W25Q64JWSSIQ from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	/CS	input	Chip Select input, active low. When high the device is deselected and DO/IO pins are high-impedance; when low the device is selected and instructions can be written/read. /CS must track VCC at power-up/down; a pull-up on /CS is recommended.
2	DO (IO1)	bidirectional	Serial Data Output for Standard SPI (unidirectional, data shifted out on falling edge of CLK). Becomes bidirectional IO1 for Dual/Quad SPI instructions.
3	/WP (IO2)	bidirectional	Write Protect input, active low, used with the Status Register block-protect and SRP bits to hardware-protect a portion of memory. Becomes bidirectional IO2 when Quad Enable (QE) bit is set for Quad SPI operation.
4	GND	power_in	Ground reference for the device.
5	DI (IO0)	bidirectional	Serial Data Input for Standard SPI (unidirectional, sampled on rising edge of CLK). Becomes bidirectional IO0 for Dual/Quad SPI instructions.
6	CLK	input	SPI Serial Clock input providing timing for serial input and output operations. Supports clock frequencies up to 133MHz.
7	/HOLD (IO3)	bidirectional	/HOLD input (active low) pauses device operation while /CS is low, tri-stating DO and ignoring DI/CLK. Becomes bidirectional IO3 when Quad Enable (QE) bit is set for Quad SPI operation. Hardware /RESET function is NOT available on the 8-pin SOIC package (only on SOIC-16 and TFBGA).
8	VCC	power_in	Power supply, 1.7V to 1.95V single supply. Power-down current typ <1uA.

Key specifications

Parameter	Value
Manufacturer	Winbond Elec
Package	SOIC-8-208mil
Category	Memory
Pins	8

Ordering variants

Same part, different packaging or reel option.

W25Q64JWSSIQ
W25Q64JWSSIQSSIG
W25Q64JWSSIQZPIQ
W25Q64JWSSIQZPIG
W25Q64JWSSIQZEIQ
W25Q64JWSSIQZEIG
W25Q64JWSSIQUUIQ
W25Q64JWSSIQUUIG
W25Q64JWSSIQXGIQ
W25Q64JWSSIQXGIG
W25Q64JWSSIQTBIQ
W25Q64JWSSIQTBIG
W25Q64JWSSIQBYIQ
W25Q64JWSSIQBYIG

CAD (KiCad official)

Symbol: W25Q64JWSSIQ
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8-208mil (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`w25q64jwssiq.step`	122 KB	You want the bare part, or you mark your own boards.
`w25q64jwssiq-etched.step`	2.6 MB	You want the part with `W25Q64JWSSIQ` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 635 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Winbond Elec datasheet (77 pp, sha256 8afcf97374895da3, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF