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Contents

README

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TPS62042DGQR

Texas Instruments · DC-DC Converters · MSOP-10-EP

TPS62042DGQR from Texas Instruments, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Enable input. Pulling EN to GND forces the device into shutdown (I_SD ≈ 0.1 µA). Pulling EN to V_IN enables the converter. V_IH ≥ 1.4 V, V_IL ≤ 0.4 V, I_EN ≈ 0.01 µA. Must not be left floating.
2 VIN power_in Supply voltage input, 2.5 V to 6.0 V (absolute max 7 V). Tie pins 2 and 3 together and bypass with a 22 µF ceramic input capacitor close to the pin.
3 VIN power_in Supply voltage input, 2.5 V to 6.0 V. Second VIN pin; connect to pin 2 externally on the PCB.
4 GND power_in Analog ground. Reference for the internal control circuitry; keep separate quiet return trace from PGND but tie together at the PowerPAD/star ground.
5 FB input Feedback input to the error amplifier. On the fixed-output TPS62042 (1.5 V) tie FB directly to the regulated output; on the adjustable TPS62040 an external divider from V_OUT to GND sets V_OUT (V_ref = 0.5 V). The internal divider is disabled for adjustable variants.
6 MODE input Operating-mode select. MODE high forces fixed-frequency PWM operation (lower output ripple / noise). MODE low enables power-save mode: fixed-frequency PWM at heavy load, automatic PFM at light loads for higher efficiency. V_IH ≥ 1.4 V, V_IL ≤ 0.4 V, I_MODE ≈ 0.01 µA.
7 SW output Switch node - drain of the internal P-channel and N-channel power MOSFETs. Connect to the external 6.2 µH inductor. Tie pins 7 and 8 together externally. Current limit ≈ 1.85 A (typ).
8 SW output Switch node (second pin); connect externally to pin 7 and to the inductor.
9 PGND power_in Power ground - return for the internal N-channel synchronous rectifier. Tie pins 9 and 10 together and route directly to the output capacitor return and the PowerPAD.
10 PGND power_in Power ground (second pin); connect externally to pin 9.
11 PAD power_in Exposed thermal PowerPAD on the underside of the DGQ MSOP-10 package. Must be soldered to the PCB GND plane through thermal vias for the rated θ_JA = 60 °C/W. Note explicitly states 'The PowerPAD must be connected to GND.'

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package MSOP-10-EP
Category Power Management (PMIC)
Pins 11

Ordering variants

Same part, different packaging or reel option.

  • TPS62042DGQR
  • TPS62042DGQRDRC
  • TPS62042DGQRDRCR

CAD (KiCad official)

  • Symbol: TPS62042DGQR
  • Footprint: Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
  • 3D model: MSOP-10-EP (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (None pp, sha256 573d1e788be29d1d, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF