W25Q64JVSSIQ from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	/CS	input	Chip Select input (active low). When /CS is high the device is deselected and IO pins are high impedance; when /CS is brought low the device is selected and instructions can be written/read. /CS must track VCC at power-up.
2	DO (IO1)	bidirectional	Serial Data Output in Standard SPI mode; bidirectional IO1 in Dual/Quad SPI modes. Data is clocked out on the falling edge of CLK.
3	/WP (IO2)	bidirectional	Write Protect input (active low) in Standard/Dual SPI; used with SRP/CMP/SEC/TB/BP bits to hardware-protect a portion or the entire array. Repurposed as IO2 when Quad SPI is enabled (QE=1).
4	GND	power_in	Ground reference (0 V) for the device.
5	DI (IO0)	bidirectional	Serial Data Input in Standard SPI mode; bidirectional IO0 in Dual/Quad SPI modes. Data is latched on the rising edge of CLK.
6	CLK	input	SPI Serial Clock input providing timing for all serial I/O operations. Supports up to 133 MHz.
7	/HOLD or /RESET (IO3)	bidirectional	Multi-function pin: /HOLD (active low) pauses SPI transactions while /CS is low, or /RESET input, in Standard/Dual SPI modes. Becomes IO3 when Quad SPI is enabled (QE=1). Note: this is NOT a dedicated hardware reset pin on the SOIC-8 package; the dedicated /RESET is only present on SOIC-16 and TFBGA packages.
8	VCC	power_in	Power supply input, 2.7 V to 3.6 V (3.3 V nominal). Power-down current <1 uA typical.

Key specifications

Parameter	Value
Manufacturer	Winbond Elec
Package	SOIC-8-208mil
Category	Memory
Pins	8

Ordering variants

Same part, different packaging or reel option.

W25Q64JVSSIQ
W25Q64JVSSIQSSIG
W25Q64JVSSIQZPIQ
W25Q64JVSSIQZPIG
W25Q64JVSSIQZEIQ
W25Q64JVSSIQZEIG
W25Q64JVSSIQXGIQ
W25Q64JVSSIQXGIG
W25Q64JVSSIQSFIQ
W25Q64JVSSIQSFIG
W25Q64JVSSIQTBIQ
W25Q64JVSSIQTBIG
W25Q64JVSSIQTCIQ
W25Q64JVSSIQTCIG
W25Q64JVSSIQBYIQ
W25Q64JVSSIQBYIG

CAD (KiCad official)

Symbol: W25Q64JVSSIQ
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8-208mil (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Winbond Elec datasheet (78 pp, sha256 9f2073343ef0e6a9, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF