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TPS2560DRCR

Texas Instruments · AC-DC Controllers and Regulators · VSON-10-EP(3x3)

TPS2560DRCR from Texas Instruments, in a VSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground connection. Must be connected externally to the exposed thermal pad.
2 IN power_in Input supply voltage (2.5 V to 6.5 V). Connect a 0.1 µF or greater ceramic bypass capacitor from IN to GND as close to the IC as possible. Pins 2 and 3 are tied together internally as the shared input.
3 IN power_in Input supply voltage (2.5 V to 6.5 V). Connect a 0.1 µF or greater ceramic bypass capacitor from IN to GND as close to the IC as possible. Pins 2 and 3 are tied together internally as the shared input.
4 EN1 input Active-low enable input for channel 1 (TPS2560 variant); logic low turns on the channel-one power switch. VIL ≤ 0.66 V, VIH ≥ 1.1 V. On the TPS2561, this same pin is active-high (EN1).
5 EN2 input Active-low enable input for channel 2 (TPS2560 variant); logic low turns on the channel-two power switch. VIL ≤ 0.66 V, VIH ≥ 1.1 V. On the TPS2561, this same pin is active-high (EN2).
6 FAULT2 output Active-low open-drain fault output for channel 2, asserted during overcurrent or overtemperature conditions. Requires an external pull-up resistor; maximum continuous sink current 25 mA (10 mA recommended).
7 ILIM passive External resistor connection to GND that sets the current-limit threshold for both channels. Recommended 20 kΩ ≤ RILIM ≤ 187 kΩ, giving a per-channel limit from roughly 2.8 A down to about 250 mA.
8 OUT2 power_out Power-switch output for channel 2. Delivers up to 2.5 A continuous through a 44 mΩ (typ) high-side MOSFET; a bulk output capacitor (e.g. 150 µF) is typical for USB loads.
9 OUT1 power_out Power-switch output for channel 1. Delivers up to 2.5 A continuous through a 44 mΩ (typ) high-side MOSFET; a bulk output capacitor (e.g. 150 µF) is typical for USB loads.
10 FAULT1 output Active-low open-drain fault output for channel 1, asserted during overcurrent or overtemperature conditions. Requires an external pull-up resistor; maximum continuous sink current 25 mA (10 mA recommended).
PAD Thermal Pad power_in Exposed thermal pad on the package underside, internally connected to GND. Must be soldered to a board copper pour and tied externally to the GND pin for heat-sinking and correct electrical operation. RθJC(bot) = 4.9 °C/W.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VSON-10-EP(3x3)
Category PMIC
Pins 11

Ordering variants

Same part, different packaging or reel option.

  • TPS2560DRCR
  • TPS2560DRCRDRCT

CAD (KiCad official)

  • Symbol: TPS2560DRCR
  • Footprint: Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm
  • 3D model: VSON-10-EP(3x3) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (30 pp, sha256 3c66a28fc3932400, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

Symbol & Footprint

Schematic Symbol

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PCB Footprint

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