RTL8153B-VB-CG
Public Unreviewedby Ray
Realtek Semicon Ethernet Controllers, QFN-40-EP(5x5). Datasheet-verified pinout, KiCad symbol/footprint/3D.
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README
markdownRTL8153B-VB-CG
Realtek Semicon · Ethernet Controllers · QFN-40-EP(5x5)
RTL8153B-VB-CG from Realtek Semicon, in a QFN-40-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | MDIP0 | bidirectional | Ethernet MDI pair 0 positive. In MDI mode, BI_DA+ (first pair) in 1000Base-T; TX+ in 10/100Base-T. Route as controlled-Z differential to magnetics. |
| 2 | MDIN0 | bidirectional | Ethernet MDI pair 0 negative. BI_DA- in 1000Base-T; TX- in 10/100Base-T. In MDI-X crossover mode acts as BI_DB- (RX-). |
| 3 | AVDD10 | power_in | Analog 1.0V power supply (PHY analog rail). Decouple locally; supplied from internal or external 1.0V regulator. |
| 4 | MDIP1 | bidirectional | Ethernet MDI pair 1 positive. In MDI mode, BI_DB+ (second pair, RX+ in 10/100Base-T). In MDI-X acts as BI_DA+ (TX+). |
| 5 | MDIN1 | bidirectional | Ethernet MDI pair 1 negative. BI_DB- in MDI (RX- in 10/100Base-T); BI_DA- in MDI-X. |
| 6 | MDIP2 | bidirectional | Ethernet MDI pair 2 positive. BI_DC+ (third pair in 1000Base-T). Unused in 10/100Base-T. |
| 7 | MDIN2 | bidirectional | Ethernet MDI pair 2 negative. BI_DC- (BI_DD- in MDI-X crossover). |
| 8 | AVDD10 | power_in | Analog 1.0V power supply (PHY analog rail). Second AVDD10 pin - decouple locally. |
| 9 | MDIP3 | bidirectional | Ethernet MDI pair 3 positive. BI_DD+ (fourth pair in 1000Base-T). |
| 10 | MDIN3 | bidirectional | Ethernet MDI pair 3 negative. BI_DD- (BI_DC- in MDI-X crossover). |
| 11 | AVDD33 | power_in | Analog 3.3V power supply. Bulk + local decoupling; internal LDO on AVDD33 rail feeds analog blocks. |
| 12 | U3SSTXN | output | USB 3.0 SuperSpeed transmit differential pair, negative. AC-couple with 75-200nF caps to the USB connector; route as 90Ω differential. |
| 13 | U3SSTXP | output | USB 3.0 SuperSpeed transmit differential pair, positive. AC-coupled; 90Ω differential. |
| 14 | U3VDD10 | power_in | USB 3.0 (SuperSpeed) 1.0V power supply. Decouple locally to GND. |
| 15 | U3SSRXN | input | USB 3.0 SuperSpeed receive differential pair, negative. 90Ω differential from connector; host end AC-couples. |
| 16 | U3SSRXP | input | USB 3.0 SuperSpeed receive differential pair, positive. 90Ω differential. |
| 17 | U2DM | bidirectional | USB 2.0/1.1 D- data line. 90Ω differential with U2DP; series ESD/EMI protection recommended at the connector. |
| 18 | U2DP | bidirectional | USB 2.0/1.1 D+ data line. 90Ω differential with U2DM. |
| 19 | U2VDD10 | power_in | USB 2.0/1.1 1.0V power supply. Decouple locally. |
| 20 | AVDD33 | power_in | Analog 3.3V power supply / internal LDO 3.3V output node. Datasheet: 'embedded LDO is for RTL8153B-VB internal use only; do not power other devices.' |
| 21 | VDD5 | power_in | Analog 5.0V power supply. Sourced from USB VBUS (typ 5V). |
| 22 | DVDD10_UPS | power_out | Digital 1.0V uninterruptible power supply / LDO 1.0V output. Feeds always-on digital domain for wake logic. Do not use to power other devices. |
| 23 | DVDD33 | power_in | Digital 3.3V power supply. Bulk + local decoupling. |
| 24 | EEDO/LED2/SPISDO/LANWAKEB/GPIO | bidirectional | Shared multi-function pin: EEPROM data-in (EEDO, from EEPROM SDO), LED2 output, SPI flash SDO input, LANWAKEB power-management event (open-drain, active low), or general-purpose I/O. Mode chosen by autoload (eFUSE). |
| 25 | EEDI/SPISDI/ENSWREG | bidirectional | Shared pin: EEPROM data-out to EEPROM SDI (EEDI), SPI flash serial-data-input driver (SPISDI), and power-on latch ENSWREG (3.3V=enable switching regulator, 0V=LDO or external 1.0V). Latch sampled at power-on. |
| 26 | VDDREG33 | power_in | Digital 3.3V supply for the internal switching/LDO regulator. |
| 27 | VDDREG5 | power_in | Digital 5V supply for the internal switching/LDO regulator (from USB VBUS). |
| 28 | REGOUT | power_out | Switching/LDO regulator 1.0V output. Feeds internal 1.0V rails via external inductor/cap network. Internal-use only per datasheet. |
| 29 | GND | power_in | Switching/LDO regulator ground return. |
| 30 | EESK/LED1/SPISCK | output | Shared pin: EEPROM serial clock (93C46/56/66), LED1 output (default), or SPI flash serial clock. Mode chosen by autoload. |
| 31 | EECS | output | EEPROM chip select (93C46/56/66). Active only when EEPROM mode is selected by autoload. |
| 32 | LED0/SPICSB | output | Shared pin: LED0 output (default) or SPI flash chip select (active low). Mode chosen by autoload. |
| 33 | DVDD33 | power_in | Digital 3.3V power supply. Second DVDD33 pin - decouple locally. |
| 34 | DVDD10 | power_in | Digital 1.0V power supply (core). Fed from REGOUT or external 1.0V source. |
| 35 | CKXTAL1 | input | Clock reference input. Connect to 25MHz crystal (Y1) with load caps; connect to GND if an external clock source drives CKXTAL2 instead. |
| 36 | CKXTAL2 | bidirectional | Clock reference output when using a crystal, or external clock input (25MHz/48MHz oscillator). |
| 37 | AVDD10 | power_in | Analog 1.0V power supply. Third AVDD10 pin - decouple locally. |
| 38 | RSET | input | External bias resistor reference. Connect a precision resistor to GND to set the internal current bias for the PHY. |
| 39 | AVDD33 | power_in | Analog 3.3V power supply. Decouple locally. |
| 40 | AVDD33 | power_in | Analog 3.3V power supply. Decouple locally. |
| 41 | GND | power_in | Ground - exposed thermal pad on QFN underside. Must be soldered to a solid GND copper pour with thermal vias for both electrical return and heat sinking. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Realtek Semicon |
| Package | QFN-40-EP(5x5) |
| Category | Interface |
| Pins | 41 |
Ordering variants
Same part, different packaging or reel option.
RTL8153B-VB-CG
CAD (KiCad official)
- Symbol:
RTL8153B-VB-CG - Footprint:
Package_DFN_QFN:QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm - 3D model: QFN-40-EP(5x5) (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
rtl8153b-vb-cg.step |
435 KB | You want the bare part, or you mark your own boards. |
rtl8153b-vb-cg-etched.step |
3.1 MB | You want the part with RTL8153B-VB-CG already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 775 faces against 254 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Realtek Semicon datasheet (34 pp, sha256
c598af5b177c86c1, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).