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TPS62170DSGR

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by Ray

Texas Instruments DC-DC Converters, WSON-8-EP(2x2). Datasheet-verified pinout, KiCad symbol/footprint/3D.

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Datasheet

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Contents

README

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TPS62170DSGR

Texas Instruments · DC-DC Converters · WSON-8-EP(2x2)

TPS62170DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PGND power_in Power ground. Return path for the internal low-side power MOSFET; carries the switching output current. Must be tied to the ground plane close to the input capacitor.
2 VIN power_in Supply voltage input, 3 V to 17 V (absolute max 20 V). Bypass with a low-ESR ceramic input capacitor (typ. 10 uF) placed close to VIN and PGND.
3 EN input Enable input. High level (V_EN_H typ. 0.9 V, min 0.6 V) enables the converter; low level (V_EN_L typ. 0.56 V, max 0.3 V) shuts it down. Do not leave floating.
4 AGND power_in Analog ground reference for the internal control circuitry. Connect to the ground plane; exposed thermal pad must also tie to AGND.
5 FB input Voltage feedback for the adjustable version (TPS62170). Connect the resistive divider from VOUT (V_REF = 0.8 V internal reference). On fixed-output variants (TPS62171/2/3), tie FB to AGND for improved thermal performance.
6 VOS input Output voltage sense pin used by the DCS-Control loop. Kelvin-connect to the output capacitor for accurate regulation and transient response.
7 SW output Switch node connecting to the drains of the internal high-side and low-side power MOSFETs. Connect the external inductor (typ. 2.2 uH) between SW and the output capacitor. Absolute max SW (AC, <10 ns): -2 V to 24.5 V.
8 PG output Power Good, open-drain output. High-Z when VOUT is within regulation (rising threshold typ. 95% of VOUT); pulled low when VOUT falls below ~90% of nominal or when the device is disabled. Requires an external pull-up resistor; sink capability up to 10 mA.
EP EP power_in Exposed thermal pad on the underside of the package. Must be connected to AGND and soldered to the PCB ground plane to achieve rated power dissipation and mechanical reliability.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-8-EP(2x2)
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • TPS62170DSGR
  • TPS62170DSGRDSGT

CAD (KiCad official)

  • Symbol: TPS62170DSGR
  • Footprint: Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
  • 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
tps62170dsgr.step 98 KB You want the bare part, or you mark your own boards.
tps62170dsgr-etched.step 2.3 MB You want the part with TPS62170DSGR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 560 faces against 62 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (39 pp, sha256 aee0fde5de348445, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF