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Contents

README

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Si24R2

Nanjing Zhongke Microelectronics · RF Transceiver ICs · QFN-20-EP(4x4)

Si24R2 from Nanjing Zhongke Microelectronics, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CE input Chip enable signal. Activates TX (or RX in compatible parts) mode. Requires a high pulse ≥10µs to trigger a TX transaction; CE=0 returns the chip to Standby.
2 CSN input SPI chip-select (active-low). Falling edge starts an SPI transaction; must stay inactive high for ≥50ns (Tcwh) between transactions.
3 SCK input SPI clock input. Maximum SCK frequency 10 MHz; minimum high and low times 40ns each.
4 MOSI input SPI master-out, slave-in serial data input. Command word is clocked in MSB-first; payload data bytes are clocked in LSByte-first.
5 MISO output SPI master-in, slave-out serial data output. Outputs the STATUS register on the first byte of every transaction and enters high-Z (Tcdz=42ns) when CSN goes high.
6 IRQ output Maskable interrupt output, active-low. Asserts on TX_DS (transmit data sent) events unless masked via MASK_TX_DS in the CONFIG register.
7 VCC power_in Main supply voltage input, +1.9V to +3.6V DC. Requires local decoupling; pin shared with pins 15 and 18.
8 VSS power_in Ground (0V). Common with pins 14, 17, 20 and the exposed die pad.
9 XO output Crystal oscillator output. Connects to one terminal of the 16MHz ±60ppm crystal with 12-22pF load capacitors.
10 XI input Crystal oscillator input. Connects to the opposite terminal of the 16MHz ±60ppm crystal (CL=12pF, ESR≤100Ω).
11 VDD_PA power_out Internal LDO output supplying the on-chip power amplifier (nominally +1.8V). Requires an external decoupling capacitor; do not use for external loads.
12 RFP bidirectional Differential RF antenna port (positive). Together with RFN forms the 2.4GHz antenna interface driven by the integrated PA (up to +7dBm).
13 RFN bidirectional Differential RF antenna port (negative). Together with RFP forms the 2.4GHz antenna interface driven by the integrated PA.
14 VSS power_in Ground (0V). Common with pins 8, 17, 20 and the exposed die pad.
15 VCC power_in Main supply voltage input, +1.9V to +3.6V DC. Requires local decoupling; pin shared with pins 7 and 18.
16 IREF passive Reference current pin. Connect through an external 22kΩ ±1% resistor to ground to set the internal bias current.
17 VSS power_in Ground (0V). Common with pins 8, 14, 20 and the exposed die pad.
18 VCC power_in Main supply voltage input, +1.9V to +3.6V DC. Requires local decoupling; pin shared with pins 7 and 15.
19 VDD_D power_out Internal digital-core LDO output. Requires an external decoupling capacitor to ground (typ. 1nF/33nF); do not use to power external loads.
20 VSS power_in Ground (0V). Common with pins 8, 14, 17 and the exposed die pad.
21 EP power_in Exposed die pad on package underside. Ground (0V); must be soldered to a large PCB ground plane for both electrical and thermal/RF performance.

Key specifications

Parameter Value
Manufacturer Nanjing Zhongke Microelectronics
Package QFN-20-EP(4x4)
Category RF And Wireless
Pins 21

Ordering variants

Same part, different packaging or reel option.

  • Si24R2Sample
  • Si24R2P

CAD (KiCad official)

  • Symbol: Si24R2
  • Footprint: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
  • 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nanjing Zhongke Microelectronics datasheet (None pp, sha256 11bbe762a5a14290, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF