component
TPS7B8601QDDARQ1
Public Unreviewedby Ray
Texas Instruments Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SO-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS7B8601QDDARQ1
Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SO-8
TPS7B8601QDDARQ1 from Texas Instruments, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage pin. Requires a ceramic output capacitor (>=2.2 uF recommended) from OUT to GND for stability; place as close to the pin as possible. Supplies up to 500 mA. |
| 2 | FB/NC | input | Feedback pin for adjustable versions: connect an external resistor divider from OUT to set output between 1.2 V and 18 V. On fixed-voltage variants this pin is NC and may be left floating or tied to GND. |
| 3 | DELAY | output | Power-good delay adjustment pin. Connect an external capacitor from DELAY to GND to program the PG reset delay; leave floating for the default t(DLY_FIX) delay. Do not tie to GND (permanent increase in GND current). |
| 4 | GND | power_in | Ground reference. Connect to the exposed thermal pad with a low-impedance connection for best thermal and noise performance. |
| 5 | PG | output | Active-high, open-drain power-good indicator. Asserts high (via external pull-up) when VOUT reaches VPG(TH,RISING). A feed-forward capacitor at FB can disrupt PG operation. |
| 6 | EN | input | Enable input. Device is disabled when EN is below VIL. Do not leave floating (high impedance). Absolute max -0.3 V to 42 V. |
| 7 | NC | unconnected | No internal connection. Leave floating or tie to GND for best thermal performance. |
| 8 | IN | power_in | Unregulated input supply pin. Operating range 3 V to 40 V (42 V absolute max). Place a ceramic input capacitor from IN to GND as close as possible to the device. |
| 9 | PAD | passive | Exposed thermal pad on the bottom of the DDA HSOIC package. Solder to a copper ground pour and connect to GND for best thermal performance (theta-JA = 41.8 degC/W). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SO-8 |
| Category | PMIC |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
TPS7B8601QDDARQ1TPS7B8601QDDARQ1KVUR
CAD (KiCad official)
- Symbol:
TPS7B8601QDDARQ1 - Footprint:
Package_SO:TI_SO-PowerPAD-8 - 3D model: SO-8 (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (41 pp, sha256
a807c89be04722f1, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).