Symbol & Footprint

Schematic Symbol

Open full view ↗

PCB Footprint

Open full view ↗
Contents

README

markdown

PAM2863ECR

Diodes Incorporated · LED Drivers · SOIC-8-EP

PAM2863ECR from Diodes Incorporated, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Input supply voltage, 4.5V to 40V (absolute max -0.3V to +40V). Decouple to ground with a 10µF or higher X7R ceramic capacitor placed close to the device.
2 ISENSE input High-side current-sense input. Connect resistor Rs from this pin to VIN to program the nominal average output current: IOUT(nom) = 0.1V / Rs (VSENSE typical 100mV). Input current typ. 8µA.
3 AGND power_in Analog ground (0V). Shown as AGND on the pin-assignment diagram; the pin-description table groups pins 3, 7, 8 together as GND. Tie to the ground plane.
4 VSET input Multi-function on/off and brightness control. Leave floating for normal operation. Drive <0.2V to disable output; DC voltage 0.3V-2.5V adjusts output current from 12% to 100% of IOUT(nom); PWM (open-collector/open-drain) at f<500Hz gives 1%-100% range. A capacitor from VSET to GND sets soft-start time (default ~0.1ms; ~1.5ms with 1nF). Abs max -0.3V to +6.0V.
5 LX output Drain of internal 40V NDMOS switch. Connect to the external Schottky diode / inductor node of the step-down power stage. Rated to 40V, RDS(on) typ. 0.3Ω @ 100mA, peak inductor current limit 2.5A. Pins 5 and 6 are internally tied and should both be soldered.
6 LX output Drain of internal 40V NDMOS switch (paralleled with pin 5 for current handling / thermal). Same electrical net as pin 5.
7 PGND power_in Power ground return for the internal NDMOS switch (0V). Pin-assignment diagram labels PGND; pin-description table groups pins 3,7,8 as GND. Tie to ground plane; keep return path to the input capacitor short.
8 PGND power_in Power ground return for the internal NDMOS switch (0V), paralleled with pin 7.
EP EP passive Exposed thermal pad on package underside (SO-8EP). Solder to ground copper for heat dissipation; electrically tied to GND.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOIC-8-EP
Category LED-drv
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • PAM2863ECR

CAD (KiCad official)

  • Symbol: PAM2863ECR
  • Footprint: Package_SO:Diodes_SO-8EP
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
pam2863ecr.step 194 KB You want the bare part, or you mark your own boards.
pam2863ecr-etched.step 2.0 MB You want the part with PAM2863ECR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 499 faces against 63 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (11 pp, sha256 f591051d0579f29b, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF