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Contents

README

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TPS2561DRCR

Texas Instruments · AC-DC Controllers and Regulators · VSON-10-EP(3x3)

TPS2561DRCR from Texas Instruments, in a VSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground connection; connect externally to the thermal pad.
2 IN power_in Input voltage (2.5 V to 6.5 V). Connect a 0.1 µF or greater ceramic capacitor from IN to GND as close to the IC as possible. Pins 2 and 3 are tied together internally as the shared input to both channels.
3 IN power_in Input voltage (2.5 V to 6.5 V). Second IN pin, shared with pin 2.
4 EN1 input Enable input for channel 1 (TPS2561 variant, active-high). Logic high turns on the channel-one power switch. VIH ≥ 1.1 V, VIL ≤ 0.66 V; input voltage range 0 to 6.5 V.
5 EN2 input Enable input for channel 2 (TPS2561 variant, active-high). Logic high turns on the channel-two power switch. VIH ≥ 1.1 V, VIL ≤ 0.66 V; input voltage range 0 to 6.5 V.
6 FAULT2 output Active-low open-drain fault output for channel 2, asserted during overcurrent or overtemperature condition. Requires external pull-up; max sink current 25 mA (10 mA recommended).
7 ILIM output External resistor to GND sets the current-limit threshold for both channels. Recommended 20 kΩ ≤ RILIM ≤ 187 kΩ, corresponding to a current-limit range of approximately 2.8 A down to 250 mA per channel.
8 OUT2 power_out Power-switch output for channel 2. Continuous output current 0 to 2.5 A; rDS(on) typ 44 mΩ.
9 OUT1 power_out Power-switch output for channel 1. Continuous output current 0 to 2.5 A; rDS(on) typ 44 mΩ.
10 FAULT1 output Active-low open-drain fault output for channel 1, asserted during overcurrent or overtemperature condition. Requires external pull-up; max sink current 25 mA (10 mA recommended).
PAD Thermal Pad power_in Exposed thermal pad on package bottom, internally connected to GND. Used to heat-sink the part to the circuit-board traces; must be externally connected to the GND pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VSON-10-EP(3x3)
Category PMIC
Pins 11

Ordering variants

Same part, different packaging or reel option.

  • TPS2561DRCR
  • TPS2561DRCRDRCT

CAD (KiCad official)

  • Symbol: TPS2561DRCR
  • Footprint: Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm
  • 3D model: VSON-10-EP(3x3) (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
tps2561drcr.step 283 KB You want the bare part, or you mark your own boards.
tps2561drcr-etched.step 2.2 MB You want the part with TPS2561DRCR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 530 faces against 74 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (30 pp, sha256 3c66a28fc3932400, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF