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Contents

README

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W25Q64JWZPIQ TR

Winbond Elec · NOR FLASH · WSON-8(5x6)

W25Q64JWZPIQ TR from Winbond Elec, in a WSON-8(5x6). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select input, active low. When high, DO/IO pins are high-impedance and the device is deselected (standby). When low, the device is selected and instructions can be written / data read. /CS must track VCC at power-up (use a pull-up if needed).
2 DO (IO1) bidirectional Serial Data Output for Standard SPI (unidirectional DO, sampled/output on falling CLK edge). Becomes bidirectional IO1 for Dual/Quad SPI instructions.
3 /WP (IO2) bidirectional Write Protect input, active low. Works with the Status Register CMP/SEC/TB/BP2/BP1/BP0 and SRP bits to hardware-protect part or all of the array. Becomes bidirectional IO2 when Quad SPI is enabled (QE=1 in Status Register-2).
4 GND power_in Device ground reference.
5 DI (IO0) bidirectional Serial Data Input for Standard SPI (unidirectional DI; instructions/addresses/data clocked in on rising CLK edge). Becomes bidirectional IO0 for Dual/Quad SPI instructions.
6 CLK input Serial Clock input. Provides timing for all serial input and output operations. Supports up to 133 MHz.
7 /HOLD or /RESET (IO3) bidirectional Multifunction pin. In Standard/Dual SPI acts as active-low /HOLD (pauses the device while /CS is low) or, if configured, active-low /RESET. Becomes bidirectional IO3 when Quad SPI is enabled (QE=1 in Status Register-2), at which point /HOLD/RESET functionality is not available.
8 VCC power_in Power supply, 1.7 V to 1.95 V (nominal 1.8 V).

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package WSON-8(5x6)
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • W25Q64JWZPIQ TR
  • W25Q64JWZPIQ TRZPIM
  • W25Q64JWZPIQ TRZPIT
  • W25Q64JWZPIQ TRSSIQ
  • W25Q64JWZPIQ TRSSIM
  • W25Q64JWZPIQ TRSSIT
  • W25Q64JWZPIQ TRZEIQ
  • W25Q64JWZPIQ TRZEIM
  • W25Q64JWZPIQ TRZEIT
  • W25Q64JWZPIQ TRUUIQ
  • W25Q64JWZPIQ TRUUIM
  • W25Q64JWZPIQ TRUUIT
  • W25Q64JWZPIQ TRXGIQ
  • W25Q64JWZPIQ TRXGIM
  • W25Q64JWZPIQ TRXGIT
  • W25Q64JWZPIQ TRTBIQ
  • W25Q64JWZPIQ TRTBIM
  • W25Q64JWZPIQ TRTBIT
  • W25Q64JWZPIQ TRBYIQ
  • W25Q64JWZPIQ TRBYIM
  • W25Q64JWZPIQ TRBYIT

CAD (KiCad official)

  • Symbol: W25Q64JWZPIQ TR
  • Footprint: Package_SON:WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm
  • 3D model: WSON-8(5x6) (KiCad packages3D, STEP)
  • 3D model files: w25q64jwzpiq-tr-etched.step / w25q64jwzpiq-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); w25q64jwzpiq-tr.step / w25q64jwzpiq-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (76 pp, sha256 0b43eb45e9d35317, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF