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Contents

README

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SGM2054XTD10G

SGMICRO · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TDFN-10L(3x3)

SGM2054XTD10G from SGMICRO, in a TDFN-10L(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 REFIN input Reference Input Pin. Sets the target reference voltage (0.5V to 1.8V range). REFOUT tracks REFIN, and VO regulates to REFOUT.
2 VLDOIN power_in Regulator Supply Voltage Pin (1.1V to 3.5V). Provides the input power to the LDO output stage. Recommended to use a ceramic capacitor with minimum effective capacitance of 15µF from VLDOIN to ground.
3 VO power_out Regulator Output Pin. Sinks and sources current to hold the DDR termination rail at REFOUT. Recommended output capacitor effective capacitance is 20µF to 100µF.
4 PGND power_in Regulator Power Ground. Return path for the output stage current; should be tied to the PCB ground plane.
5 VOSNS input Voltage Sense Input Pin. Connect to the remote voltage sensing point of the load powered by VO for accurate regulation and to inform the power-good comparator.
6 REFOUT output Buffered Reference Output Pin (±10mA). Buffers REFIN and provides the reference used by the VO regulator loop. Recommended output capacitor effective capacitance is 0.1µF to 1µF.
7 EN input Enable Pin. Drive EN high (≥1V) to turn on the regulator; drive EN low (≤0.5V) to shut down. When EN is below 0.3V the internal discharge path pulls VO down.
8 GND power_in Signal Ground. Return for the analog/control circuitry.
9 PGOOD output Power-Good Indicator Output Pin. Open-drain output that is active high (via external pull-up) when the VO/VOSNS voltage is within the ±20% PGOOD window around REFOUT. Requires an external pull-up resistor (e.g. 100kΩ to VIN).
10 VIN power_in Input Voltage Supply Pin (2.375V to 3.5V). Powers the control circuitry. Recommended to use a ceramic capacitor with minimum effective capacitance of 1µF from VIN to ground.
EP GND power_in Exposed Pad. Connect to GND internally; must be connected to a large ground plane on the PCB to maximize thermal performance. Not an electrical connection point on the die.

Key specifications

Parameter Value
Manufacturer SGMICRO
Package TDFN-10L(3x3)
Category PMIC
Pins 11

Ordering variants

Same part, different packaging or reel option.

  • SGM2054XTD10G/TR

CAD (KiCad official)

  • Symbol: SGM2054XTD10G
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: TDFN-10L(3x3) (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SGMICRO datasheet (14 pp, sha256 a6699b6ea61e1847, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF