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TX4121

XDS · DC-DC Converters · ESOP-8

TX4121 from XDS, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BST passive Bootstrap driver pin for the high-side MOSFET gate drive. Connect a 0.1 µF (or larger) ceramic capacitor between BST and SW to develop the high-side gate drive rail.
2 VDD power_in Chip power / converter input supply. Operating range 6.5V to 36V, absolute max 36V. Bypass locally to GND with low-ESR ceramic input capacitors.
3 SW power_out Switching node output - drain junction of the internal high-side and low-side power MOSFETs. Connect to the external inductor. Delivers up to 3.1 A continuous.
4 GND power_in Device ground / power return. Tie to the ground plane together with the EP thermal pad for best thermal and electrical performance.
5 FB input Feedback sense input for the output voltage divider. Regulated to VFB = 0.9 V typical; output OVP threshold VFB_OVP = 0.99 V. Absolute max −0.3 V to 6 V.
6 COMP output Error amplifier output / loop compensation node. Connect an R-C (and optional second C) network from COMP to GND to shape the control-loop response. Source ~5.2 µA, sink ~3.2 µA.
7 EN input Enable input, active-high, with an internal high-value pull-up (~1.6 µA input current). VIH ≥ 1.2 V, VIL ≤ 1.1 V. Absolute max −0.3 V to 6 V. Leave floating or tie high to enable; pull to GND to shut down.
8 SST input Programmable soft-start input. Connect a capacitor from SST to GND; the pin is charged by an internal ~2.3 µA source, ramping the internal reference to control output-voltage rise time and inrush current. Absolute max −0.3 V to 6 V.
9 EP passive Exposed thermal pad on the bottom of the ESOP-8 package. Solder to a large copper ground pour for heat sinking; electrically tie to GND (pin 4). θJA ≈ 56 °C/W, θJC ≈ 45 °C/W.

Key specifications

Parameter Value
Manufacturer XDS
Package ESOP-8
Category PMIC
Pins 9

CAD (KiCad official)

  • Symbol: TX4121
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
tx4121.step 193 KB You want the bare part, or you mark your own boards.
tx4121-etched.step 834 KB You want the part with TX4121 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 236 faces against 63 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XDS datasheet (12 pp, sha256 d852293a9e759d95, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF