component
Si24R2
Public Unreviewedby Ray
Nanjing Zhongke Microelectronics RF Transceiver ICs, QFN-20-EP(4x4). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads on click. Unloads when scrolled away or the tab is hidden.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads on click. Unloads when scrolled away or the tab is hidden.
PCB Footprint
Open full view ↗Loads on click. Unloads when scrolled away or the tab is hidden.
Datasheet
Open in new tab ↗Loads on click. Unloads when scrolled away or the tab is hidden.
README
markdownSi24R2
Nanjing Zhongke Microelectronics · RF Transceiver ICs · QFN-20-EP(4x4)
Si24R2 from Nanjing Zhongke Microelectronics, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CE | input | Chip enable signal. Activates TX (or RX in compatible parts) mode. Requires a high pulse ≥10µs to trigger a TX transaction; CE=0 returns the chip to Standby. |
| 2 | CSN | input | SPI chip-select (active-low). Falling edge starts an SPI transaction; must stay inactive high for ≥50ns (Tcwh) between transactions. |
| 3 | SCK | input | SPI clock input. Maximum SCK frequency 10 MHz; minimum high and low times 40ns each. |
| 4 | MOSI | input | SPI master-out, slave-in serial data input. Command word is clocked in MSB-first; payload data bytes are clocked in LSByte-first. |
| 5 | MISO | output | SPI master-in, slave-out serial data output. Outputs the STATUS register on the first byte of every transaction and enters high-Z (Tcdz=42ns) when CSN goes high. |
| 6 | IRQ | output | Maskable interrupt output, active-low. Asserts on TX_DS (transmit data sent) events unless masked via MASK_TX_DS in the CONFIG register. |
| 7 | VCC | power_in | Main supply voltage input, +1.9V to +3.6V DC. Requires local decoupling; pin shared with pins 15 and 18. |
| 8 | VSS | power_in | Ground (0V). Common with pins 14, 17, 20 and the exposed die pad. |
| 9 | XO | output | Crystal oscillator output. Connects to one terminal of the 16MHz ±60ppm crystal with 12-22pF load capacitors. |
| 10 | XI | input | Crystal oscillator input. Connects to the opposite terminal of the 16MHz ±60ppm crystal (CL=12pF, ESR≤100Ω). |
| 11 | VDD_PA | power_out | Internal LDO output supplying the on-chip power amplifier (nominally +1.8V). Requires an external decoupling capacitor; do not use for external loads. |
| 12 | RFP | bidirectional | Differential RF antenna port (positive). Together with RFN forms the 2.4GHz antenna interface driven by the integrated PA (up to +7dBm). |
| 13 | RFN | bidirectional | Differential RF antenna port (negative). Together with RFP forms the 2.4GHz antenna interface driven by the integrated PA. |
| 14 | VSS | power_in | Ground (0V). Common with pins 8, 17, 20 and the exposed die pad. |
| 15 | VCC | power_in | Main supply voltage input, +1.9V to +3.6V DC. Requires local decoupling; pin shared with pins 7 and 18. |
| 16 | IREF | passive | Reference current pin. Connect through an external 22kΩ ±1% resistor to ground to set the internal bias current. |
| 17 | VSS | power_in | Ground (0V). Common with pins 8, 14, 20 and the exposed die pad. |
| 18 | VCC | power_in | Main supply voltage input, +1.9V to +3.6V DC. Requires local decoupling; pin shared with pins 7 and 15. |
| 19 | VDD_D | power_out | Internal digital-core LDO output. Requires an external decoupling capacitor to ground (typ. 1nF/33nF); do not use to power external loads. |
| 20 | VSS | power_in | Ground (0V). Common with pins 8, 14, 17 and the exposed die pad. |
| 21 | EP | power_in | Exposed die pad on package underside. Ground (0V); must be soldered to a large PCB ground plane for both electrical and thermal/RF performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nanjing Zhongke Microelectronics |
| Package | QFN-20-EP(4x4) |
| Category | RF And Wireless |
| Pins | 21 |
Ordering variants
Same part, different packaging or reel option.
Si24R2SampleSi24R2P
CAD (KiCad official)
- Symbol:
Si24R2 - Footprint:
Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm - 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nanjing Zhongke Microelectronics datasheet (None pp, sha256
11bbe762a5a14290, retrieved 2026-08-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).