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W25Q80DVSNIG

Winbond Elec · NOR FLASH · SOIC-8

W25Q80DVSNIG from Winbond Elec, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Active-low SPI Chip Select input. Drive low to select the device and clock in instructions on CLK; drive high to deselect and place DO/IO pins into Hi-Z. After power-up /CS must transition high-to-low before the first instruction; a pull-up to VCC is recommended.
2 DO (IO1) bidirectional Serial Data Output in Standard SPI mode (data shifts out on falling edge of CLK). Becomes bidirectional IO1 for Dual/Quad SPI instructions.
3 /WP (IO2) bidirectional Active-low Write Protect input, used with Status Register CMP/SEC/TB/BP2/BP1/BP0/SRP0 bits to hardware-protect part or all of the array. Becomes bidirectional IO2 when Quad Enable (QE) bit is set for Quad SPI I/O.
4 GND power_in Device ground reference (0 V).
5 DI (IO0) bidirectional Serial Data Input in Standard SPI mode (instructions, addresses and data clocked in on rising edge of CLK). Becomes bidirectional IO0 for Dual/Quad SPI instructions.
6 CLK input SPI Serial Clock input. Provides timing for serial input and output; up to 104MHz on W25Q80DV. Data is latched on rising edge and shifted out on falling edge.
7 /HOLD (IO3) bidirectional Active-low Hold input pauses serial communication while /CS is low: DO goes Hi-Z and DI/CLK are ignored. Becomes bidirectional IO3 when Quad Enable (QE) bit is set for Quad SPI I/O.
8 VCC power_in Power supply input. W25Q80DV: 2.7 V to 3.6 V (single supply). Decouple to GND with a local bypass capacitor near the pin.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • W25Q80DVSNIG
  • W25Q80DVSNIGSS
  • W25Q80DVSNIGSV
  • W25Q80DVSNIGZP
  • W25Q80DVSNIGUX
  • W25Q80DVSNIGUXIE
  • W25Q80DVSNIGDA
  • W25Q80DVSNIGBY

CAD (KiCad official)

  • Symbol: W25Q80DVSNIG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
w25q80dvsnig.step 122 KB You want the bare part, or you mark your own boards.
w25q80dvsnig-etched.step 2.6 MB You want the part with W25Q80DVSNIG already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 627 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (73 pp, sha256 7f8c606061fa6b81, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF