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SSP1922

Shanghai Siproin Microelectronics · Position Sensor · QFN-32-EP(5x5)

SSP1922 from Shanghai Siproin Microelectronics, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 XIN input High-speed oscillator driver input (2-8 MHz ceramic/crystal). Tie to GND if unused.
2 XOUT output High-speed oscillator driver output. Leave floating if unused.
3 VIO power_in I/O supply voltage, 2.5 V to 3.6 V. Must equal Vcc for correct operation.
4 GND power_in Ground reference. Connect to a solid ground plane.
5 FIRE_UP output Fire pulse generator output 1 (upstream). Drives ultrasonic transducer with up to 48 mA, Rdson ~4 Ω.
6 FIRE_DOWN output Fire pulse generator output 2 (downstream). Drives ultrasonic transducer with up to 48 mA, Rdson ~4 Ω.
7 FIRE_IN input 'Sing-around' signal input terminal for continuous ultrasonic measurement. Tie to GND if unused.
8 INTN output Interrupt flag output, LOW active. 4 mA drive. Cleared by rising edge of the first SCK.
9 SSN input SPI slave select input, LOW active. Required for 4-wire SPI operation.
10 SCK input SPI serial clock input. Up to 20 MHz at Vio = 3.3 V (15 MHz at Vio = 2.5 V).
11 SI input SPI serial data input (MOSI). MSB-first byte transfers.
12 SO output SPI serial data output (MISO). Drives low when SPI bus is free (non-tristate).
13 RSTN input Reset input, LOW active. After power-on reset wait ≥500 µs before starting the analog section.
14 VCC power_in Core supply voltage, 2.5 V to 3.6 V. Must equal Vio.
15 CLK32OUT output 32 kHz clock generator output. Leave n.c. if not used.
16 CLK32IN input 32 kHz clock generator input (crystal / external clock). Tie to GND if unused.
17 SENSET input Sense input for temperature measurement (Schmitt trigger). Tie to GND if unused.
18 LOADT output Load output for temperature measurement (24 mA drive). Leave n.c. if unused.
19 PT4 output Port 4 temperature measurement (RTD drive, >96 mA open drain).
20 PT3 output Port 3 temperature measurement (RTD drive, >96 mA open drain).
21 GND power_in Ground reference. Connect to a solid ground plane.
22 VIO power_in I/O supply voltage, 2.5 V to 3.6 V (second Vio pin, must equal Vcc).
23 PT2 output Port 2 temperature measurement (RTD drive, >96 mA open drain).
24 PT1 output Port 1 temperature measurement (RTD drive, >96 mA open drain).
25 EN_STOP2 input Enable pin for STOP input 2, HIGH active. Tie to Vio if unused / always enabled.
26 EN_STOP1 input Enable pin for STOP input 1, HIGH active. Tie to Vio if unused / always enabled.
27 STOP2 input TDC stop input 2 (analog frontend via ~200 Ω switch). Tie to GND if unused.
28 GND power_in Ground reference. Connect to a solid ground plane.
29 VCC power_in Core supply voltage (second Vcc pin), 2.5 V to 3.6 V.
30 STOP1 input TDC stop input 1 (analog frontend via ~200 Ω switch). Tie to GND if unused.
31 START input TDC start input. Tie to GND if unused.
32 EN_START input Enable pin for START input, HIGH active. Tie to Vio if unused / always enabled.

Key specifications

Parameter Value
Manufacturer Shanghai Siproin Microelectronics
Package QFN-32-EP(5x5)
Category Sensor
Pins 32

Ordering variants

Same part, different packaging or reel option.

  • SSP1922
  • SSP1922P

CAD (KiCad official)

  • Symbol: SSP1922
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
ssp1922.step 346 KB You want the bare part, or you mark your own boards.
ssp1922-etched.step 2.1 MB You want the part with SSP1922 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 529 faces against 206 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Siproin Microelectronics datasheet (47 pp, sha256 e322d1593761f7b8, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF