TPS79801QDGNRQ1
Public Unreviewedby Ray
Texas Instruments Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, MSOP-8-EP. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownTPS79801QDGNRQ1
Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · MSOP-8-EP
TPS79801QDGNRQ1 from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | output | Regulated output voltage pin. Adjustable from 1.275 V to 28 V; 50 mA maximum output current. A small (1 µF) ceramic capacitor is required from this pin to ground for stability. |
| 2 | SENSE/FB | input | Feedback input to the control loop error amplifier; used to set the output voltage of the adjustable regulator (TPS79801) via an external resistor divider. VFB = 1.275 V (typical); IFB = 0.2 µA at 25°C. |
| 3 | NC | unconnected | No internal connection. |
| 4 | GND | power_in | Ground reference pin. The exposed PowerPAD thermal pad is connected to ground through this pin and should be tied to the ground plane for optimal thermal performance. |
| 5 | EN | input | Enable pin. Driving EN high (>1.5 V) turns the regulator on over the full operating range; driving EN low (<0.4 V) places the device in shutdown mode. EN can be driven up to 50 V. |
| 6 | NC | unconnected | No internal connection. |
| 7 | NC | unconnected | No internal connection. |
| 8 | IN | power_in | Input supply pin, 3 V to 50 V operating range. TI recommends a 0.1 µF ceramic or greater capacitor from this pin to ground for stability. Both input and output capacitor grounds should be tied back to the IC ground with no significant impedance between them. |
| 9 | PAD | power_in | Exposed thermal pad on the underside of the MSOP-PowerPAD package. Internally connected to ground through pin 4 (GND) and must be soldered to the PCB ground land for proper thermal dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | MSOP-8-EP |
| Category | PMIC |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
TPS79801QDGNRQ1
CAD (KiCad official)
- Symbol:
TPS79801QDGNRQ1 - Footprint:
Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm - 3D model: MSOP-8-EP (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
tps79801qdgnrq1.step |
114 KB | You want the bare part, or you mark your own boards. |
tps79801qdgnrq1-etched.step |
3.0 MB | You want the part with TPS79801QDGNRQ1 already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 727 faces against 140 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (25 pp, sha256
7d14dd0649c2c71d, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).