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Contents

README

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TPS62125DSGR

Texas Instruments · DC-DC Converters · WSON-8-EP(2x2)

TPS62125DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground supply pin. Connect directly to the ground plane; the exposed thermal pad must also be tied to GND.
2 VIN power_in Input supply pin, 3 V to 17 V (absolute max 20 V). Bypass with a low-ESR ceramic capacitor (typ. 10 uF) close to the pin.
3 EN input Enable-comparator input. Pulling to GND shuts the device down. The DC/DC turns on when EN rises above VTH_EN_ON (typ. 1.20 V) and off when EN falls below VTH_EN_OFF (typ. 1.15 V). Threshold can be raised via an external resistor to EN_hys. Must be terminated (do not leave floating).
4 EN_hys output Enable-hysteresis open-drain output. Pulled to GND while EN is below VTH_EN_ON and high-impedance once the comparator has tripped, then pulled back to GND when EN falls below VTH_EN_OFF (1.15 V typ). Used to program additional EN hysteresis; leave open or tie to GND if unused. Sink current up to 3 mA (abs max).
5 FB input Feedback pin for the regulator. An external resistor divider from VOUT sets the output voltage (VREF_FB = 0.808 V typ). For fixed-output-voltage variants, the divider is internal and FB is tied to VOUT.
6 VOS input Output-voltage sense input for the DCS-Control circuitry. Must be connected directly to the DC/DC converter output voltage.
7 SW output Switch node connected to the internal high-side and low-side power MOSFETs. Connect the external inductor here. Do not tie to VIN, VOUT, or GND.
8 PG output Open-drain power-good output. Pulled to GND when the device is disabled or VOUT is below the PG threshold; high-impedance (floating) when VOUT is in regulation. Connect via a pull-up resistor to any rail up to 10 V; sink up to 0.4 mA at spec'd VOL (abs max 10 mA). Can also serve as output-discharge path (up to ~10 mA).
PAD Exposed Thermal PAD power_in Exposed thermal pad on the underside of the package. Must be connected to GND and to a copper area for thermal dissipation.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-8-EP(2x2)
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • TPS62125DSGR
  • TPS62125DSGRDSGT

CAD (KiCad official)

  • Symbol: TPS62125DSGR
  • Footprint: Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
  • 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (38 pp, sha256 aeabaaa1efb91d0f, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF