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Contents

README

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TPS61027DRCR

Texas Instruments · DC-DC Converters · VSON-10-EP(3x3)

TPS61027DRCR from Texas Instruments, in a VSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Enable input. Drive to VBAT to enable the device; drive to GND to disable (shutdown). Input high >= 0.8 x VBAT, input low <= 0.2 x VBAT. Input current <= 0.1 uA.
2 VOUT power_out Boost converter output. Regulated to 5.0 V (fixed) on TPS61027. Connect the output capacitor between VOUT and PGND.
3 FB input Voltage feedback input, used by adjustable versions. On the fixed-output TPS61027 this pin is typically tied to the internal reference/output as per the datasheet; for adjustable versions it accepts a resistor-divider tap with a 500-mV (typ) reference.
4 LBO output Low-battery comparator output (open drain). Requires an external pull-up to VBAT or VOUT. VOL <= 0.4 V at IOL = 100 uA; leakage <= 0.1 uA at VLBO = 7 V.
5 GND power_in Control / logic (analog) ground. Reference for control-stage circuitry.
6 VBAT power_in Supply voltage (battery input) for the control stage. Operating range 0.9 V to 6.5 V after start-up; minimum start-up voltage 0.9 V (typ, 1.2 V max) with RL = 120 ohm.
7 LBI input Low-battery comparator input (comparator enabled with EN). Compared against a 500-mV (typ) internal reference with 10-mV hysteresis. May NOT be left floating: tie to GND or VBAT if the comparator is unused.
8 PS input Power-save mode enable/disable. Drive to VBAT to disable power-save mode (forced fixed-frequency PWM); drive to GND to enable power-save mode for improved light-load efficiency.
9 SW input Boost and rectifying switch node. Connect the boost inductor between VBAT and SW. Internal switches: SWN Rds(on) ~260 mOhm, SWP Rds(on) ~290 mOhm. Peak switch current limited to 1800 mA (typ) on TPS61027.
10 PGND power_in Power ground for the internal synchronous rectifier and switch. Return for the output capacitor. The exposed PowerPAD should be soldered to this net.
11 PowerPAD passive Exposed thermal pad on the underside of the VSON-10 package. Must be soldered to the PCB to achieve appropriate power dissipation. Connect to PGND.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VSON-10-EP(3x3)
Category PMIC
Pins 11

Ordering variants

Same part, different packaging or reel option.

  • TPS61027DRCR
  • TPS61027DRCRDRCT

CAD (KiCad official)

  • Symbol: TPS61027DRCR
  • Footprint: Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm
  • 3D model: VSON-10-EP(3x3) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 970777c56be06a42, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF