W25Q80DVSSIG from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	/CS	input	SPI Chip Select input, active low. When high the device is deselected and DO/IO pins are high-impedance; when low the device is enabled. A pull-up resistor to VCC is recommended to guarantee deselect at power-up.
2	DO (IO1)	bidirectional	Serial Data Output in Standard SPI mode (data shifted out on the falling edge of CLK). In Dual/Quad SPI modes this pin becomes bidirectional IO1.
3	/WP (IO2)	bidirectional	Hardware Write Protect input, active low, used with the Status Register Block Protect and SRP bits to write-protect all or a portion of the array. When the Quad Enable (QE) bit is set the pin is repurposed as bidirectional IO2 for Quad SPI.
4	GND	power_in	Ground reference for the device.
5	DI (IO0)	bidirectional	Serial Data Input in Standard SPI mode (data shifted in on the rising edge of CLK). In Dual/Quad SPI modes this pin becomes bidirectional IO0.
6	CLK	input	SPI serial clock input. Provides timing for serial input on the rising edge and serial output on the falling edge. Supports clock rates up to 104MHz.
7	/HOLD (IO3)	bidirectional	Hold input, active low. When /HOLD is asserted while /CS is low, DO goes high-impedance and DI/CLK are ignored so the device can be paused while selected. When Quad Enable (QE) is set the pin is repurposed as bidirectional IO3 for Quad SPI.
8	VCC	power_in	Power supply input, 2.7V to 3.6V. Recommended to decouple with a bulk and a ceramic bypass capacitor close to the pin.

Key specifications

Parameter	Value
Manufacturer	Winbond Elec
Package	SOIC-8-208mil
Category	Memory
Pins	8

Ordering variants

Same part, different packaging or reel option.

W25Q80DVSSIG
W25Q80DVSSIGSSIQ
W25Q80DVSSIGSNIG
W25Q80DVSSIGSNIQ
W25Q80DVSSIGSVIG
W25Q80DVSSIGSVIQ
W25Q80DVSSIGZPIG
W25Q80DVSSIGZPIQ
W25Q80DVSSIGUXIE
W25Q80DVSSIGDAIG
W25Q80DVSSIGBYIT

CAD (KiCad official)

Symbol: W25Q80DVSSIG
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8-208mil (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`w25q80dvssig.step`	122 KB	You want the bare part, or you mark your own boards.
`w25q80dvssig-etched.step`	2.8 MB	You want the part with `W25Q80DVSSIG` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 663 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Winbond Elec datasheet (71 pp, sha256 bd7e65b1335bb21d, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF