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Contents

README

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SCT2430STER

SCT · DC-DC Converters · ESOP-8

SCT2430STER from SCT, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT power_in Bootstrap supply for the high-side MOSFET gate driver. Connect a 0.1uF ceramic capacitor from BOOT to SW; the bootstrap cap charges through an internal regulator when the low-side MOSFET is on or SW is low. BOOT-SW absolute max is 6V.
2 VIN power_in Input supply, 3.8V to 40V operating range (absolute max 42V). Connect a local high-frequency bypass capacitor from VIN to GND with the shortest possible path.
3 EN input Enable input with internal ~1.5uA pull-up current source and precision 1.18V rising / 1.1V falling threshold. Pull below 1.1V to disable the converter; float or tie to VIN to enable. A resistor divider from VIN to GND on EN programs the input UVLO threshold. High-voltage tolerant (abs max 42V).
4 RT/CLK bidirectional Dual-function timing pin. In resistor mode, a resistor from RT/CLK to GND programs the switching frequency (100kHz-2.2MHz; RT[kΩ] = 100000/fsw[kHz]). Alternatively, drive with an external clock (100kHz-2.2MHz, VIH ≥ 2V, VIL ≤ 0.4V, pulse width > 80ns) to synchronize via the internal PLL. Must not be left floating or shorted to ground.
5 FB input Feedback input to the inverting terminal of the internal trans-conductance error amplifier. Connect to the tap of an external resistor divider from VOUT to GND; the device regulates FB to the internal 0.8V ±1% reference (VOUT range 0.8V-40V).
6 COMP output Error amplifier output and loop compensation node. Connect the frequency-loop compensation network (typ. series R+C to GND) here. Also senses PSM entry (low clamp ~0.4V, high clamp ~3V).
7 GND power_in Device ground reference and power return.
8 SW output Switching node - source of the high-side MOSFET and drain of the low-side MOSFET. Connect to the external power inductor. Absolute max -0.3V to 42V.
9 Thermal Pad power_in Exposed die-attach pad on the package bottom. Electrically connected internally to GND (pin 7) and provides the primary heat-dissipation path. Must be soldered to the PCB ground plane for correct operation and thermal performance (RθJA = 42 °C/W).

Key specifications

Parameter Value
Manufacturer SCT
Package ESOP-8
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • SCT2430STER

CAD (KiCad official)

  • Symbol: SCT2430STER
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SCT datasheet (23 pp, sha256 94ab70b839a113fe, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF