W25Q32JVSSIQ from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	/CS	input	SPI Chip Select input, active low. Drive low to select the device and clock instructions/data on DI/DO or IO0-IO3; drive high to deselect and place I/O pins in high impedance. Requires a valid high-to-low transition after power-up before any instruction is accepted; a pull-up to VCC is recommended.
2	DO/IO1	bidirectional	Standard/Dual SPI serial data output (DO) driven on the falling edge of CLK. In Quad SPI mode (Quad Enable QE=1) this pin becomes bidirectional IO1 for both write and read transfers.
3	/WP/IO2	bidirectional	Active-low Write Protect input in standard/Dual SPI mode; when asserted together with the SRP/BP/TB/SEC/CMP bits it hardware-protects part or all of the array and the Status Register. In Quad SPI mode (QE=1) this pin becomes bidirectional IO2.
4	GND	power_in	Device ground reference. Connect to the system 0 V/GND plane.
5	DI/IO0	bidirectional	Standard/Dual SPI serial data input (DI), sampled on the rising edge of CLK for instructions, addresses and data. In Quad SPI mode this pin becomes bidirectional IO0.
6	CLK	input	SPI serial clock input. Provides the timing reference for all serial input and output operations; supports up to 133 MHz. Data on DI/IOx is latched on the rising edge; DO/IOx is updated on the falling edge.
7	/HOLD/IO3	bidirectional	Active-low /HOLD input in standard/Dual SPI mode: while /CS is low, driving /HOLD low pauses the device (DO goes high-Z, DI/CLK are ignored) without deselecting it. In Quad SPI mode (QE=1) the pin is repurposed as bidirectional IO3. Note: on this 8-pin package the pin does NOT provide the dedicated hardware /RESET function (only SOIC-16 and TFBGA packages expose /RESET).
8	VCC	power_in	Core and I/O supply, 2.7 V to 3.6 V. Decouple with a local ceramic bypass capacitor close to the pin.

Key specifications

Parameter	Value
Manufacturer	Winbond Elec
Package	SOIC-8-208mil
Category	Memory
Pins	8

Ordering variants

Same part, different packaging or reel option.

W25Q32JVSSIQ
W25Q32JVSSIQSSIG
W25Q32JVSSIQSNIQ
W25Q32JVSSIQSNIG
W25Q32JVSSIQSTIQ
W25Q32JVSSIQSTIG
W25Q32JVSSIQZPIQ
W25Q32JVSSIQZPIG
W25Q32JVSSIQZEIQ
W25Q32JVSSIQZEIG
W25Q32JVSSIQXGIQ
W25Q32JVSSIQXGIG
W25Q32JVSSIQSFIQ
W25Q32JVSSIQSFIG
W25Q32JVSSIQDAIQ
W25Q32JVSSIQDAIG
W25Q32JVSSIQTBIQ
W25Q32JVSSIQTBIG
W25Q32JVSSIQTCIQ
W25Q32JVSSIQTCIG

CAD (KiCad official)

Symbol: W25Q32JVSSIQ
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8-208mil (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`w25q32jvssiq.step`	122 KB	You want the bare part, or you mark your own boards.
`w25q32jvssiq-etched.step`	2.7 MB	You want the part with `W25Q32JVSSIQ` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 643 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Winbond Elec datasheet (80 pp, sha256 a835e8ae41ea71e9, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF