWL 100 ns Only for Write Status Register when SRP is set to 1 42
/CS High to Power-down Mode tDP 3 µs 42
/CS High to Standby Mode without Electronic Signature Read tRES1 3 µs 42
/CS High to Standby Mode with Electronic Signature Read tRES2 1.8 µs 42
Write Status Register Time tW 10 15 ms 42
Byte Program Time (First Byte) tBP1 15 30 µs 42
Additional Byte Program Time (After First Byte) tBP2 2.5 5 µs 42
Page Program Time tPP 0.4 0.8 ms 42
Sector Erase Time (4KB) tSE 30 300 ms 42
Block Erase Time (32KB) tBE1 120 800 ms 42
Block Erase Time (64KB) tBE2 150 1000 ms 42
Chip Erase Time tCE 1 4 s 42

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin 10.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 44 10.2 8-Pin VSOP8 150-mil (Package Code SV)........................................... 3

CAD (KiCad official)

  • Symbol: W25X40CLSSIG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8-208mil (KiCad packages3D, STEP)
  • 3D model files: w25x40clssig-etched.step / w25x40clssig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25x40clssig.step / w25x40clssig.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (53 pp, sha256 815a536a29f475d0, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF